JP5733898B2 - 静電容量型電気機械変換装置 - Google Patents

静電容量型電気機械変換装置 Download PDF

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Publication number
JP5733898B2
JP5733898B2 JP2010029598A JP2010029598A JP5733898B2 JP 5733898 B2 JP5733898 B2 JP 5733898B2 JP 2010029598 A JP2010029598 A JP 2010029598A JP 2010029598 A JP2010029598 A JP 2010029598A JP 5733898 B2 JP5733898 B2 JP 5733898B2
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Japan
Prior art keywords
electrode
vibrating membrane
vibration film
electromechanical transducer
gap
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Expired - Fee Related
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JP2010029598A
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English (en)
Japanese (ja)
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JP2011167021A (ja
JP2011167021A5 (enExample
Inventor
一成 藤井
一成 藤井
貴弘 秋山
貴弘 秋山
水谷　英正
英正 水谷
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Canon Inc
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Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2010029598A priority Critical patent/JP5733898B2/ja
Priority to US13/025,869 priority patent/US20110198966A1/en
Publication of JP2011167021A publication Critical patent/JP2011167021A/ja
Publication of JP2011167021A5 publication Critical patent/JP2011167021A5/ja
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Publication of JP5733898B2 publication Critical patent/JP5733898B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
JP2010029598A 2010-02-14 2010-02-14 静電容量型電気機械変換装置 Expired - Fee Related JP5733898B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010029598A JP5733898B2 (ja) 2010-02-14 2010-02-14 静電容量型電気機械変換装置
US13/025,869 US20110198966A1 (en) 2010-02-14 2011-02-11 Capacitive electromechanical transducer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010029598A JP5733898B2 (ja) 2010-02-14 2010-02-14 静電容量型電気機械変換装置

Publications (3)

Publication Number Publication Date
JP2011167021A JP2011167021A (ja) 2011-08-25
JP2011167021A5 JP2011167021A5 (enExample) 2013-03-28
JP5733898B2 true JP5733898B2 (ja) 2015-06-10

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Family Applications (1)

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JP2010029598A Expired - Fee Related JP5733898B2 (ja) 2010-02-14 2010-02-14 静電容量型電気機械変換装置

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US (1) US20110198966A1 (enExample)
JP (1) JP5733898B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6185988B2 (ja) * 2012-05-31 2017-08-23 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． ウェハ及びその製造方法
WO2015043989A1 (en) 2013-09-24 2015-04-02 Koninklijke Philips N.V. Cmut device manufacturing method, cmut device and apparatus
KR102184453B1 (ko) * 2014-07-21 2020-11-30 삼성전자주식회사 초음파 변환기 및 초음파 변환기의 제조 방법
EP3533386A1 (en) 2018-02-28 2019-09-04 Koninklijke Philips N.V. Pressure sensing with capacitive pressure sensor
US11545612B2 (en) * 2019-05-03 2023-01-03 May Sun Technology Co., Ltd. Pseudo-piezoelectric D33 device and electronic device using the same
JP7581795B2 (ja) 2020-11-25 2024-11-13 セイコーエプソン株式会社 圧電アクチュエーター、超音波素子、超音波探触子、超音波装置、及び電子デバイス
TWI789229B (zh) * 2022-01-28 2023-01-01 友達光電股份有限公司 換能器及其製造方法
CN117000570B (zh) * 2022-08-06 2025-08-29 洪波 一种先进电容纳机电超声换能器芯片单元

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19922967C2 (de) * 1999-05-19 2001-05-03 Siemens Ag Mikromechanischer kapazitiver Ultraschallwandler und Verfahren zu dessen Herstellung
US6499348B1 (en) * 1999-12-03 2002-12-31 Scimed Life Systems, Inc. Dynamically configurable ultrasound transducer with integral bias regulation and command and control circuitry
US6831394B2 (en) * 2002-12-11 2004-12-14 General Electric Company Backing material for micromachined ultrasonic transducer devices
WO2006027873A1 (ja) * 2004-09-10 2006-03-16 Murata Manufacturing Co., Ltd. 圧電薄膜共振子
US7888709B2 (en) * 2004-09-15 2011-02-15 Sonetics Ultrasound, Inc. Capacitive micromachined ultrasonic transducer and manufacturing method
US7037746B1 (en) * 2004-12-27 2006-05-02 General Electric Company Capacitive micromachined ultrasound transducer fabricated with epitaxial silicon membrane
US7615834B2 (en) * 2006-02-28 2009-11-10 The Board Of Trustees Of The Leland Stanford Junior University Capacitive micromachined ultrasonic transducer(CMUT) with varying thickness membrane
JP4699259B2 (ja) * 2006-03-31 2011-06-08 株式会社日立製作所 超音波トランスデューサ
US7745973B2 (en) * 2006-05-03 2010-06-29 The Board Of Trustees Of The Leland Stanford Junior University Acoustic crosstalk reduction for capacitive micromachined ultrasonic transducers in immersion
JP4842010B2 (ja) * 2006-05-09 2011-12-21 株式会社日立メディコ 超音波探触子及び超音波診断装置
JP5026770B2 (ja) * 2006-11-14 2012-09-19 株式会社日立メディコ 超音波探触子及び超音波診断装置

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Publication number Publication date
JP2011167021A (ja) 2011-08-25
US20110198966A1 (en) 2011-08-18

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