JP5730500B2 - コネクタ - Google Patents
コネクタ Download PDFInfo
- Publication number
- JP5730500B2 JP5730500B2 JP2010111400A JP2010111400A JP5730500B2 JP 5730500 B2 JP5730500 B2 JP 5730500B2 JP 2010111400 A JP2010111400 A JP 2010111400A JP 2010111400 A JP2010111400 A JP 2010111400A JP 5730500 B2 JP5730500 B2 JP 5730500B2
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- bismuth
- tin
- layer
- whisker
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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- 239000010410 layer Substances 0.000 claims description 285
- 238000007747 plating Methods 0.000 claims description 261
- 229910052709 silver Inorganic materials 0.000 claims description 139
- 239000004332 silver Substances 0.000 claims description 139
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 claims description 108
- 238000005204 segregation Methods 0.000 claims description 49
- 229910052797 bismuth Inorganic materials 0.000 claims description 48
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 48
- 239000000463 material Substances 0.000 claims description 31
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 17
- 239000002344 surface layer Substances 0.000 claims description 17
- 229910001152 Bi alloy Inorganic materials 0.000 claims description 16
- 230000001629 suppression Effects 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 138
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 48
- 229910052759 nickel Inorganic materials 0.000 description 23
- 238000000576 coating method Methods 0.000 description 18
- 239000011248 coating agent Substances 0.000 description 17
- 238000002474 experimental method Methods 0.000 description 17
- 238000000635 electron micrograph Methods 0.000 description 13
- 230000035882 stress Effects 0.000 description 9
- 239000010949 copper Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910000881 Cu alloy Inorganic materials 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 230000006355 external stress Effects 0.000 description 6
- 230000006870 function Effects 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 6
- 230000033228 biological regulation Effects 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 230000007613 environmental effect Effects 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 4
- FHKPLLOSJHHKNU-INIZCTEOSA-N [(3S)-3-[8-(1-ethyl-5-methylpyrazol-4-yl)-9-methylpurin-6-yl]oxypyrrolidin-1-yl]-(oxan-4-yl)methanone Chemical compound C(C)N1N=CC(=C1C)C=1N(C2=NC=NC(=C2N=1)O[C@@H]1CN(CC1)C(=O)C1CCOCC1)C FHKPLLOSJHHKNU-INIZCTEOSA-N 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 2
- 206010027146 Melanoderma Diseases 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 231100000681 Certain safety factor Toxicity 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- -1 SnBi Substances 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Description
52 基材
53 被膜
54 ニッケル下地めっき層
55 銀めっき層
56 錫ビスマスめっき層
801 めっき被膜
802 錫酸化膜
803 結晶粒子
804 ウィスカ
Claims (5)
- (a)ケーブル又は基板と電気的に接続されるコネクタであって、
(b)ハウジングと、
(c)該ハウジングに装填された端子とを有し、
(d)該端子は、金属から成る基材と、該基材上に形成されたビスマスの偏析を抑制する偏析抑制層と、該偏析抑制層上に形成された錫ビスマス合金から成る表面層とを備え、
(e)前記偏析抑制層の厚さは、前記表面層の厚さの5〔%〕以上であり、かつ、0.17〔μm〕以下であることを特徴とするコネクタ。 - 前記端子は前記ケーブルの導電部材又は基板の導電部材と接触して電気的に導通する請求項1に記載のコネクタ。
- 前記偏析抑制層は銀をめっきすることによって形成される請求項1又は2に記載のコネクタ。
- 前記表面層の錫ビスマス合金は、錫に対するビスマスの添加量が1.0〜4.0〔wt%〕である請求項1〜3のいずれか1項に記載のコネクタ。
- 前記偏析抑制層の厚さは0.1〜0.17〔μm〕である請求項1〜4のいずれか1項に記載のコネクタ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010111400A JP5730500B2 (ja) | 2009-05-18 | 2010-05-13 | コネクタ |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009119385 | 2009-05-18 | ||
JP2009119385 | 2009-05-18 | ||
JP2010111400A JP5730500B2 (ja) | 2009-05-18 | 2010-05-13 | コネクタ |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015079236A Division JP5964478B2 (ja) | 2009-05-18 | 2015-04-08 | コネクタ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011001630A JP2011001630A (ja) | 2011-01-06 |
JP5730500B2 true JP5730500B2 (ja) | 2015-06-10 |
Family
ID=43559816
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010111400A Active JP5730500B2 (ja) | 2009-05-18 | 2010-05-13 | コネクタ |
JP2015079236A Active JP5964478B2 (ja) | 2009-05-18 | 2015-04-08 | コネクタ |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015079236A Active JP5964478B2 (ja) | 2009-05-18 | 2015-04-08 | コネクタ |
Country Status (1)
Country | Link |
---|---|
JP (2) | JP5730500B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6618241B2 (ja) | 2014-06-11 | 2019-12-11 | 上村工業株式会社 | 錫電気めっき浴および錫めっき皮膜 |
CN113042931A (zh) * | 2019-12-26 | 2021-06-29 | 有研工程技术研究院有限公司 | 一种抑制无铅Sn-Bi焊料中Bi相偏析的理论设计方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11350188A (ja) * | 1998-06-03 | 1999-12-21 | Furukawa Electric Co Ltd:The | 電気・電子部品用材料とその製造方法、およびその材料を用いた電気・電子部品 |
JP3513709B2 (ja) * | 2001-10-16 | 2004-03-31 | 石原薬品株式会社 | 前処理によるスズホイスカーの防止方法 |
JP4894304B2 (ja) * | 2005-03-28 | 2012-03-14 | ソニー株式会社 | 無鉛Snベースめっき膜及び接続部品の接点構造 |
-
2010
- 2010-05-13 JP JP2010111400A patent/JP5730500B2/ja active Active
-
2015
- 2015-04-08 JP JP2015079236A patent/JP5964478B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP5964478B2 (ja) | 2016-08-03 |
JP2015164134A (ja) | 2015-09-10 |
JP2011001630A (ja) | 2011-01-06 |
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