JP5725278B2 - 光源装置 - Google Patents
光源装置 Download PDFInfo
- Publication number
- JP5725278B2 JP5725278B2 JP2010236695A JP2010236695A JP5725278B2 JP 5725278 B2 JP5725278 B2 JP 5725278B2 JP 2010236695 A JP2010236695 A JP 2010236695A JP 2010236695 A JP2010236695 A JP 2010236695A JP 5725278 B2 JP5725278 B2 JP 5725278B2
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- cooling water
- light source
- pipe
- source device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000001816 cooling Methods 0.000 claims description 152
- 239000000498 cooling water Substances 0.000 claims description 145
- 239000000758 substrate Substances 0.000 claims description 23
- 239000007787 solid Substances 0.000 claims description 4
- 238000005304 joining Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 42
- 238000010586 diagram Methods 0.000 description 14
- 229910052782 aluminium Inorganic materials 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 238000005520 cutting process Methods 0.000 description 8
- 238000007743 anodising Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 239000007810 chemical reaction solvent Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000003779 heat-resistant material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000012811 non-conductive material Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229920002449 FKM Polymers 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Description
11 LED(発光ダイオード)
12 実装基板
13 光源モジュール
14 冷却部材
15,151〜156 実装面部
161〜166 冷却流水路
181,182 ガスケット
191,192 連結部材
20 容器
61 入水パイプ
62,63 接続口
64 出水パイプ
65〜68,71〜76 連結溝
69,70,77〜79 連結管
Claims (3)
- 複数個の固体発光素子が、それぞれ実装基板に搭載された少なくとも1つの光源モジュールと、
前記光源モジュールを取着するとともに、該光源モジュールを冷却させるための冷却部材と、
前記固体発光素子の非装着面側の前記実装基板と対向する前記冷却部材に配置させ、内部に該冷却部材を冷却させるための冷却水が流れる少なくとも2本の筒状冷却流水路と、
前記冷却部材の一端に取着させ、一方の前記冷却流水路から他方の前記冷却流水路に折り返して前記冷却水を流す連結管を穿った第1連結部材と、
前記冷却部材の他端に取着させ、他方の前記冷却流水路から一方の前記冷却流水路に折り返して前記冷却水を流す連結管を穿つとともに、前記冷却水の入水および出水パイプを取着した第2連結部材と、
前記第1および前記第2連結部材と前記冷却部材との間にそれぞれ配置したガスケットと、を具備したことを特徴とする光源装置。 - 冷却水が流れる前記筒状の流水路は内径断面が扁平形状とし、前記実装基板と前記内径断面の内径の長辺側で対向することを特徴とする請求項1記載の光源装置。
- 前記筒状冷却流水路と接合させ、一方の前記冷却流水路から他方の冷却流水路に折り返して前記冷却水を流すための前記連結管は、前記筒状冷却流水路の楕円形状より断面を漸次円形状とし、該円形状から漸次前記筒状冷却流水路の楕円形状とした連結管とを具備したことを特徴とする請求項1または2記載の光源装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010236695A JP5725278B2 (ja) | 2010-10-21 | 2010-10-21 | 光源装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010236695A JP5725278B2 (ja) | 2010-10-21 | 2010-10-21 | 光源装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012089755A JP2012089755A (ja) | 2012-05-10 |
JP5725278B2 true JP5725278B2 (ja) | 2015-05-27 |
Family
ID=46261029
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010236695A Active JP5725278B2 (ja) | 2010-10-21 | 2010-10-21 | 光源装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5725278B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106594623A (zh) * | 2016-12-16 | 2017-04-26 | 珠海华而美照明有限公司 | 一种水冷式灯体 |
CN106594612A (zh) * | 2016-12-16 | 2017-04-26 | 珠海华而美照明有限公司 | 渐进式集鱼灯 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2923754B1 (en) * | 2014-03-26 | 2019-08-14 | Corning Incorporated | Modular photochemical flow reactor system |
EP3205395B1 (en) * | 2014-10-09 | 2019-11-06 | Toray Industries, Inc. | Photoirradiation device, photoreaction method using same, and method for producing lactam |
JP6419083B2 (ja) * | 2014-10-09 | 2018-11-07 | 東レ株式会社 | 光化学反応装置及びそれを用いた光化学反応方法とその方法を用いたラクタムの製造方法 |
JP2022543774A (ja) * | 2019-08-06 | 2022-10-14 | スナップドラゴン ケミストリー,インコーポレイテッド | 連続流光反応器 |
CN113270527B (zh) * | 2021-05-17 | 2022-06-03 | 深圳极光王科技股份有限公司 | 一种Mini-LED封装冷却装置及方法 |
WO2023165849A1 (en) * | 2022-03-01 | 2023-09-07 | Signify Holding B.V. | Integrated photochemical flow reactor with led light source |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000299585A (ja) * | 1999-02-12 | 2000-10-24 | Toyota Motor Corp | 冷却装置 |
JP2001147093A (ja) * | 1999-11-19 | 2001-05-29 | Toshiba Corp | 熱交換器 |
JP2004003725A (ja) * | 2002-05-31 | 2004-01-08 | Toshiba Corp | コールドプレート、コールドプレートの製造方法、及び放送用送信装置とそのシャーシ装置 |
JP4488873B2 (ja) * | 2004-03-02 | 2010-06-23 | シーシーエス株式会社 | 光照射装置 |
JP4751098B2 (ja) * | 2005-04-28 | 2011-08-17 | シチズン電子株式会社 | 発光ユニット |
JP2008307552A (ja) * | 2007-06-12 | 2008-12-25 | Nippon Light Metal Co Ltd | 熱交換器の製造方法および熱交換器 |
JP2009064986A (ja) * | 2007-09-06 | 2009-03-26 | Panasonic Electric Works Co Ltd | 光源装置 |
-
2010
- 2010-10-21 JP JP2010236695A patent/JP5725278B2/ja active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106594623A (zh) * | 2016-12-16 | 2017-04-26 | 珠海华而美照明有限公司 | 一种水冷式灯体 |
CN106594612A (zh) * | 2016-12-16 | 2017-04-26 | 珠海华而美照明有限公司 | 渐进式集鱼灯 |
Also Published As
Publication number | Publication date |
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JP2012089755A (ja) | 2012-05-10 |
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