JP5725240B2 - 電子部品及び実装構造体 - Google Patents
電子部品及び実装構造体 Download PDFInfo
- Publication number
- JP5725240B2 JP5725240B2 JP2014114052A JP2014114052A JP5725240B2 JP 5725240 B2 JP5725240 B2 JP 5725240B2 JP 2014114052 A JP2014114052 A JP 2014114052A JP 2014114052 A JP2014114052 A JP 2014114052A JP 5725240 B2 JP5725240 B2 JP 5725240B2
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- JP
- Japan
- Prior art keywords
- electrode
- external electrode
- land
- external
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003990 capacitor Substances 0.000 claims description 44
- 239000004020 conductor Substances 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 23
- 238000010030 laminating Methods 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 description 35
- 229910000679 solder Inorganic materials 0.000 description 17
- 238000000034 method Methods 0.000 description 9
- 238000010187 selection method Methods 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000003985 ceramic capacitor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000010304 firing Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- -1 rare earth compound Chemical class 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Images
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014114052A JP5725240B2 (ja) | 2014-06-02 | 2014-06-02 | 電子部品及び実装構造体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014114052A JP5725240B2 (ja) | 2014-06-02 | 2014-06-02 | 電子部品及び実装構造体 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011190736A Division JP5589994B2 (ja) | 2011-09-01 | 2011-09-01 | 選択方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014187381A JP2014187381A (ja) | 2014-10-02 |
| JP2014187381A5 JP2014187381A5 (enrdf_load_stackoverflow) | 2015-04-02 |
| JP5725240B2 true JP5725240B2 (ja) | 2015-05-27 |
Family
ID=51834561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014114052A Active JP5725240B2 (ja) | 2014-06-02 | 2014-06-02 | 電子部品及び実装構造体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5725240B2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6958429B2 (ja) * | 2018-02-28 | 2021-11-02 | Tdk株式会社 | 積層コンデンサ |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11251178A (ja) * | 1998-03-04 | 1999-09-17 | Taiyo Yuden Co Ltd | ４端子型積層コンデンサ |
| JP4187184B2 (ja) * | 2002-02-28 | 2008-11-26 | Ｔｄｋ株式会社 | 電子部品 |
| JP2004146493A (ja) * | 2002-10-23 | 2004-05-20 | Nikon Corp | 基板 |
| US7697262B2 (en) * | 2005-10-31 | 2010-04-13 | Avx Corporation | Multilayer ceramic capacitor with internal current cancellation and bottom terminals |
| KR100925603B1 (ko) * | 2007-09-28 | 2009-11-06 | 삼성전기주식회사 | 적층형 캐패시터 |
| KR100910527B1 (ko) * | 2007-09-28 | 2009-07-31 | 삼성전기주식회사 | 적층형 칩 커패시터 및 적층형 칩 커패시터의 용량조절방법 |
| JP5343997B2 (ja) * | 2011-04-22 | 2013-11-13 | Ｔｄｋ株式会社 | 積層コンデンサの実装構造 |
-
2014
- 2014-06-02 JP JP2014114052A patent/JP5725240B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014187381A (ja) | 2014-10-02 |
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