JP5716702B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

Info

Publication number
JP5716702B2
JP5716702B2 JP2012096944A JP2012096944A JP5716702B2 JP 5716702 B2 JP5716702 B2 JP 5716702B2 JP 2012096944 A JP2012096944 A JP 2012096944A JP 2012096944 A JP2012096944 A JP 2012096944A JP 5716702 B2 JP5716702 B2 JP 5716702B2
Authority
JP
Japan
Prior art keywords
terminal
electrode
fwd
semiconductor switching
switching element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012096944A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013225590A5 (https=
JP2013225590A (ja
Inventor
武志 王丸
武志 王丸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2012096944A priority Critical patent/JP5716702B2/ja
Publication of JP2013225590A publication Critical patent/JP2013225590A/ja
Publication of JP2013225590A5 publication Critical patent/JP2013225590A5/ja
Application granted granted Critical
Publication of JP5716702B2 publication Critical patent/JP5716702B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Power Conversion In General (AREA)
  • Inverter Devices (AREA)
JP2012096944A 2012-04-20 2012-04-20 半導体装置 Active JP5716702B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012096944A JP5716702B2 (ja) 2012-04-20 2012-04-20 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012096944A JP5716702B2 (ja) 2012-04-20 2012-04-20 半導体装置

Publications (3)

Publication Number Publication Date
JP2013225590A JP2013225590A (ja) 2013-10-31
JP2013225590A5 JP2013225590A5 (https=) 2014-11-20
JP5716702B2 true JP5716702B2 (ja) 2015-05-13

Family

ID=49595461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012096944A Active JP5716702B2 (ja) 2012-04-20 2012-04-20 半導体装置

Country Status (1)

Country Link
JP (1) JP5716702B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6690252B2 (ja) * 2016-01-22 2020-04-28 富士電機株式会社 半導体装置
JP2018007501A (ja) * 2016-07-07 2018-01-11 トヨタ自動車株式会社 半導体装置
JP6804421B2 (ja) * 2017-10-06 2020-12-23 三菱電機株式会社 半導体装置
JP7703943B2 (ja) * 2021-08-10 2025-07-08 株式会社Ihi 電力変換装置
WO2024202813A1 (ja) * 2023-03-29 2024-10-03 住友精密工業株式会社 振動型ジャイロ素子およびジャイロスコープ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002064180A (ja) * 2000-08-22 2002-02-28 Mitsubishi Electric Corp 半導体モジュール
JP4830877B2 (ja) * 2007-01-31 2011-12-07 トヨタ自動車株式会社 半導体装置の製造方法
JP2012050176A (ja) * 2010-08-24 2012-03-08 Fuji Electric Co Ltd 電力変換装置のパワーモジュール

Also Published As

Publication number Publication date
JP2013225590A (ja) 2013-10-31

Similar Documents

Publication Publication Date Title
US10903158B2 (en) Semiconductor arrangement having a circuit board with a patterned metallization layer
JP6400201B2 (ja) パワー半導体モジュール
US9659912B2 (en) Low-inductance circuit arrangement comprising load current collecting conductor track
US8045352B2 (en) Power converter
WO2021014692A1 (ja) パワー半導体モジュール
US20170170157A1 (en) Power Transistor Module
JP6603676B2 (ja) ハーフブリッジパワー半導体モジュール及びその製造方法
JP5716702B2 (ja) 半導体装置
US20130242631A1 (en) Power converter apparatus
JP2019149882A (ja) ３レベルｉタイプインバータおよび半導体モジュール
CN113707625B (zh) 电力用半导体模块
US10186986B2 (en) Semiconductor arrangement with controllable semiconductor elements
CN114079446A (zh) 开关装置及用于制造开关装置的方法
JP6723469B2 (ja) ２ｉｎ１型チョッパモジュール
JP4697025B2 (ja) 電力用半導体モジュール
JP7044049B2 (ja) 半導体装置
US20240006330A1 (en) High-symmetrical semiconductor arrangement
JP2023140056A (ja) パワー半導体スイッチングモジュール

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140610

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20141002

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20141125

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20141202

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150126

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150217

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150302

R150 Certificate of patent or registration of utility model

Ref document number: 5716702

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250