JP5711930B2 - 基板処理装置及び半導体装置の製造方法 - Google Patents

基板処理装置及び半導体装置の製造方法 Download PDF

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Publication number
JP5711930B2
JP5711930B2 JP2010227766A JP2010227766A JP5711930B2 JP 5711930 B2 JP5711930 B2 JP 5711930B2 JP 2010227766 A JP2010227766 A JP 2010227766A JP 2010227766 A JP2010227766 A JP 2010227766A JP 5711930 B2 JP5711930 B2 JP 5711930B2
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motor
torque
boat
lid
tube
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JP2010227766A
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Japanese (ja)
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JP2011166112A5 (https=
JP2011166112A (ja
Inventor
油谷　幸則
幸則 油谷
島田　真一
真一 島田
守田　修
修 守田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Denki Electric Inc
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Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
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Application filed by Hitachi Kokusai Electric Inc, Kokusai Denki Electric Inc filed Critical Hitachi Kokusai Electric Inc
Priority to JP2010227766A priority Critical patent/JP5711930B2/ja
Priority to KR1020100129772A priority patent/KR101219587B1/ko
Priority to TW100100797A priority patent/TWI447839B/zh
Priority to US13/004,495 priority patent/US8876453B2/en
Publication of JP2011166112A publication Critical patent/JP2011166112A/ja
Publication of JP2011166112A5 publication Critical patent/JP2011166112A5/ja
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JP2010227766A 2010-01-12 2010-10-07 基板処理装置及び半導体装置の製造方法 Active JP5711930B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010227766A JP5711930B2 (ja) 2010-01-12 2010-10-07 基板処理装置及び半導体装置の製造方法
KR1020100129772A KR101219587B1 (ko) 2010-01-12 2010-12-17 기판 처리 장치 및 반도체 장치의 제조 방법
TW100100797A TWI447839B (zh) 2010-01-12 2011-01-10 基板處理裝置及半導體裝置之製造方法
US13/004,495 US8876453B2 (en) 2010-01-12 2011-01-11 Substrate processing apparatus and method of manufacturing semiconductor device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010003884 2010-01-12
JP2010003884 2010-01-12
JP2010227766A JP5711930B2 (ja) 2010-01-12 2010-10-07 基板処理装置及び半導体装置の製造方法

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JP2011166112A JP2011166112A (ja) 2011-08-25
JP2011166112A5 JP2011166112A5 (https=) 2013-11-14
JP5711930B2 true JP5711930B2 (ja) 2015-05-07

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JP2010227766A Active JP5711930B2 (ja) 2010-01-12 2010-10-07 基板処理装置及び半導体装置の製造方法

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6208588B2 (ja) * 2014-01-28 2017-10-04 東京エレクトロン株式会社 支持機構及び基板処理装置
WO2016052023A1 (ja) 2014-09-30 2016-04-07 株式会社日立国際電気 半導体製造装置、半導体装置の製造方法および記録媒体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3065438B2 (ja) * 1992-07-22 2000-07-17 キヤノン株式会社 位置決め制御装置
JPH07230320A (ja) * 1994-02-18 1995-08-29 Canon Inc サーボ制御装置
JP2004104011A (ja) * 2002-09-12 2004-04-02 Hitachi Kokusai Electric Inc 基板処理装置
JP2005056905A (ja) * 2003-08-05 2005-03-03 Hitachi Kokusai Electric Inc 基板処理装置
JP2008277354A (ja) * 2007-04-25 2008-11-13 Tekkusu Iijii:Kk 把持装置
JP5221118B2 (ja) * 2007-12-14 2013-06-26 東京エレクトロン株式会社 検査装置
JP5635270B2 (ja) * 2009-02-13 2014-12-03 株式会社日立国際電気 基板処理装置及び基板処理システム及び基板処理装置の表示方法及び基板処理装置のパラメータ設定方法及び記録媒体

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