JP5707254B2 - 熱硬化性樹脂多孔シートの製造方法 - Google Patents
熱硬化性樹脂多孔シートの製造方法 Download PDFInfo
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- JP5707254B2 JP5707254B2 JP2011146470A JP2011146470A JP5707254B2 JP 5707254 B2 JP5707254 B2 JP 5707254B2 JP 2011146470 A JP2011146470 A JP 2011146470A JP 2011146470 A JP2011146470 A JP 2011146470A JP 5707254 B2 JP5707254 B2 JP 5707254B2
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- 229930003836 cresol Natural products 0.000 description 1
- XWALRFDLDRDCJG-UHFFFAOYSA-N cyclobutane-1,1,2,2-tetracarbonyl chloride Chemical compound ClC(=O)C1(C(Cl)=O)CCC1(C(Cl)=O)C(Cl)=O XWALRFDLDRDCJG-UHFFFAOYSA-N 0.000 description 1
- LXLCHRQXLFIZNP-UHFFFAOYSA-N cyclobutane-1,1-dicarbonyl chloride Chemical compound ClC(=O)C1(C(Cl)=O)CCC1 LXLCHRQXLFIZNP-UHFFFAOYSA-N 0.000 description 1
- PBWUKDMYLKXAIP-UHFFFAOYSA-N cyclohexane-1,1,2-tricarbonyl chloride Chemical compound ClC(=O)C1CCCCC1(C(Cl)=O)C(Cl)=O PBWUKDMYLKXAIP-UHFFFAOYSA-N 0.000 description 1
- MLCGVCXKDYTMRG-UHFFFAOYSA-N cyclohexane-1,1-dicarbonyl chloride Chemical compound ClC(=O)C1(C(Cl)=O)CCCCC1 MLCGVCXKDYTMRG-UHFFFAOYSA-N 0.000 description 1
- SSJXIUAHEKJCMH-UHFFFAOYSA-N cyclohexane-1,2-diamine Chemical compound NC1CCCCC1N SSJXIUAHEKJCMH-UHFFFAOYSA-N 0.000 description 1
- GEQHKFFSPGPGLN-UHFFFAOYSA-N cyclohexane-1,3-diamine Chemical compound NC1CCCC(N)C1 GEQHKFFSPGPGLN-UHFFFAOYSA-N 0.000 description 1
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 1
- DCXMNNZFVFSGJX-UHFFFAOYSA-N cyclopentane-1,1,2,2-tetracarbonyl chloride Chemical compound ClC(=O)C1(C(Cl)=O)CCCC1(C(Cl)=O)C(Cl)=O DCXMNNZFVFSGJX-UHFFFAOYSA-N 0.000 description 1
- JREFGECMMPJUHM-UHFFFAOYSA-N cyclopentane-1,1,2-tricarbonyl chloride Chemical compound ClC(=O)C1CCCC1(C(Cl)=O)C(Cl)=O JREFGECMMPJUHM-UHFFFAOYSA-N 0.000 description 1
- YYLFLXVROAGUFH-UHFFFAOYSA-N cyclopentane-1,1-dicarbonyl chloride Chemical compound ClC(=O)C1(C(Cl)=O)CCCC1 YYLFLXVROAGUFH-UHFFFAOYSA-N 0.000 description 1
- CRMQURWQJQPUMY-UHFFFAOYSA-N cyclopropane-1,1,2-tricarbonyl chloride Chemical compound ClC(=O)C1CC1(C(Cl)=O)C(Cl)=O CRMQURWQJQPUMY-UHFFFAOYSA-N 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 235000012041 food component Nutrition 0.000 description 1
- 239000005417 food ingredient Substances 0.000 description 1
- 238000009292 forward osmosis Methods 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000012510 hollow fiber Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000012433 hydrogen halide Substances 0.000 description 1
- 229910000039 hydrogen halide Inorganic materials 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- OCIDXARMXNJACB-UHFFFAOYSA-N n'-phenylethane-1,2-diamine Chemical compound NCCNC1=CC=CC=C1 OCIDXARMXNJACB-UHFFFAOYSA-N 0.000 description 1
- ZETYUTMSJWMKNQ-UHFFFAOYSA-N n,n',n'-trimethylhexane-1,6-diamine Chemical compound CNCCCCCCN(C)C ZETYUTMSJWMKNQ-UHFFFAOYSA-N 0.000 description 1
- WUQGUKHJXFDUQF-UHFFFAOYSA-N naphthalene-1,2-dicarbonyl chloride Chemical compound C1=CC=CC2=C(C(Cl)=O)C(C(=O)Cl)=CC=C21 WUQGUKHJXFDUQF-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- LSHSZIMRIAJWRM-UHFFFAOYSA-N oxolane-2,3-dicarbonyl chloride Chemical compound ClC(=O)C1CCOC1C(Cl)=O LSHSZIMRIAJWRM-UHFFFAOYSA-N 0.000 description 1
- MTAAPVANJNSBGV-UHFFFAOYSA-N pentane-1,1,1-tricarbonyl chloride Chemical compound CCCCC(C(Cl)=O)(C(Cl)=O)C(Cl)=O MTAAPVANJNSBGV-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000010587 phase diagram Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- GHAIYFTVRRTBNG-UHFFFAOYSA-N piperazin-1-ylmethanamine Chemical compound NCN1CCNCC1 GHAIYFTVRRTBNG-UHFFFAOYSA-N 0.000 description 1
- 229920000962 poly(amidoamine) Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920006149 polyester-amide block copolymer Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229940113115 polyethylene glycol 200 Drugs 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- VLRIRAGKJXODNO-UHFFFAOYSA-N propane-1,1,1-tricarbonyl chloride Chemical compound CCC(C(Cl)=O)(C(Cl)=O)C(Cl)=O VLRIRAGKJXODNO-UHFFFAOYSA-N 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- AGGKEGLBGGJEBZ-UHFFFAOYSA-N tetramethylenedisulfotetramine Chemical compound C1N(S2(=O)=O)CN3S(=O)(=O)N1CN2C3 AGGKEGLBGGJEBZ-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- MBYLVOKEDDQJDY-UHFFFAOYSA-N tris(2-aminoethyl)amine Chemical compound NCCN(CCN)CCN MBYLVOKEDDQJDY-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 229910000406 trisodium phosphate Inorganic materials 0.000 description 1
- 235000019801 trisodium phosphate Nutrition 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D69/00—Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or properties; Manufacturing processes specially adapted therefor
- B01D69/12—Composite membranes; Ultra-thin membranes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D63/00—Apparatus in general for separation processes using semi-permeable membranes
- B01D63/10—Spiral-wound membrane modules
- B01D63/103—Details relating to membrane envelopes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D67/00—Processes specially adapted for manufacturing semi-permeable membranes for separation processes or apparatus
- B01D67/0002—Organic membrane manufacture
- B01D67/0023—Organic membrane manufacture by inducing porosity into non porous precursor membranes
- B01D67/003—Organic membrane manufacture by inducing porosity into non porous precursor membranes by selective elimination of components, e.g. by leaching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D69/00—Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or properties; Manufacturing processes specially adapted therefor
- B01D69/10—Supported membranes; Membrane supports
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/28—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by elimination of a liquid phase from a macromolecular composition or article, e.g. drying of coagulum
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2323/00—Details relating to membrane preparation
- B01D2323/08—Specific temperatures applied
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2323/00—Details relating to membrane preparation
- B01D2323/08—Specific temperatures applied
- B01D2323/081—Heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D63/00—Apparatus in general for separation processes using semi-permeable membranes
- B01D63/10—Spiral-wound membrane modules
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D71/00—Semi-permeable membranes for separation processes or apparatus characterised by the material; Manufacturing processes specially adapted therefor
- B01D71/06—Organic material
- B01D71/46—Epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2201/00—Foams characterised by the foaming process
- C08J2201/04—Foams characterised by the foaming process characterised by the elimination of a liquid or solid component, e.g. precipitation, leaching out, evaporation
- C08J2201/046—Elimination of a polymeric phase
- C08J2201/0464—Elimination of a polymeric phase using water or inorganic fluids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2300/00—Characterised by the use of unspecified polymers
- C08J2300/24—Thermosetting resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
Description
ポロゲンを含む熱硬化性樹脂シートから前記ポロゲンを抽出除去する工程を含み、
相対的に低い温度の第1液に前記熱硬化性樹脂シートを接触させた後、相対的に高い温度の第2液に前記熱硬化性樹脂シートを接触させることによって、前記ポロゲンの抽出除去を行う、熱硬化性樹脂多孔シートの製造方法を提供する。
上記本発明の方法によって製造された平均孔径0.01μm〜0.4μmの熱硬化性樹脂多孔シートと、
前記熱硬化性樹脂多孔シートの表面に設けられたポリアミド系スキン層と、
を備えた、複合分離膜を提供する。
有孔中空管と、
前記有孔中空管に巻回された積層体と、
を備え、
前記積層体が、上記本発明の複合分離膜と、前記複合分離膜に組み合わされた流路材とを含む、スパイラル型分離膜エレメントを提供する。
空孔率(%)=100×(V−(W/D))/V
V:体積(cm3)
W:重量(g)
D:構成成分の平均密度(g/cm3)
ビスフェノールA型エポキシ樹脂(ジャパンエポキシレジン社製、エピコート828)139重量部、ビスフェノールA型エポキシ樹脂(ジャパンエポキシレジン社製、エピコート1010)93.2重量部、ビス(4−アミノシクロヘキシル)メタン52重量部、及びポリエチレングリコール200(三洋化成社製)500重量部を容器に入れ、スリーワンモーターを用いて400rpmで15分間撹拌した。得られたエポキシ樹脂組成物を、円筒状モールド(外径35cm、内径10.5cm)内に高さ30cmまで充填して25℃で12時間室温硬化し、さらに130℃で18時間反応硬化させて円筒状樹脂ブロックを作製した。この樹脂ブロックを、円筒軸を中心に回転させながら切削装置を用いて、その表面を厚さ135μmで連続的にスライスし、長尺状のエポキシ樹脂シート(幅30cm、長さ150m)を得た。
ガラス転移温度は、温度変調DSC(示差走査熱量計)(TAインスツルメント社製、Q2000)を用いて測定した。
ポリエチレングリコールの残存量は、次の方法で測定した。具体的には、アセトニトリルを用いてエポキシ樹脂シート又は多孔シートからポリエチレングリコールを抽出し、得られた抽出液をHPLC(高速液体クロマトグラフィー)にて分画後、RI(屈折率)測定装置で試料の屈折率を測定した。屈折率から試料におけるポリエチレングリコールの濃度を算出し、単位重量のエポキシ樹脂シート又は多孔シートに含まれたポリエチレングリコールの重量を算出した。
第2浴の浴液温度を80℃とした以外は実施例1と同様にしてエポキシ樹脂多孔シートを作製した。その各測定結果を表1に示す。また、目視によるシート外観は、皺や変形もなく良好であった。
第1浴と第2浴の浴液温度をともに60℃とした以外は実施例1と同様にしてエポキシ樹脂多孔シートを作製した。その各測定結果を表1に示す。このときの目視によるシート外観において、シートが波板状に変形していた。この様子を図6に示す。
第1浴と第2浴の浴液温度をともに80℃とした以外は実施例1と同様にしてエポキシ樹脂多孔シートを作製した。その各測定結果を表1に示す。このときの目視によるシート外観において、シートが波板状に変形していた。
図3を参照して説明した方法によってエポキシ樹脂シートからポリエチレングリコールを除去し、多孔シートを得た。具体的には、まず、厚さを90μmとした点を除き実施例1と同様にして作製したエポキシ樹脂シートをポリエステル樹脂製のネット(スペーサ)とともにコアに巻き取り、巻回体(直径:200mm)を得た。この巻回体を圧力容器に入れ、ポリエチレングリコールの抽出除去を以下に示す条件で実施した。
第2段階:50℃、15リットル/min、60min
第3段階:80℃、4.8リットル/min、60min
処理液:純水
実施例3と同じように、図3を参照して説明した方法によってエポキシ樹脂シートからポリエチレングリコールを除去し、多孔シートを得た。具体的には、まず、厚さを90μmとした点を除き実施例1と同様にして作製したエポキシ樹脂シートをポリエステル樹脂製のネット(スペーサ)とともにコアに巻き取り、巻回体(直径:100mm)を得た。この巻回体を圧力容器に入れ、ポリエチレングリコールの抽出除去を以下に示す条件で実施した。
第2段階:25℃、20リットル/min、5min
処理液:純水
2 浴液流出口
3 浴液供給部
4 循環ポンプ
5 夾雑物除去フィルター
6 温度調整器
7 浴液排出口
Claims (14)
- ポロゲンを含む熱硬化性樹脂シートから前記ポロゲンを抽出除去する工程を含み、
相対的に低い温度の第1液に前記熱硬化性樹脂シートを接触させた後、相対的に高い温度の第2液に前記熱硬化性樹脂シートを接触させることによって、前記ポロゲンの抽出除去を行い、
前記第1液の温度が、当該第1液に接触させる前における前記熱硬化性樹脂シートのガラス転移温度以下である、熱硬化性樹脂多孔シートの製造方法。 - ポロゲンを含む熱硬化性樹脂シートから前記ポロゲンを抽出除去する工程を含み、
相対的に低い温度の第1液に前記熱硬化性樹脂シートを接触させた後、相対的に高い温度の第2液に前記熱硬化性樹脂シートを接触させることによって、前記ポロゲンの抽出除去を行い、
前記第2液の温度が、前記第1液に接触させた後かつ当該第2液に接触させる前における前記熱硬化性樹脂シートのガラス転移温度以下である、熱硬化性樹脂多孔シートの製造方法。 - ポロゲンを含む熱硬化性樹脂シートから前記ポロゲンを抽出除去する工程を含み、
相対的に低い温度の第1液に前記熱硬化性樹脂シートを接触させた後、相対的に高い温度の第2液に前記熱硬化性樹脂シートを接触させることによって、前記ポロゲンの抽出除去を行い、
前記第2液の温度が60℃以上90℃以下である、熱硬化性樹脂多孔シートの製造方法。 - ポロゲンを含む熱硬化性樹脂シートから前記ポロゲンを抽出除去する工程を含み、
相対的に低い温度の第1液に前記熱硬化性樹脂シートを接触させた後、相対的に高い温度の第2液に前記熱硬化性樹脂シートを接触させることによって、前記ポロゲンの抽出除去を行い、
前記第1液への前記熱硬化性樹脂シートの接触時間が、前記第2液への前記熱硬化性樹脂シートの接触時間よりも長い、熱硬化性樹脂多孔シートの製造方法。 - ポロゲンを含む熱硬化性樹脂シートから前記ポロゲンを抽出除去する工程を含み、
相対的に低い温度の第1液に前記熱硬化性樹脂シートを接触させた後、相対的に高い温度の第2液に前記熱硬化性樹脂シートを接触させることによって、前記ポロゲンの抽出除去を行い、
前記第1液及び前記第2液が、それぞれ、第1浴及び第2浴に保持され、
前記第1浴及び前記第2浴に前記熱硬化性樹脂シートをこの順に浸漬することによって前記ポロゲンを抽出除去し、
前記熱硬化性樹脂シートが長尺の形状を有し、
巻き出し位置から巻き取り位置へと搬送中の前記熱硬化性樹脂シートが前記第1浴及び前記第2浴の中をこの順に通過するように前記熱硬化性樹脂シートの搬送経路が定められている、熱硬化性樹脂多孔シートの製造方法。 - ポロゲンを含む熱硬化性樹脂シートから前記ポロゲンを抽出除去する工程を含み、
相対的に低い温度の第1液に前記熱硬化性樹脂シートを接触させた後、相対的に高い温度の第2液に前記熱硬化性樹脂シートを接触させることによって、前記ポロゲンの抽出除去を行い、
前記第1液及び前記第2液が、それぞれ、第1浴及び第2浴に保持され、
前記第1浴及び前記第2浴に前記熱硬化性樹脂シートをこの順に浸漬することによって前記ポロゲンを抽出除去し、
前記第1浴及び前記第2浴がそれぞれ撹拌され、前記第1液及び前記第2液が流動状態で前記ポロゲンを抽出除去する、熱硬化性樹脂多孔シートの製造方法。 - 前記第1液及び前記第2液が、それぞれ、第1浴及び第2浴に保持され、
前記第1浴及び前記第2浴に前記熱硬化性樹脂シートをこの順に浸漬することによって前記ポロゲンを抽出除去する、請求項1〜4のいずれか1項に記載の熱硬化性樹脂多孔シートの製造方法。 - 前記第1液の温度が、当該第1液に接触させる前における前記熱硬化性樹脂シートのガラス転移温度以下である、請求項2〜6のいずれか1項に記載の熱硬化性樹脂多孔シートの製造方法。
- 前記第2液の温度が、前記第1液に接触させた後かつ当該第2液に接触させる前における前記熱硬化性樹脂シートのガラス転移温度以下である、請求項1、3〜6のいずれか1項に記載の熱硬化性樹脂多孔シートの製造方法。
- 前記第1液及び前記第2液が、それぞれ、水又は水溶液である、請求項1〜9のいずれか1項に記載の熱硬化性樹脂多孔シートの製造方法。
- 前記第1液の温度が30℃以上55℃以下である、請求項1〜10のいずれか1項に記載の熱硬化性樹脂多孔シートの製造方法。
- 前記第2液の温度が60℃以上90℃以下である、請求項1,2,4〜6のいずれか1項に記載の熱硬化性樹脂多孔シートの製造方法。
- 前記熱硬化性樹脂がエポキシ樹脂である、請求項1〜12のいずれか1項に記載の熱硬化性樹脂多孔シートの製造方法。
- 前記ポロゲンがポリエチレングリコールである、請求項1〜13のいずれか1項に記載の熱硬化性樹脂多孔シートの製造方法。
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