JP5697972B2 - 有機発光表示装置及びその製造方法 - Google Patents
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- 238000000151 deposition Methods 0.000 description 2
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- 229910052759 nickel Inorganic materials 0.000 description 2
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- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
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- 239000011888 foil Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910001026 inconel Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
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- 229910052741 iridium Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
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- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
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- 239000010936 titanium Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
- H10K59/80517—Multilayers, e.g. transparent multilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/816—Multilayers, e.g. transparent multilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/10—Transparent electrodes, e.g. using graphene
- H10K2102/101—Transparent electrodes, e.g. using graphene comprising transparent conductive oxides [TCO]
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Description
Tin Oxide)を含有してもよい。
101,201 基板
110,210 第1電極
110a,210a エッチング部
115,215 画素定義膜
120,220 中間層
130,230 第2電極
Claims (14)
- 基板上に配された第1電極と、
前記第1電極上に配されて有機発光層を有する中間層と、
前記中間層上に配される第2電極と、を備え、
前記第1電極は、前記中間層に向かう方向にエッチング部が形成され、
前記第1電極の領域のうち、前記エッチング部が形成された領域は、結晶化され、
前記エッチング部は前記第1電極の表面に対する結晶化を進行した後にエッチング工程を進行して形成されたことを特徴とする有機発光表示装置。 - 前記第1電極上に前記第1電極の所定領域を露出するように画素定義膜が形成され、前記エッチング部は、前記露出された第1電極の領域に形成されたことを特徴とする請求項1に記載の有機発光表示装置。
- 前記第1電極は、Agを含有することを特徴とする請求項2に記載の有機発光表示装置。
- 前記第1電極の領域のうち、前記エッチング部が形成された領域は、結晶化されたITOを含有することを特徴とする請求項1に記載の有機発光表示装置。
- 前記第1電極は、第1導電層/第2導電層/第3導電層の積層構造で形成し、
前記第1導電層及び前記第3導電層は、ITOを含有し、前記第2導電層は、Agを含有することを特徴とする請求項1に記載の有機発光表示装置。 - 前記エッチング部は、前記第3導電層に形成されたことを特徴とする請求項5に記載の有機発光表示装置。
- 基板上に第1電極を形成する工程と、
前記第1電極上に有機発光層を備える中間層を形成する工程と、
前記中間層上に第2電極を形成する工程と、
前記第1電極を形成した後、前記中間層を形成する前に、前記第1電極上に前記第1電極の所定領域を露出するように画素定義膜を形成する工程と、
前記露出された第1電極の表面をエッチングして前記第1電極の前記中間層に向かう方向にエッチング部を形成する工程と、を含み、
前記第1電極に前記エッチング部を形成する前に、前記第1電極の表面を結晶化し、 前記結晶化は前記画素定義膜を形成した後に、前記画素定義膜を形成時に露出された前記第1電極の表面に対して進行する、有機発光表示装置の製造方法。 - 前記エッチング部は、ウェットエッチング法で形成することを特徴とする請求項7に記載の有機発光表示装置の製造方法。
- 前記エッチング部は、シュウ酸を利用したエッチング方法で形成することを特徴とする請求項8に記載の有機発光表示装置の製造方法。
- 前記第1電極は、Agを含有することを特徴とする請求項7に記載の有機発光表示装置の製造方法。
- 前記第1電極の表面は、ITOを含有し、前記第1電極の表面を結晶化する工程は、前記ITOを結晶化する工程を含むことを特徴とする請求項7に記載の有機発光表示装置の製造方法。
- 前記第1電極の表面を結晶化する工程は、熱処理を利用して行うことを特徴とする請求項7に記載の有機発光表示装置の製造方法。
- 前記第1電極は、第1導電層/第2導電層/第3導電層の積層構造で形成し、
前記第1導電層及び前記第3導電層は、ITOを含有し、前記第2導電層は、Agを含有することを特徴とする請求項7に記載の有機発光表示装置の製造方法。 - 前記エッチング部は、前記第3導電層に形成することを特徴とする請求項13に記載の有機発光表示装置の製造方法。
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KR1020100028082A KR101692409B1 (ko) | 2010-03-29 | 2010-03-29 | 유기 발광 표시 장치 및 그 제조 방법 |
KR10-2010-0028082 | 2010-03-29 |
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JP2011210700A JP2011210700A (ja) | 2011-10-20 |
JP5697972B2 true JP5697972B2 (ja) | 2015-04-08 |
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US (1) | US8785224B2 (ja) |
JP (1) | JP5697972B2 (ja) |
KR (1) | KR101692409B1 (ja) |
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DE102012210484B4 (de) * | 2012-06-21 | 2017-02-02 | Osram Oled Gmbh | Verfahren für ein schlüssiges Verbinden eines organischen optoelektronischen Bauelementes mit einem Verbindungsstück, Verbindungsstruktur für ein kraftschlüssiges Verbinden und optoelektronische Bauelementevorrichtung |
KR102441566B1 (ko) * | 2017-08-07 | 2022-09-07 | 삼성디스플레이 주식회사 | 발광 장치 및 발광 장치의 제조 방법 |
KR20190058758A (ko) | 2017-11-21 | 2019-05-30 | 삼성디스플레이 주식회사 | 식각액 조성물 및 이를 이용한 디스플레이 장치의 제조방법 |
KR102554816B1 (ko) | 2018-04-23 | 2023-07-12 | 삼성디스플레이 주식회사 | 식각액 조성물 및 이를 이용한 금속 패턴의 제조 방법 |
KR102661845B1 (ko) | 2018-10-11 | 2024-04-30 | 삼성디스플레이 주식회사 | 식각액 및 이를 이용한 표시 장치의 제조 방법 |
KR102669119B1 (ko) | 2018-11-14 | 2024-05-24 | 삼성디스플레이 주식회사 | 식각 조성물, 이를 이용한 패턴 형성 방법 및 표시 장치의 제조 방법 |
KR102676044B1 (ko) | 2020-04-29 | 2024-06-20 | 삼성디스플레이 주식회사 | 식각액 조성물 및 이를 이용한 표시 장치의 제조 방법 |
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Publication number | Publication date |
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JP2011210700A (ja) | 2011-10-20 |
KR101692409B1 (ko) | 2017-01-04 |
US8785224B2 (en) | 2014-07-22 |
US20110233569A1 (en) | 2011-09-29 |
KR20110108722A (ko) | 2011-10-06 |
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