JP5697348B2 - 発光素子 - Google Patents
発光素子 Download PDFInfo
- Publication number
- JP5697348B2 JP5697348B2 JP2010045212A JP2010045212A JP5697348B2 JP 5697348 B2 JP5697348 B2 JP 5697348B2 JP 2010045212 A JP2010045212 A JP 2010045212A JP 2010045212 A JP2010045212 A JP 2010045212A JP 5697348 B2 JP5697348 B2 JP 5697348B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- primer layer
- emitting device
- resin layer
- phosphor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011347 resin Substances 0.000 claims description 77
- 229920005989 resin Polymers 0.000 claims description 77
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 33
- 239000007769 metal material Substances 0.000 claims description 18
- 230000003287 optical effect Effects 0.000 claims description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- 239000004593 Epoxy Substances 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 230000035807 sensation Effects 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 239000002210 silicon-based material Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 5
- 239000010931 gold Substances 0.000 claims 4
- 239000011135 tin Substances 0.000 claims 4
- 239000010936 titanium Substances 0.000 claims 4
- 239000011701 zinc Substances 0.000 claims 4
- 239000010944 silver (metal) Substances 0.000 claims 2
- 108010043121 Green Fluorescent Proteins Proteins 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 115
- 239000003795 chemical substances by application Substances 0.000 description 17
- 239000000758 substrate Substances 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 239000004020 conductor Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000000149 argon plasma sintering Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000003086 colorant Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
図9乃至図11は、本発明において、プライマー剤のドッティング数による光特性の変化を示すグラフであり、図9は、光度の変化を示すグラフであり、図10は、色度座標xの変化を示すグラフであり、図11は、色度座標yの変化を示すグラフである。
Claims (22)
- 本体;
前記本体上に発光ダイオード;
前記発光ダイオードの上面及び側面を囲み、蛍光体を含む樹脂層;
前記樹脂層上に金属材料及びゴム材料を含むプライマー層;及び
前記プライマー層上に配置される光学部材を含み、
前記光学部材は、前記本体の上面の一部及び前記プライマー層の上面に接着される発光素子。 - 前記本体に前記樹脂層が形成されたキャビティと、前記キャビティに配置された少なくとも一つのリード電極と、を含み、
前記発光ダイオードは前記キャビティ内のリード電極に電気的に連結される請求項1に記載の発光素子。 - 前記光学部材はレンズを含む請求項1または2に記載の発光素子。
- 前記金属材料は有色系の色感を有する物質である請求項1から請求項3のいずれか一項に記載の発光素子。
- 前記金属材料はC(炭素)、Fe(鉄)、Al(アルミニウム)、Ag(銀)、Au(金)、Ti(チタニウム)、Zn(亜鉛)、Sn(スズ)のうち少なくとも一つを含む請求項1〜請求項4のいずれか一項に記載の発光素子。
- 前記ゴム材料はシリコン、エポキシ、アクリル物質のうち少なくとも一つを含む請求項1〜請求項5のいずれか一項に記載の発光素子。
- 前記樹脂層は蛍光体を含み、前記蛍光体は赤色蛍光体、緑色蛍光体、青色蛍光体、及び黄色蛍光体のうち少なくとも一つを含む請求項1〜請求項6のいずれか一項に記載の発光素子。
- 前記本体は樹脂材質、セラミック材質、シリコン材質のうちいずれか一つを含む請求項1〜請求項7のいずれか一項に記載の発光素子。
- 前記発光ダイオード(LED)は赤色LED、青色LED、緑色LED、及び紫外線LEDのうち少なくとも一つを含む請求項1〜請求項8のいずれか一項に記載の発光素子。
- 前記プライマー層は50μm以下の厚さを有する請求項1〜請求項9のいずれか一項に記載の発光素子。
- 前記本体は複数のキャビティを含む請求項1〜請求項10のいずれか一項に記載の発光素子。
- 本体;
前記本体上に発光ダイオード;
前記発光ダイオードの上面及び側面を囲み、蛍光体を含む樹脂層;
前記発光ダイオードから放出された光の色座標分布を移動させるために前記樹脂層上に配置され、金属材料及びゴム材料を含むプライマー層;及び
前記プライマー層上に接着された光学部材を含み、
前記光学部材は、前記本体の上面の一部及び前記プライマー層の上面に接着される発光素子。 - 前記本体は上部に前記樹脂層が形成されたキャビティ;及び前記キャビティに前記発光ダイオードと電気的に連結される複数のリード電極を含む請求項12に記載の発光素子。
- 前記金属材料は、有色系の色感を有する物質である請求項12または請求項13に記載の発光素子。
- 前記金属材料はC、Fe、Al、Ag、Au、Ti、Zn、及びSnのうち少なくとも一つを含む請求項12〜請求項14のいずれか一項に記載の発光素子。
- 前記金属材料は赤色系又は黄色系の材料を含む請求項14に記載の発光素子。
- 前記樹脂層は内部に添加された蛍光体を含み、
前記蛍光体は赤色蛍光体、緑色蛍光体、青色蛍光体、及び黄色蛍光体のうち少なくとも一つを含む請求項12〜請求項16のいずれか一項に記載の発光素子。 - 前記プライマー層は前記発光ダイオードから放出された光の有する色座標分布に対する一つのランクを異なる色座標分布を有する他のランクに移動させる請求項12〜請求項17のいずれか一項に記載の発光素子。
- 前記プライマー層は前記樹脂層を透過した光が有する色座標分布に対するランクを異なる色座標分布を有するランクに移動させる請求項12〜請求項17のいずれか一項に記載の発光素子。
- 複数のキャビティを有する本体;
前記キャビティに複数のリード電極;
前記キャビティに複数の発光ダイオード;
前記複数の発光ダイオード上に複数の樹脂層;及び
前記複数の樹脂層上にプライマー層;
前記プライマー層上に接着された光学部材を含み、
前記複数の樹脂層のそれぞれは、前記複数の発光ダイオードのそれぞれの上面及び側面を囲み、蛍光体を含み、
前記複数のプライマー層のそれぞれは、金属材料及びゴム材料を含み、
前記光学部材は、前記本体の上面の一部及び前記プライマー層の上面に接着される発光素子。 - 前記樹脂層に少なくとも一つの種類の蛍光体を含む請求項20に記載の発光素子。
- 前記金属材料はC、Fe、Al、Ag、Au、Ti、Zn、及びSnのうち少なくとも一つを含む請求項20または請求項21に記載の発光素子。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090017732A KR101064005B1 (ko) | 2009-03-02 | 2009-03-02 | 발광 장치 및 그 제조방법 |
KR10-2009-0017732 | 2009-03-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010206206A JP2010206206A (ja) | 2010-09-16 |
JP5697348B2 true JP5697348B2 (ja) | 2015-04-08 |
Family
ID=42262002
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010045212A Active JP5697348B2 (ja) | 2009-03-02 | 2010-03-02 | 発光素子 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8860052B2 (ja) |
EP (1) | EP2226860A3 (ja) |
JP (1) | JP5697348B2 (ja) |
KR (1) | KR101064005B1 (ja) |
CN (1) | CN101826589B (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201020643A (en) * | 2008-11-25 | 2010-06-01 | Chi Mei Lighting Tech Corp | Side view type light-emitting diode package structure, and manufacturing method and application thereof |
US8552438B2 (en) * | 2010-03-25 | 2013-10-08 | Micron Technology, Inc. | Multi-lens solid state lighting devices |
CN102468407A (zh) * | 2010-11-17 | 2012-05-23 | 青岛杰生电气有限公司 | 一种紫外发光二极管 |
JP5559027B2 (ja) * | 2010-12-24 | 2014-07-23 | 株式会社朝日ラバー | シリコーンレンズ、レンズ付led装置及びレンズ付led装置の製造方法 |
CN102148297B (zh) * | 2010-12-28 | 2012-08-22 | 广州市鸿利光电股份有限公司 | 一种色光可均匀调配的led制造工艺及led |
US8878215B2 (en) * | 2011-06-22 | 2014-11-04 | Lg Innotek Co., Ltd. | Light emitting device module |
TW201310710A (zh) * | 2011-08-18 | 2013-03-01 | Alder Optomechanical Corp | 發光裝置 |
US20140014987A1 (en) * | 2012-07-10 | 2014-01-16 | Luminus Devices, Inc. | Methods and apparatuses for shifting chromaticity of light |
DE102016204887A1 (de) * | 2016-03-23 | 2017-09-28 | E.G.O. Elektro-Gerätebau GmbH | Anzeigevorrichtung für ein Elektrogerät und Elektrogerät |
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US6340824B1 (en) * | 1997-09-01 | 2002-01-22 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device including a fluorescent material |
JPH11145519A (ja) | 1997-09-02 | 1999-05-28 | Toshiba Corp | 半導体発光素子、半導体発光装置および画像表示装置 |
JP3614776B2 (ja) * | 2000-12-19 | 2005-01-26 | シャープ株式会社 | チップ部品型ledとその製造方法 |
JP2003152227A (ja) | 2001-11-14 | 2003-05-23 | Citizen Electronics Co Ltd | Ledの色補正手段および色補正方法 |
US6734465B1 (en) * | 2001-11-19 | 2004-05-11 | Nanocrystals Technology Lp | Nanocrystalline based phosphors and photonic structures for solid state lighting |
JP2004031003A (ja) | 2002-06-24 | 2004-01-29 | Mitsuboshi Belting Ltd | ランプバルブ用着色剤及びアンバー色を呈するランプバルブ |
JP4280050B2 (ja) | 2002-10-07 | 2009-06-17 | シチズン電子株式会社 | 白色発光装置 |
JP4799809B2 (ja) | 2003-08-04 | 2011-10-26 | 株式会社ファインラバー研究所 | 半導体発光装置の製造方法 |
EP1794808B1 (en) | 2004-09-10 | 2017-08-09 | Seoul Semiconductor Co., Ltd. | Light emitting diode package having multiple molding resins |
US7670872B2 (en) * | 2004-10-29 | 2010-03-02 | LED Engin, Inc. (Cayman) | Method of manufacturing ceramic LED packages |
TWI263802B (en) * | 2004-12-03 | 2006-10-11 | Innolux Display Corp | Color filter |
JP4591106B2 (ja) | 2005-02-10 | 2010-12-01 | パナソニック電工株式会社 | 白色発光装置 |
EP2280430B1 (en) * | 2005-03-11 | 2020-01-01 | Seoul Semiconductor Co., Ltd. | LED package having an array of light emitting cells coupled in series |
US7329907B2 (en) * | 2005-08-12 | 2008-02-12 | Avago Technologies, Ecbu Ip Pte Ltd | Phosphor-converted LED devices having improved light distribution uniformity |
CN101253637A (zh) | 2005-08-30 | 2008-08-27 | 奥斯兰姆奥普托半导体有限责任公司 | 光电子器件 |
JP2007173547A (ja) | 2005-12-22 | 2007-07-05 | Toshiba Lighting & Technology Corp | 発光装置 |
KR101303377B1 (ko) | 2006-05-02 | 2013-09-03 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 색-안정적 인광체 변환 led |
US20070269586A1 (en) * | 2006-05-17 | 2007-11-22 | 3M Innovative Properties Company | Method of making light emitting device with silicon-containing composition |
JP2008235827A (ja) | 2007-03-23 | 2008-10-02 | Matsushita Electric Works Ltd | 発光装置 |
-
2009
- 2009-03-02 KR KR1020090017732A patent/KR101064005B1/ko active IP Right Grant
- 2009-12-28 US US12/648,118 patent/US8860052B2/en active Active
-
2010
- 2010-02-23 EP EP10154371A patent/EP2226860A3/en not_active Withdrawn
- 2010-02-25 CN CN201010125218.1A patent/CN101826589B/zh active Active
- 2010-03-02 JP JP2010045212A patent/JP5697348B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
CN101826589B (zh) | 2016-02-03 |
EP2226860A2 (en) | 2010-09-08 |
US20100219435A1 (en) | 2010-09-02 |
EP2226860A3 (en) | 2010-09-22 |
KR20100098988A (ko) | 2010-09-10 |
KR101064005B1 (ko) | 2011-09-08 |
CN101826589A (zh) | 2010-09-08 |
JP2010206206A (ja) | 2010-09-16 |
US8860052B2 (en) | 2014-10-14 |
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