JP5690065B2 - 着火が迅速な触媒付きガス貫流セラミック基体およびその製造方法 - Google Patents
着火が迅速な触媒付きガス貫流セラミック基体およびその製造方法 Download PDFInfo
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- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 4
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
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Description
3 網状組織
5 ウェブ壁
7 セル通路
9 外皮
11 入口端
13 出口端
15 気泡
17 ウォッシュコート
22 第1軸線方向領域
24 第2軸線方向領域
37 テーパー壁
Claims (14)
- 触媒コンバータとして用いるのに適したガス貫流セラミック基体であって、ガス流をそれぞれ受入れかつ排出するための軸線方向に互いに反対側にある入口端および出口端を有し、かつ前記入口端から前記出口端まで閉塞されずに伸びる軸線方向に配向されたセル通路を画成する壁からなる網状組織を備えた、セラミック材料からなる本体を含み、
前記壁の厚さが、該セラミック基体の中心から半径方向にいくに従って増大しており、さらにガス流が基体の中心を通ることを促すように、前記軸線方向に配向されたセル通路の断面積が、該セラミック基体の中心から半径方向にいくに従って減少しており、
前記壁の前記入口端近傍の第1軸線方向領域の平均熱質量(ATM1)が、壁全体の平均熱質量(ATMTOT)よりも小さく、さらに
前記第1軸線方向領域における前記壁の平均熱質量(ATM1)が、該第1軸線方向領域に軸線方向に連続する第2軸線方向領域における前記壁の平均熱質量(ATM2)よりも小さいことを特徴とするセラミック基体。 - ATM1がATMTOTよりも少なくとも20%低いことを特徴とする請求項1記載のセラミック基体。
- 前記第1および第2軸線方向領域における前記壁の平均熱質量(ATM1,ATM2)は前記軸線に沿ってほぼ一様であり、かつATM1<ATM2であることを特徴とする請求項1または2記載のセラミック基体。
- 前記第1軸線方向領域における壁の平均厚さが、前記第2軸線方向領域における壁の平均厚さよりも薄いことを特徴とする請求項1から3いずれか1項記載のセラミック基体。
- 前記第1軸線方向領域における平均多孔度が、前記第2軸線方向領域における壁の平均多孔度よりも大きいことを特徴とする請求項1から4いずれか1項記載のセラミック基体。
- 前前記第1軸線方向領域の平均熱質量(ATM1)が、前記第2軸線方向領域の平均熱質量(ATM2)よりも30%〜40%低いことを特徴とする請求項1から5いずれか1項記載のセラミック基体。
- 前記壁が、一酸化炭素の酸化および窒素酸化物(NOX)の解離を促進する触媒で覆われていることを特徴とする請求項1から6いずれか1項記載のセラミック基体。
- 前記壁が全て0.010インチ(0.25mm)未満の厚さを有することを特徴とする請求項1から7いずれか1項記載のセラミック基体。
- 迅速着火・緩慢冷却特性を有するガス貫流セラミック基体の製造方法であって、
軸線方向に互いに反対側にある入口端および出口端を有し、かつ前記入口端から前記出口端まで閉塞されずに伸びる軸線方向に配向されたセル通路を画成する壁からなる網状組織を備えた、セラミック材料からなる本体を形成し、ここで、前記壁の厚さが、セラミック基体の中心から半径方向にいくに従って増大しており、さらにガス流が基体の中心を通ることを促すように、前記軸線方向に配向されたセル通路の断面積が、該セラミック基体の中心から半径方向にいくに従って減少しており、さらに
前記基体の入口端近傍の第1軸線方向領域における壁の平均熱質量(ATM1)が、壁全体の平均熱質量(ATMTOT)よりも小さく、かつ前記第1軸線方向領域における前記壁の平均熱質量(ATM1)が、該第1軸線方向領域に軸線方向に連続する第2軸線方向領域における前記壁の平均熱質量(ATM2)よりも小さくなるように、前記基体の軸線方向に沿って壁の熱質量を変化させる工程を含むことを特徴とする方法。 - 前記壁が基体の軸線方向に実質的に同じ熱質量を有するように形成され、さらに前記第1軸線方向領域における壁の平均熱質量を低下させる工程を含む、請求項9記載の方法。
- 前記平均熱質量を低下させる工程が、前記第1軸線方向領域における壁を化学的にエッチングして壁を薄くするおよび/または多孔度を増大させることにより行われる、請求項10記載の方法。
- 前記平均熱質量を低下させる工程が、前記第1軸線方向領域の壁を、流動流体中に懸濁された研磨剤に曝して壁を薄くすることにより行われる、請求項10記載の方法。
- 前記基体の出口端が最初に形成されるように軸線方向に先駆セラミック材料を押し出すことにより基体が形成され、その際に前記入口端近傍の第1軸線方向領域により少ない先駆セラミック材料を押し出すことにより前記壁の熱質量を変化させる、請求項9記載の方法。
- 前記先駆セラミック材料を押し出す工程が、組み合わさって前記壁を形成する第1および第2の材料の同時押出しにより行われ、基体の軸線に沿って、第1の材料と同時押出しされる第2の材料の量を減らすことにより、前記壁の熱質量を変化させる、請求項13記載の方法。
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Application Number | Priority Date | Filing Date | Title |
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US11/394,779 US7722827B2 (en) | 2006-03-31 | 2006-03-31 | Catalytic flow-through fast light off ceramic substrate and method of manufacture |
US11/394,779 | 2006-03-31 | ||
PCT/US2007/007301 WO2007126710A1 (en) | 2006-03-31 | 2007-03-23 | Catalytic flow-through fast light off ceramic substrate and method of manufacture |
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JP2009532196A JP2009532196A (ja) | 2009-09-10 |
JP5690065B2 true JP5690065B2 (ja) | 2015-03-25 |
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JP2009502897A Active JP5690065B2 (ja) | 2006-03-31 | 2007-03-23 | 着火が迅速な触媒付きガス貫流セラミック基体およびその製造方法 |
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US (1) | US7722827B2 (ja) |
EP (2) | EP3090796A1 (ja) |
JP (1) | JP5690065B2 (ja) |
CN (1) | CN101437599B (ja) |
WO (1) | WO2007126710A1 (ja) |
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- 2007-03-23 CN CN2007800159425A patent/CN101437599B/zh active Active
- 2007-03-23 EP EP16171743.4A patent/EP3090796A1/en not_active Withdrawn
- 2007-03-23 JP JP2009502897A patent/JP5690065B2/ja active Active
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Also Published As
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WO2007126710A1 (en) | 2007-11-08 |
CN101437599A (zh) | 2009-05-20 |
JP2009532196A (ja) | 2009-09-10 |
US7722827B2 (en) | 2010-05-25 |
CN101437599B (zh) | 2012-12-26 |
US20070238256A1 (en) | 2007-10-11 |
EP2004304A1 (en) | 2008-12-24 |
EP3090796A1 (en) | 2016-11-09 |
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