JP5662435B2 - 損傷を与えない高効率な粒子除去洗浄 - Google Patents

損傷を与えない高効率な粒子除去洗浄 Download PDF

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Publication number
JP5662435B2
JP5662435B2 JP2012517635A JP2012517635A JP5662435B2 JP 5662435 B2 JP5662435 B2 JP 5662435B2 JP 2012517635 A JP2012517635 A JP 2012517635A JP 2012517635 A JP2012517635 A JP 2012517635A JP 5662435 B2 JP5662435 B2 JP 5662435B2
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Japan
Prior art keywords
cleaning agent
cleaning
particles
substrate surface
pva particles
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Expired - Fee Related
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JP2012517635A
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English (en)
Japanese (ja)
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JP2012531748A5 (enExample
JP2012531748A (ja
Inventor
ミハイリチェンコ・カトリーナ
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Lam Research Corp
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Lam Research Corp
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    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3753—Polyvinylalcohol; Ethers or esters thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G3/00—Apparatus for cleaning or pickling metallic material
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D17/00—Detergent materials or soaps characterised by their shape or physical properties
    • C11D17/0008—Detergent materials or soaps characterised by their shape or physical properties aqueous liquid non soap compositions
    • C11D17/0013—Liquid compositions with insoluble particles in suspension
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D17/00—Detergent materials or soaps characterised by their shape or physical properties
    • C11D17/0008—Detergent materials or soaps characterised by their shape or physical properties aqueous liquid non soap compositions
    • C11D17/003—Colloidal solutions, e.g. gels; Thixotropic solutions or pastes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2012517635A 2009-06-24 2010-06-21 損傷を与えない高効率な粒子除去洗浄 Expired - Fee Related JP5662435B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/491,213 US8367594B2 (en) 2009-06-24 2009-06-24 Damage free, high-efficiency, particle removal cleaner comprising polyvinyl alcohol particles
US12/491,213 2009-06-24
PCT/US2010/039396 WO2010151513A1 (en) 2009-06-24 2010-06-21 Damage-free high efficiency particle removal clean

Publications (3)

Publication Number Publication Date
JP2012531748A JP2012531748A (ja) 2012-12-10
JP2012531748A5 JP2012531748A5 (enExample) 2013-08-08
JP5662435B2 true JP5662435B2 (ja) 2015-01-28

Family

ID=43381398

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012517635A Expired - Fee Related JP5662435B2 (ja) 2009-06-24 2010-06-21 損傷を与えない高効率な粒子除去洗浄

Country Status (7)

Country Link
US (1) US8367594B2 (enExample)
JP (1) JP5662435B2 (enExample)
KR (1) KR101625703B1 (enExample)
CN (1) CN102803564B (enExample)
SG (1) SG176795A1 (enExample)
TW (1) TWI518757B (enExample)
WO (1) WO2010151513A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170056631A (ko) * 2014-09-18 2017-05-23 어플라이드 머티어리얼스, 인코포레이티드 엔지니어링된 점성 유체를 이용한 고효율 ｃｍｐ 후 세정을 위한 방법 및 장치
CN106319848B (zh) * 2015-06-29 2020-05-22 青岛海尔滚筒洗衣机有限公司 一种滚筒洗衣机
KR102208754B1 (ko) 2017-07-10 2021-01-28 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
US10748757B2 (en) 2017-09-21 2020-08-18 Honeywell International, Inc. Thermally removable fill materials for anti-stiction applications
US10727044B2 (en) 2017-09-21 2020-07-28 Honeywell International Inc. Fill material to mitigate pattern collapse
US10468243B2 (en) 2017-11-22 2019-11-05 Taiwan Semiconductor Manufacturing Co., Ltd. Method of manufacturing semiconductor device and method of cleaning substrate
WO2020077406A1 (en) * 2018-10-16 2020-04-23 Saban Ventures Pty Limited Apparatus and method for cleaning a medical device
CN111744891B (zh) * 2020-05-22 2022-06-10 西安奕斯伟材料科技有限公司 研磨机吸附台表面的清洁方法
CN111760847A (zh) * 2020-06-19 2020-10-13 东莞市佳骏电子科技有限公司 一种半导体产品的清洗工艺

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6012A (en) * 1849-01-09 Lithographing co
US9015A (en) * 1852-06-15 Manufacture of granular fuel from brush-wood and twigs
US3819525A (en) * 1972-08-21 1974-06-25 Avon Prod Inc Cosmetic cleansing preparation
JPS54153779A (en) 1978-05-25 1979-12-04 Kuraray Co Ltd Preparation of polyvinyl alcohol base selective transmission membrane
US4777089A (en) * 1985-05-08 1988-10-11 Lion Corporation Microcapsule containing hydrous composition
JP2562624B2 (ja) * 1986-11-07 1996-12-11 昭和電工株式会社 水溶性マイクロカプセルおよび液体洗剤組成物
US5281357A (en) * 1993-03-25 1994-01-25 Lever Brothers Company, Division Of Conopco, Inc. Protease containing heavy duty liquid detergent compositions comprising capsules comprising non-proteolytic enzyme and composite polymer
US20030162398A1 (en) * 2002-02-11 2003-08-28 Small Robert J. Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
US7799752B2 (en) * 2002-08-14 2010-09-21 Quest International Services B.V. Compositions comprising encapsulated material
US7737097B2 (en) 2003-06-27 2010-06-15 Lam Research Corporation Method for removing contamination from a substrate and for making a cleaning solution
JP4668528B2 (ja) * 2003-09-05 2011-04-13 株式会社フジミインコーポレーテッド 研磨用組成物
US20050136670A1 (en) * 2003-12-19 2005-06-23 Ameen Joseph G. Compositions and methods for controlled polishing of copper
US20050194562A1 (en) * 2004-02-23 2005-09-08 Lavoie Raymond L.Jr. Polishing compositions for controlling metal interconnect removal rate in semiconductor wafers
JP4814502B2 (ja) * 2004-09-09 2011-11-16 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
JP2006278392A (ja) 2005-03-28 2006-10-12 Dainippon Screen Mfg Co Ltd 基板洗浄装置および基板洗浄方法
JP4912791B2 (ja) * 2006-08-21 2012-04-11 Ｊｓｒ株式会社 洗浄用組成物、洗浄方法及び半導体装置の製造方法
US8211846B2 (en) * 2007-12-14 2012-07-03 Lam Research Group Materials for particle removal by single-phase and two-phase media
US7915215B2 (en) * 2008-10-17 2011-03-29 Appleton Papers Inc. Fragrance-delivery composition comprising boron and persulfate ion-crosslinked polyvinyl alcohol microcapsules and method of use thereof
US8227394B2 (en) * 2008-11-07 2012-07-24 Lam Research Corporation Composition of a cleaning material for particle removal

Also Published As

Publication number Publication date
KR20120109999A (ko) 2012-10-09
CN102803564A (zh) 2012-11-28
WO2010151513A1 (en) 2010-12-29
CN102803564B (zh) 2015-04-29
TWI518757B (zh) 2016-01-21
US8367594B2 (en) 2013-02-05
TW201110210A (en) 2011-03-16
US20100331226A1 (en) 2010-12-30
KR101625703B1 (ko) 2016-05-30
SG176795A1 (en) 2012-01-30
JP2012531748A (ja) 2012-12-10

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