KR101625703B1 - 손상이 없는 고효율 파티클 제거 세정 - Google Patents

손상이 없는 고효율 파티클 제거 세정 Download PDF

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Publication number
KR101625703B1
KR101625703B1 KR1020117030897A KR20117030897A KR101625703B1 KR 101625703 B1 KR101625703 B1 KR 101625703B1 KR 1020117030897 A KR1020117030897 A KR 1020117030897A KR 20117030897 A KR20117030897 A KR 20117030897A KR 101625703 B1 KR101625703 B1 KR 101625703B1
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South Korea
Prior art keywords
cleaning
cleaning material
contaminants
particles
pva
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KR1020117030897A
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English (en)
Korean (ko)
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KR20120109999A (ko
Inventor
카트리나 미하일리첸코
Original Assignee
램 리써치 코포레이션
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    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3753—Polyvinylalcohol; Ethers or esters thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G3/00—Apparatus for cleaning or pickling metallic material
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D17/00—Detergent materials or soaps characterised by their shape or physical properties
    • C11D17/0008—Detergent materials or soaps characterised by their shape or physical properties aqueous liquid non soap compositions
    • C11D17/0013—Liquid compositions with insoluble particles in suspension
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D17/00—Detergent materials or soaps characterised by their shape or physical properties
    • C11D17/0008—Detergent materials or soaps characterised by their shape or physical properties aqueous liquid non soap compositions
    • C11D17/003—Colloidal solutions, e.g. gels; Thixotropic solutions or pastes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020117030897A 2009-06-24 2010-06-21 손상이 없는 고효율 파티클 제거 세정 Expired - Fee Related KR101625703B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/491,213 US8367594B2 (en) 2009-06-24 2009-06-24 Damage free, high-efficiency, particle removal cleaner comprising polyvinyl alcohol particles
US12/491,213 2009-06-24
PCT/US2010/039396 WO2010151513A1 (en) 2009-06-24 2010-06-21 Damage-free high efficiency particle removal clean

Publications (2)

Publication Number Publication Date
KR20120109999A KR20120109999A (ko) 2012-10-09
KR101625703B1 true KR101625703B1 (ko) 2016-05-30

Family

ID=43381398

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117030897A Expired - Fee Related KR101625703B1 (ko) 2009-06-24 2010-06-21 손상이 없는 고효율 파티클 제거 세정

Country Status (7)

Country Link
US (1) US8367594B2 (enExample)
JP (1) JP5662435B2 (enExample)
KR (1) KR101625703B1 (enExample)
CN (1) CN102803564B (enExample)
SG (1) SG176795A1 (enExample)
TW (1) TWI518757B (enExample)
WO (1) WO2010151513A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170056631A (ko) * 2014-09-18 2017-05-23 어플라이드 머티어리얼스, 인코포레이티드 엔지니어링된 점성 유체를 이용한 고효율 ｃｍｐ 후 세정을 위한 방법 및 장치
CN106319848B (zh) * 2015-06-29 2020-05-22 青岛海尔滚筒洗衣机有限公司 一种滚筒洗衣机
KR102208754B1 (ko) 2017-07-10 2021-01-28 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
US10748757B2 (en) 2017-09-21 2020-08-18 Honeywell International, Inc. Thermally removable fill materials for anti-stiction applications
US10727044B2 (en) 2017-09-21 2020-07-28 Honeywell International Inc. Fill material to mitigate pattern collapse
US10468243B2 (en) 2017-11-22 2019-11-05 Taiwan Semiconductor Manufacturing Co., Ltd. Method of manufacturing semiconductor device and method of cleaning substrate
WO2020077406A1 (en) * 2018-10-16 2020-04-23 Saban Ventures Pty Limited Apparatus and method for cleaning a medical device
CN111744891B (zh) * 2020-05-22 2022-06-10 西安奕斯伟材料科技有限公司 研磨机吸附台表面的清洁方法
CN111760847A (zh) * 2020-06-19 2020-10-13 东莞市佳骏电子科技有限公司 一种半导体产品的清洗工艺

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050054203A1 (en) 2003-09-05 2005-03-10 Shuhei Yamada Polishing composition
US20060128590A1 (en) 2003-06-27 2006-06-15 Lam Research Corporation Method for removing contamination from a substrate and for making a cleaning solution

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US6012A (en) * 1849-01-09 Lithographing co
US9015A (en) * 1852-06-15 Manufacture of granular fuel from brush-wood and twigs
US3819525A (en) * 1972-08-21 1974-06-25 Avon Prod Inc Cosmetic cleansing preparation
JPS54153779A (en) 1978-05-25 1979-12-04 Kuraray Co Ltd Preparation of polyvinyl alcohol base selective transmission membrane
US4777089A (en) * 1985-05-08 1988-10-11 Lion Corporation Microcapsule containing hydrous composition
JP2562624B2 (ja) * 1986-11-07 1996-12-11 昭和電工株式会社 水溶性マイクロカプセルおよび液体洗剤組成物
US5281357A (en) * 1993-03-25 1994-01-25 Lever Brothers Company, Division Of Conopco, Inc. Protease containing heavy duty liquid detergent compositions comprising capsules comprising non-proteolytic enzyme and composite polymer
US20030162398A1 (en) * 2002-02-11 2003-08-28 Small Robert J. Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
US7799752B2 (en) * 2002-08-14 2010-09-21 Quest International Services B.V. Compositions comprising encapsulated material
US20050136670A1 (en) * 2003-12-19 2005-06-23 Ameen Joseph G. Compositions and methods for controlled polishing of copper
US20050194562A1 (en) * 2004-02-23 2005-09-08 Lavoie Raymond L.Jr. Polishing compositions for controlling metal interconnect removal rate in semiconductor wafers
JP4814502B2 (ja) * 2004-09-09 2011-11-16 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
JP2006278392A (ja) 2005-03-28 2006-10-12 Dainippon Screen Mfg Co Ltd 基板洗浄装置および基板洗浄方法
JP4912791B2 (ja) * 2006-08-21 2012-04-11 Ｊｓｒ株式会社 洗浄用組成物、洗浄方法及び半導体装置の製造方法
US8211846B2 (en) * 2007-12-14 2012-07-03 Lam Research Group Materials for particle removal by single-phase and two-phase media
US7915215B2 (en) * 2008-10-17 2011-03-29 Appleton Papers Inc. Fragrance-delivery composition comprising boron and persulfate ion-crosslinked polyvinyl alcohol microcapsules and method of use thereof
US8227394B2 (en) * 2008-11-07 2012-07-24 Lam Research Corporation Composition of a cleaning material for particle removal

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060128590A1 (en) 2003-06-27 2006-06-15 Lam Research Corporation Method for removing contamination from a substrate and for making a cleaning solution
US20050054203A1 (en) 2003-09-05 2005-03-10 Shuhei Yamada Polishing composition

Also Published As

Publication number Publication date
KR20120109999A (ko) 2012-10-09
JP5662435B2 (ja) 2015-01-28
CN102803564A (zh) 2012-11-28
WO2010151513A1 (en) 2010-12-29
CN102803564B (zh) 2015-04-29
TWI518757B (zh) 2016-01-21
US8367594B2 (en) 2013-02-05
TW201110210A (en) 2011-03-16
US20100331226A1 (en) 2010-12-30
SG176795A1 (en) 2012-01-30
JP2012531748A (ja) 2012-12-10

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