JP5658715B2 - ホール起電力信号検出装置 - Google Patents
ホール起電力信号検出装置 Download PDFInfo
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- JP5658715B2 JP5658715B2 JP2012164454A JP2012164454A JP5658715B2 JP 5658715 B2 JP5658715 B2 JP 5658715B2 JP 2012164454 A JP2012164454 A JP 2012164454A JP 2012164454 A JP2012164454 A JP 2012164454A JP 5658715 B2 JP5658715 B2 JP 5658715B2
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- signal
- electromotive force
- hall
- hall electromotive
- force signal
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- 238000001514 detection method Methods 0.000 claims description 37
- 238000012937 correction Methods 0.000 claims description 26
- 230000035945 sensitivity Effects 0.000 claims description 22
- 230000002742 anti-folding effect Effects 0.000 claims description 15
- 238000012545 processing Methods 0.000 description 16
- 238000005070 sampling Methods 0.000 description 15
- 238000010586 diagram Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 230000010355 oscillation Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000005355 Hall effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
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- 238000012935 Averaging Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
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- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 238000011045 prefiltration Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Hall/Mr Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012164454A JP5658715B2 (ja) | 2012-07-25 | 2012-07-25 | ホール起電力信号検出装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012164454A JP5658715B2 (ja) | 2012-07-25 | 2012-07-25 | ホール起電力信号検出装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014025740A JP2014025740A (ja) | 2014-02-06 |
| JP2014025740A5 JP2014025740A5 (enExample) | 2014-04-03 |
| JP5658715B2 true JP5658715B2 (ja) | 2015-01-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012164454A Active JP5658715B2 (ja) | 2012-07-25 | 2012-07-25 | ホール起電力信号検出装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5658715B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12543510B2 (en) | 2022-06-30 | 2026-02-03 | Asahi Kasei Microdevices Corporation | Semiconductor package and drive apparatus |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6159296B2 (ja) * | 2014-06-16 | 2017-07-05 | 旭化成エレクトロニクス株式会社 | ホールセンサ及びホール起電力検出方法 |
| JP6885538B2 (ja) * | 2016-12-07 | 2021-06-16 | 国立大学法人九州大学 | 磁界センサ |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6022A (en) * | 1849-01-09 | Cast-iron oak-wheel | ||
| JPH0547813U (ja) * | 1991-11-28 | 1993-06-25 | 矢崎総業株式会社 | センサ装置 |
| JP4736508B2 (ja) * | 2005-03-31 | 2011-07-27 | 株式会社デンソー | 物理量検出方法及びセンサ装置 |
| JP2008008883A (ja) * | 2006-06-02 | 2008-01-17 | Denso Corp | 磁気センサ及びセンサ |
| JP2008096213A (ja) * | 2006-10-10 | 2008-04-24 | Toyota Motor Corp | ホールセンサ及びホール電圧補正方法 |
| JP4884299B2 (ja) * | 2007-05-18 | 2012-02-29 | 旭化成エレクトロニクス株式会社 | 磁気検出装置 |
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2012
- 2012-07-25 JP JP2012164454A patent/JP5658715B2/ja active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12543510B2 (en) | 2022-06-30 | 2026-02-03 | Asahi Kasei Microdevices Corporation | Semiconductor package and drive apparatus |
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| Publication number | Publication date |
|---|---|
| JP2014025740A (ja) | 2014-02-06 |
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