JP5656688B2 - 透明板状物のエッジ検出装置及び研削装置 - Google Patents

透明板状物のエッジ検出装置及び研削装置 Download PDF

Info

Publication number
JP5656688B2
JP5656688B2 JP2011043868A JP2011043868A JP5656688B2 JP 5656688 B2 JP5656688 B2 JP 5656688B2 JP 2011043868 A JP2011043868 A JP 2011043868A JP 2011043868 A JP2011043868 A JP 2011043868A JP 5656688 B2 JP5656688 B2 JP 5656688B2
Authority
JP
Japan
Prior art keywords
transparent plate
edge detection
chuck table
grinding
detection device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011043868A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012179676A (ja
JP2012179676A5 (enExample
Inventor
杉山　聡
聡 杉山
二郎 現王園
二郎 現王園
山田　賢
賢 山田
暢之 福士
暢之 福士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2011043868A priority Critical patent/JP5656688B2/ja
Publication of JP2012179676A publication Critical patent/JP2012179676A/ja
Publication of JP2012179676A5 publication Critical patent/JP2012179676A5/ja
Application granted granted Critical
Publication of JP5656688B2 publication Critical patent/JP5656688B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
JP2011043868A 2011-03-01 2011-03-01 透明板状物のエッジ検出装置及び研削装置 Active JP5656688B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011043868A JP5656688B2 (ja) 2011-03-01 2011-03-01 透明板状物のエッジ検出装置及び研削装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011043868A JP5656688B2 (ja) 2011-03-01 2011-03-01 透明板状物のエッジ検出装置及び研削装置

Publications (3)

Publication Number Publication Date
JP2012179676A JP2012179676A (ja) 2012-09-20
JP2012179676A5 JP2012179676A5 (enExample) 2014-03-27
JP5656688B2 true JP5656688B2 (ja) 2015-01-21

Family

ID=47011351

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011043868A Active JP5656688B2 (ja) 2011-03-01 2011-03-01 透明板状物のエッジ検出装置及び研削装置

Country Status (1)

Country Link
JP (1) JP5656688B2 (enExample)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO152065C (no) * 1983-02-24 1985-07-24 Tomra Systems As Fremgangsmaate for konturgjenkjenning av helt eller delvis transparente gjenstander, f.eks. flasker
JPS6222576U (enExample) * 1985-07-26 1987-02-10
JP5117686B2 (ja) * 2006-05-29 2013-01-16 株式会社ディスコ 研削装置
GB0818625D0 (en) * 2008-10-10 2008-11-19 Renishaw Plc Backlit vision machine

Also Published As

Publication number Publication date
JP2012179676A (ja) 2012-09-20

Similar Documents

Publication Publication Date Title
JP5324231B2 (ja) 半導体ウエハのアライメント装置
TWI809228B (zh) 切割裝置及使用切割裝置的晶圓加工方法
JP2009123790A (ja) 研削装置
CN102019581B (zh) 晶圆研磨装置和晶圆的制造方法
JP2010186863A (ja) 位置合わせ機構、加工装置および位置合わせ方法
JP6230934B2 (ja) 切削装置
TWI751354B (zh) 切割裝置及晶圓的加工方法
JP2008203280A (ja) 欠陥検査装置
TWI741151B (zh) 工件的檢查方法、工件的檢查裝置及加工裝置
TWI760551B (zh) 研削方法
JP7521979B2 (ja) 基板検査装置
JP6192527B2 (ja) 研削装置
JP5930519B2 (ja) 加工装置
JP6223862B2 (ja) 切削装置
TW201615345A (zh) 被加工物之磨削方法
JP6817761B2 (ja) ウエーハの分割方法
JP6574373B2 (ja) 円板状ワークの研削方法
JP5656688B2 (ja) 透明板状物のエッジ検出装置及び研削装置
JP2014154708A (ja) ウエーハの割れ検出方法及びウエーハの割れ検出装置
JP5473715B2 (ja) ウエーハ搬送機構の調整方法
CN113199353B (zh) 加工装置
CN116230510A (zh) 晶片的制造方法和磨削装置
JP2015226043A (ja) ウェーハｉｄ読み取り装置
JP2021177504A (ja) 搬送装置および加工装置
JP2022099716A (ja) 研削装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140210

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140219

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20141120

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20141125

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20141125

R150 Certificate of patent or registration of utility model

Ref document number: 5656688

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250