JP5654718B2 - 多相系を有する接着剤を使用する高温結合力を改善する方法 - Google Patents

多相系を有する接着剤を使用する高温結合力を改善する方法 Download PDF

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Publication number
JP5654718B2
JP5654718B2 JP2005100639A JP2005100639A JP5654718B2 JP 5654718 B2 JP5654718 B2 JP 5654718B2 JP 2005100639 A JP2005100639 A JP 2005100639A JP 2005100639 A JP2005100639 A JP 2005100639A JP 5654718 B2 JP5654718 B2 JP 5654718B2
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resin
acrylate
poly
resins
group
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JP2005290380A (ja
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タダシ・タカノ
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ヘンケル・アーゲー・アンド・カンパニー・カーゲーアーアー
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L1/00—Arrangements for detecting or preventing errors in the information received
    • H04L1/22—Arrangements for detecting or preventing errors in the information received using redundant apparatus to increase reliability
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/34—Introducing sulfur atoms or sulfur-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/30—Introducing nitrogen atoms or nitrogen-containing groups

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
JP2005100639A 2004-04-01 2005-03-31 多相系を有する接着剤を使用する高温結合力を改善する方法 Expired - Lifetime JP5654718B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/815,442 US7160946B2 (en) 2004-04-01 2004-04-01 Method to improve high temperature cohesive strength with adhesive having multi-phase system
US10/815442 2004-04-01

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014097205A Division JP5676801B2 (ja) 2004-04-01 2014-05-08 多相系を有する接着剤を使用する高温結合力を改善する方法

Publications (2)

Publication Number Publication Date
JP2005290380A JP2005290380A (ja) 2005-10-20
JP5654718B2 true JP5654718B2 (ja) 2015-01-14

Family

ID=34887744

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2005100639A Expired - Lifetime JP5654718B2 (ja) 2004-04-01 2005-03-31 多相系を有する接着剤を使用する高温結合力を改善する方法
JP2014097205A Expired - Lifetime JP5676801B2 (ja) 2004-04-01 2014-05-08 多相系を有する接着剤を使用する高温結合力を改善する方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2014097205A Expired - Lifetime JP5676801B2 (ja) 2004-04-01 2014-05-08 多相系を有する接着剤を使用する高温結合力を改善する方法

Country Status (8)

Country Link
US (1) US7160946B2 (enrdf_load_stackoverflow)
EP (1) EP1582574B1 (enrdf_load_stackoverflow)
JP (2) JP5654718B2 (enrdf_load_stackoverflow)
KR (1) KR101158348B1 (enrdf_load_stackoverflow)
CN (1) CN1676564A (enrdf_load_stackoverflow)
DE (1) DE602005000365T2 (enrdf_load_stackoverflow)
SG (1) SG115812A1 (enrdf_load_stackoverflow)
TW (1) TWI367926B (enrdf_load_stackoverflow)

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EP1736520B1 (en) * 2004-03-19 2014-04-30 Sumitomo Bakelite Company, Ltd. Resin composition and semiconductor devices made by using the same
TW200707468A (en) * 2005-04-06 2007-02-16 Toagosei Co Ltd Conductive paste, circuit board, circuit article and method for manufacturing such circuit article
US7422707B2 (en) * 2007-01-10 2008-09-09 National Starch And Chemical Investment Holding Corporation Highly conductive composition for wafer coating
US20080292801A1 (en) * 2007-05-23 2008-11-27 National Starch And Chemical Investment Holding Corporation Corrosion-Preventive Adhesive Compositions
WO2009105911A1 (en) * 2008-02-25 2009-09-03 National Starch And Chemical Investment Holding Coporation Self-filleting die attach paste
US9018326B2 (en) 2012-04-06 2015-04-28 Ips Corporation Adhesive composition for bonding low surface energy polyolefin substrates
KR101974257B1 (ko) * 2014-08-29 2019-04-30 후루카와 덴키 고교 가부시키가이샤 접착 필름 및 접착 필름을 이용한 반도체 패키지
CN104212365B (zh) * 2014-09-26 2015-12-02 烟台德邦科技有限公司 一种非流动底部填充材料及其制备方法
WO2016087036A1 (de) 2014-12-01 2016-06-09 Pi Ceramic Gmbh Kermische Technologien Und Bauelemente Aktuatorvorrichtung
DE102014017746B4 (de) * 2014-12-01 2021-10-21 Pi Ceramic Gmbh Aktuatorvorrichtung
CN110065272B (zh) * 2014-12-18 2021-06-11 株式会社钟化 石墨层叠体、石墨层叠体的制造方法、热传输用构造物以及棒状热传输体
JP6623092B2 (ja) * 2016-03-22 2019-12-18 株式会社巴川製紙所 熱硬化性接着シートおよびその製造方法
KR102466030B1 (ko) * 2016-09-29 2022-11-10 세키스이가가쿠 고교가부시키가이샤 액정 표시 소자용 시일제, 상하 도통 재료, 및 액정 표시 소자
WO2018212215A1 (ja) 2017-05-16 2018-11-22 デクセリアルズ株式会社 アンダーフィル材、アンダーフィルフィルム、及びこれを用いた半導体装置の製造方法
DE112019006725T5 (de) * 2019-01-24 2021-10-07 Showa Denko K.K. Wärmehärtende harzzusammensetzung
TWI783454B (zh) * 2021-04-21 2022-11-11 翌驊實業股份有限公司 黏著複合物及其使用方法
CN119306648A (zh) * 2024-12-17 2025-01-14 杭州之江有机硅化工有限公司 一种双马来酰亚胺树脂及其制备方法和应用

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US5747615A (en) * 1988-04-29 1998-05-05 Cytec Technology Corp. Slurry-mixed heat-curable resin systems having superior tack and drape
US5003018A (en) * 1988-04-29 1991-03-26 Basf Aktiengesellschaft Slurry mixing of bismaleimide resins
JP3290242B2 (ja) * 1993-05-13 2002-06-10 住友ベークライト株式会社 低誘電率熱硬化性樹脂組成物
US6852814B2 (en) 1994-09-02 2005-02-08 Henkel Corporation Thermosetting resin compositions containing maleimide and/or vinyl compounds
CA2237359A1 (en) * 1995-11-13 1997-05-22 Cytec Technology Corp. Thermosetting polymers for composite and adhesive applications
US20030055121A1 (en) 1996-09-10 2003-03-20 Dershem Stephen M. Thermosetting resin compositions containing maleimide and/or vinyl compounds
JP3599160B2 (ja) 1997-05-16 2004-12-08 大日本インキ化学工業株式会社 マレイミド誘導体を含有する活性エネルギー線硬化性組成物及び該活性エネルギー線硬化性組成物の硬化方法
CA2679577C (en) * 1997-07-03 2013-08-13 Henkel Loctite Corporation High temperature, controlled strength anaerobic adhesive compositions curable under ambient environmental conditions
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JPH11106454A (ja) * 1997-10-06 1999-04-20 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
US6265530B1 (en) * 1998-07-02 2001-07-24 National Starch And Chemical Investment Holding Corporation Die attach adhesives for use in microelectronic devices
US6350840B1 (en) 1998-07-02 2002-02-26 National Starch And Chemical Investment Holding Corporation Underfill encapsulants prepared from allylated amide compounds
JP3705530B2 (ja) * 1998-08-24 2005-10-12 住友ベークライト株式会社 絶縁性ダイアタッチペースト
CA2377902A1 (en) * 1999-07-08 2001-01-18 The University Of North Carolina At Chapel Hill Novel prodrugs for antimicrobial amidines
US6441213B1 (en) * 2000-05-18 2002-08-27 National Starch And Chemical Investment Holding Corporation Adhesion promoters containing silane, carbamate or urea, and donor or acceptor functionality
ES2240471T3 (es) * 2000-06-23 2005-10-16 Cytec Surface Specialties, S.A. Proceso para formacion de microesferas solidas de polimeros adhesivos de contacto.
JP3599659B2 (ja) * 2000-10-26 2004-12-08 株式会社巴川製紙所 半導体装置用接着テープ
EP1401380B1 (en) * 2001-06-22 2005-10-12 Unilever Plc Hair conditioning compositions
JP3989299B2 (ja) * 2002-05-23 2007-10-10 日本化薬株式会社 マレイミド化合物、これを含む樹脂組成物及びその硬化物
US6669929B1 (en) 2002-12-30 2003-12-30 Colgate Palmolive Company Dentifrice containing functional film flakes

Also Published As

Publication number Publication date
SG115812A1 (en) 2005-10-28
EP1582574B1 (en) 2006-12-27
KR20060044868A (ko) 2006-05-16
JP5676801B2 (ja) 2015-02-25
US20050222330A1 (en) 2005-10-06
TW200613501A (en) 2006-05-01
DE602005000365D1 (de) 2007-02-08
JP2014169450A (ja) 2014-09-18
CN1676564A (zh) 2005-10-05
DE602005000365T2 (de) 2007-05-16
EP1582574A1 (en) 2005-10-05
KR101158348B1 (ko) 2012-06-22
JP2005290380A (ja) 2005-10-20
TWI367926B (en) 2012-07-11
US7160946B2 (en) 2007-01-09

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