JP5653755B2 - 結像光学系及び投影露光装置 - Google Patents
結像光学系及び投影露光装置 Download PDFInfo
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- JP5653755B2 JP5653755B2 JP2010530304A JP2010530304A JP5653755B2 JP 5653755 B2 JP5653755 B2 JP 5653755B2 JP 2010530304 A JP2010530304 A JP 2010530304A JP 2010530304 A JP2010530304 A JP 2010530304A JP 5653755 B2 JP5653755 B2 JP 5653755B2
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- optical system
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- light
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- 230000003287 optical effect Effects 0.000 title claims description 125
- 238000003384 imaging method Methods 0.000 title claims description 76
- 238000000576 coating method Methods 0.000 claims description 32
- 239000011248 coating agent Substances 0.000 claims description 30
- 238000005286 illumination Methods 0.000 claims description 17
- 238000002310 reflectometry Methods 0.000 claims description 9
- 238000001393 microlithography Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 210000001747 pupil Anatomy 0.000 description 18
- 239000000758 substrate Substances 0.000 description 9
- XQPRBTXUXXVTKB-UHFFFAOYSA-M caesium iodide Chemical compound [I-].[Cs+] XQPRBTXUXXVTKB-UHFFFAOYSA-M 0.000 description 4
- 238000004364 calculation method Methods 0.000 description 4
- 230000001427 coherent effect Effects 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 3
- 229910052580 B4C Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
- G02B5/0891—Ultraviolet [UV] mirrors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70233—Optical aspects of catoptric systems, i.e. comprising only reflective elements, e.g. extreme ultraviolet [EUV] projection systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/14—Optical objectives specially designed for the purposes specified below for use with infrared or ultraviolet radiation
- G02B13/143—Optical objectives specially designed for the purposes specified below for use with infrared or ultraviolet radiation for use with ultraviolet radiation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B17/00—Systems with reflecting surfaces, with or without refracting elements
- G02B17/02—Catoptric systems, e.g. image erecting and reversing system
- G02B17/06—Catoptric systems, e.g. image erecting and reversing system using mirrors only, i.e. having only one curved mirror
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
- G03F7/70175—Lamphouse reflector arrangements or collector mirrors, i.e. collecting light from solid angle upstream of the light source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lenses (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Optical Elements Other Than Lenses (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
Description
α=2arcsin(1/2XS/R)
γ=d(吸収体層)/d(二重層)=0.4
この場合、dは、それぞれの層の層厚を表している。
5 物体平面
7 結像光学系
8 像視野
9 像平面
15 結像光
M1、M2、M3、M4、M5、M6 ミラー
Claims (8)
- 物体平面(5)の物体視野(4)を像平面(9)の像視野(8)内に結像する複数のミラー(M1からM6)を有する結像光学系(7)であって、
ミラー(M1からM6)の全ての反射面上への結像光(3)の最大入射角と、結像光学系(7)の像側開口数との比率が33.8°よりも小さく、
結像光の貫通のための貫通開口部を有しないミラーを有するミラー群を有し、
結像光(15)が通過するための貫通開口部(20)を有する少なくとも1つの掩蔽ミラー(M3からM6)を含む、
ことを特徴とする結像光学系(7)。 - 少なくとも3つのミラーが掩蔽された6つのミラー(M1からM6)を含むことを特徴とする請求項1に記載の結像光学系。
- ミラー(M1からM6)の各々が、10nmよりも短い波長を有する結像光(3)に対する反射コーティング(80)を担持し、
結像光(15)が通過するための貫通開口部(20)を有する少なくとも1つの掩蔽ミラー(M3からM6)、
を含むことを特徴とする請求項1に記載の結像光学系(7)。 - ミラー(M1からM6)の各々が、10nmよりも短い波長を有する結像光(3)に対する反射コーティング(80)を担持し、該ミラー(M1からM6)は、50%よりも大きい平均反射率を有する、
ことを特徴とする請求項1に記載の結像光学系(7)。 - 前記ミラー(M1からM6)の各々は、該ミラー(M1からM6)が6.9nmの波長を有する結像光(3)に対して58%よりも大きい平均反射率を有するように反射コーティング(80)を担持することを特徴とする請求項4に記載の結像光学系。
- マイクロリソグラフィのための投影露光装置であって、
請求項1から請求項5のいずれか1項に記載の結像光学系(7)を含み、
光源(2)を含み、かつ
照明光(3)を前記結像光学系(7)の物体視野(4)へ誘導するための照明光学系(6)を含む、
ことを特徴とする装置。 - 照明光(3)を生成するための前記光源(2)は、10nmよりも短い波長を用いて構成されることを特徴とする請求項6に記載の投影露光装置。
- 微細構造構成要素を生成する方法であって、
レチクル(10)及びウェーハ(11)を準備する段階と、
請求項6又は請求項7のいずれか1項に記載の投影露光装置を用いて、前記レチクル(10)上の構造を前記ウェーハ(11)の感光層上に投影する段階と、
前記ウェーハ(11)上に微細構造(B、C)を生成する段階と、
を有することを特徴とする方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US98279307P | 2007-10-26 | 2007-10-26 | |
US60/982,793 | 2007-10-26 | ||
DE102007051671.3 | 2007-10-26 | ||
DE102007051671A DE102007051671A1 (de) | 2007-10-26 | 2007-10-26 | Abbildende Optik sowie Projektionsbelichtungsanlage für die Mikrolithographie mit einer derartigen abbildenden Optik |
PCT/EP2008/008619 WO2009052962A1 (en) | 2007-10-26 | 2008-10-11 | Imaging optical system and projection exposure installation |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011502275A JP2011502275A (ja) | 2011-01-20 |
JP2011502275A5 JP2011502275A5 (ja) | 2011-11-24 |
JP5653755B2 true JP5653755B2 (ja) | 2015-01-14 |
Family
ID=40514165
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010530304A Active JP5653755B2 (ja) | 2007-10-26 | 2008-10-11 | 結像光学系及び投影露光装置 |
Country Status (8)
Country | Link |
---|---|
US (2) | US8605255B2 (ja) |
EP (1) | EP2203785A1 (ja) |
JP (1) | JP5653755B2 (ja) |
KR (2) | KR101593243B1 (ja) |
CN (2) | CN101836165B (ja) |
DE (1) | DE102007051671A1 (ja) |
TW (1) | TWI402629B (ja) |
WO (1) | WO2009052962A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007051671A1 (de) | 2007-10-26 | 2009-05-07 | Carl Zeiss Smt Ag | Abbildende Optik sowie Projektionsbelichtungsanlage für die Mikrolithographie mit einer derartigen abbildenden Optik |
WO2009052932A1 (en) | 2007-10-26 | 2009-04-30 | Carl Zeiss Smt Ag | Imaging optical system and projection exposure installation for micro-lithography with an imaging optical system of this type |
KR101542272B1 (ko) | 2007-10-26 | 2015-08-06 | 칼 짜이스 에스엠티 게엠베하 | 결상 광학 시스템 및 이러한 유형의 결상 광학 시스템을 구비하는 마이크로리소그래피용 투영 노광 장치 |
DE102009046685A1 (de) | 2009-11-13 | 2011-05-26 | Carl Zeiss Smt Gmbh | Abbildende Optik |
DE102009047179B8 (de) * | 2009-11-26 | 2016-08-18 | Carl Zeiss Smt Gmbh | Projektionsobjektiv |
CN103038690B (zh) * | 2010-07-30 | 2016-08-03 | 卡尔蔡司Smt有限责任公司 | 成像光学系统以及具有该类型成像光学系统的用于微光刻的投射曝光设备 |
DE102011083888A1 (de) * | 2011-09-30 | 2013-04-04 | Carl Zeiss Smt Gmbh | Abbildende katoptrische EUV-Projektionsoptik |
DE102012202675A1 (de) * | 2012-02-22 | 2013-01-31 | Carl Zeiss Smt Gmbh | Abbildende Optik sowie Projektionsbelichtungsanlage für die Projektionslithografie mit einer derartigen abbildenden Optik |
US9291751B2 (en) | 2013-06-17 | 2016-03-22 | Carl Zeiss Smt Gmbh | Imaging optical unit and projection exposure apparatus for projection lithography comprising such an imaging optical unit |
DE102013107192A1 (de) | 2013-07-08 | 2015-01-08 | Carl Zeiss Laser Optics Gmbh | Reflektives optisches Element für streifenden Einfall im EUV-Wellenlängenbereich |
DE102013213544A1 (de) * | 2013-07-10 | 2015-01-15 | Carl Zeiss Smt Gmbh | Tragsystem und Projektionsbelichtungsanlage |
DE102013224435A1 (de) * | 2013-11-28 | 2015-05-28 | Carl Zeiss Smt Gmbh | Messanordnung zur Messung optischer Eigenschaften eines reflektiven optischen Elements, insbesondere für die Mikrolithographie |
CN108594411B (zh) * | 2018-06-04 | 2023-06-02 | 凯迈(洛阳)测控有限公司 | 一种长焦距、大口径、多视场中波红外光学系统 |
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KR101542272B1 (ko) | 2007-10-26 | 2015-08-06 | 칼 짜이스 에스엠티 게엠베하 | 결상 광학 시스템 및 이러한 유형의 결상 광학 시스템을 구비하는 마이크로리소그래피용 투영 노광 장치 |
DE102007051671A1 (de) | 2007-10-26 | 2009-05-07 | Carl Zeiss Smt Ag | Abbildende Optik sowie Projektionsbelichtungsanlage für die Mikrolithographie mit einer derartigen abbildenden Optik |
-
2007
- 2007-10-26 DE DE102007051671A patent/DE102007051671A1/de not_active Ceased
-
2008
- 2008-10-11 CN CN200880113387.4A patent/CN101836165B/zh active Active
- 2008-10-11 KR KR1020107010271A patent/KR101593243B1/ko active IP Right Grant
- 2008-10-11 KR KR1020167002267A patent/KR20160018817A/ko not_active Application Discontinuation
- 2008-10-11 EP EP08841328A patent/EP2203785A1/en not_active Withdrawn
- 2008-10-11 CN CN2012102202210A patent/CN102749810A/zh active Pending
- 2008-10-11 JP JP2010530304A patent/JP5653755B2/ja active Active
- 2008-10-11 WO PCT/EP2008/008619 patent/WO2009052962A1/en active Application Filing
- 2008-10-24 TW TW097140935A patent/TWI402629B/zh active
-
2010
- 2010-04-26 US US12/767,627 patent/US8605255B2/en active Active
-
2013
- 2013-11-08 US US14/075,313 patent/US9285515B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN101836165B (zh) | 2016-12-07 |
US8605255B2 (en) | 2013-12-10 |
CN101836165A (zh) | 2010-09-15 |
KR20160018817A (ko) | 2016-02-17 |
EP2203785A1 (en) | 2010-07-07 |
US20140132941A1 (en) | 2014-05-15 |
US20100265481A1 (en) | 2010-10-21 |
KR101593243B1 (ko) | 2016-02-11 |
TW200923595A (en) | 2009-06-01 |
KR20100100781A (ko) | 2010-09-15 |
CN102749810A (zh) | 2012-10-24 |
WO2009052962A1 (en) | 2009-04-30 |
DE102007051671A1 (de) | 2009-05-07 |
TWI402629B (zh) | 2013-07-21 |
US9285515B2 (en) | 2016-03-15 |
JP2011502275A (ja) | 2011-01-20 |
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