JP5645164B2 - フィルム剥離装置 - Google Patents

フィルム剥離装置 Download PDF

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Publication number
JP5645164B2
JP5645164B2 JP2011230327A JP2011230327A JP5645164B2 JP 5645164 B2 JP5645164 B2 JP 5645164B2 JP 2011230327 A JP2011230327 A JP 2011230327A JP 2011230327 A JP2011230327 A JP 2011230327A JP 5645164 B2 JP5645164 B2 JP 5645164B2
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Japan
Prior art keywords
plate
width direction
substrate
roller
film
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JP2011230327A
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Japanese (ja)
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JP2013089826A5 (ko
JP2013089826A (ja
Inventor
進 大場
進 大場
隆之 松井
隆之 松井
正樹 三田
正樹 三田
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株式会社エムイーイー
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Priority to JP2011230327A priority Critical patent/JP5645164B2/ja
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Publication of JP2013089826A5 publication Critical patent/JP2013089826A5/ja
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2011230327A 2011-10-20 2011-10-20 フィルム剥離装置 Active JP5645164B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011230327A JP5645164B2 (ja) 2011-10-20 2011-10-20 フィルム剥離装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011230327A JP5645164B2 (ja) 2011-10-20 2011-10-20 フィルム剥離装置

Publications (3)

Publication Number Publication Date
JP2013089826A JP2013089826A (ja) 2013-05-13
JP2013089826A5 JP2013089826A5 (ko) 2013-08-29
JP5645164B2 true JP5645164B2 (ja) 2014-12-24

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JP2011230327A Active JP5645164B2 (ja) 2011-10-20 2011-10-20 フィルム剥離装置

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JP (1) JP5645164B2 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108891121B (zh) * 2018-08-13 2024-05-31 深圳市伟鸿科科技有限公司 剥料机构及fpc预处理装置

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JP2013089826A (ja) 2013-05-13

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