JP5638790B2 - パッケ−ジキャリアの回路構造とマルチチップパッケ−ジ - Google Patents

パッケ−ジキャリアの回路構造とマルチチップパッケ−ジ Download PDF

Info

Publication number
JP5638790B2
JP5638790B2 JP2009263385A JP2009263385A JP5638790B2 JP 5638790 B2 JP5638790 B2 JP 5638790B2 JP 2009263385 A JP2009263385 A JP 2009263385A JP 2009263385 A JP2009263385 A JP 2009263385A JP 5638790 B2 JP5638790 B2 JP 5638790B2
Authority
JP
Japan
Prior art keywords
bonding pads
bonding
electrode
chip
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009263385A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010123969A (ja
Inventor
自皓 趙
自皓 趙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Everlight Electronics Co Ltd
Original Assignee
Everlight Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Everlight Electronics Co Ltd filed Critical Everlight Electronics Co Ltd
Publication of JP2010123969A publication Critical patent/JP2010123969A/ja
Application granted granted Critical
Publication of JP5638790B2 publication Critical patent/JP5638790B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09254—Branched layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP2009263385A 2008-11-20 2009-11-18 パッケ−ジキャリアの回路構造とマルチチップパッケ−ジ Expired - Fee Related JP5638790B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW097144960 2008-11-20
TW097144960A TWI372476B (en) 2008-11-20 2008-11-20 Circuit structure of package carrier and multi-chip package

Publications (2)

Publication Number Publication Date
JP2010123969A JP2010123969A (ja) 2010-06-03
JP5638790B2 true JP5638790B2 (ja) 2014-12-10

Family

ID=41809217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009263385A Expired - Fee Related JP5638790B2 (ja) 2008-11-20 2009-11-18 パッケ−ジキャリアの回路構造とマルチチップパッケ−ジ

Country Status (4)

Country Link
US (2) US8071989B2 (de)
EP (1) EP2190272B1 (de)
JP (1) JP5638790B2 (de)
TW (1) TWI372476B (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102237352B (zh) * 2010-05-04 2013-05-22 旭丽电子(广州)有限公司 发光二极管模块及发光二极管灯具
US9093445B2 (en) * 2011-08-26 2015-07-28 International Business Machines Corporation Packaging identical chips in a stacked structure
TWI583195B (zh) 2012-07-06 2017-05-11 新力股份有限公司 A solid-state imaging device and a solid-state imaging device, and an electronic device
KR102297284B1 (ko) * 2014-06-23 2021-09-02 삼성전기주식회사 회로 기판 및 회로 기판을 이용한 전자 부품의 배치 상태 검사 방법
USD762596S1 (en) * 2015-04-02 2016-08-02 Genesis Photonics Inc. Light emitting diode package substrate
TWI682531B (zh) * 2019-06-04 2020-01-11 友達光電股份有限公司 顯示裝置及其製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4600970A (en) * 1984-05-29 1986-07-15 Rca Corporation Leadless chip carriers having self-aligning mounting pads
US7042098B2 (en) * 2003-07-07 2006-05-09 Freescale Semiconductor,Inc Bonding pad for a packaged integrated circuit
TWM283319U (en) * 2005-04-01 2005-12-11 Lingsen Precision Ind Ltd Package carrier of IC
WO2007018360A1 (en) * 2005-08-09 2007-02-15 Seoul Opto Device Co., Ltd. Ac light emitting diode and method for fabricating the same
KR100618943B1 (ko) * 2005-12-13 2006-09-01 김성규 투명전광판 및 이에 사용되는 칩 엘이디
TWI320228B (en) 2006-05-04 2010-02-01 A structure of a lead-frame matrix of photoelectron devices
TWI345107B (en) 2006-06-28 2011-07-11 Everlight Electronics Co Ltd Primary color matrix of led

Also Published As

Publication number Publication date
TWI372476B (en) 2012-09-11
EP2190272B1 (de) 2013-03-13
EP2190272A2 (de) 2010-05-26
US20100123144A1 (en) 2010-05-20
US8624273B2 (en) 2014-01-07
US20110254024A1 (en) 2011-10-20
US8071989B2 (en) 2011-12-06
TW201021239A (en) 2010-06-01
JP2010123969A (ja) 2010-06-03
EP2190272A3 (de) 2012-01-18

Similar Documents

Publication Publication Date Title
JP5638790B2 (ja) パッケ−ジキャリアの回路構造とマルチチップパッケ−ジ
US8492777B2 (en) Light emitting diode package, lighting device and light emitting diode package substrate
US8129917B2 (en) Light emitting device for AC operation
EP1908124B1 (de) Lichtemittierendes modul und dessen leiterplatte
KR20120010994A (ko) 발광 장치의 검사 방법 및 발광 장치의 검사 후의 처리 방법
US20220199590A1 (en) Light-emitting diode packaging module
US8138517B2 (en) Light-emitting diode package
CN102691981A (zh) 一种高密集成封装rgb模组及制作方法
US20140159075A1 (en) Light-emitting device package and method of manufacturing the same
US9543279B2 (en) Method of manufacturing a single light-emitting structure
JP6053594B2 (ja) Ｌｅｄ発光装置の製造方法及びｌｅｄ発光装置
CN217468426U (zh) 一种led发光模组
KR101448165B1 (ko) 금속 본딩 회로 패턴을 독립적으로 구성하고，어레이가 형성되어 직병렬 연결 구조가 가능하게 한 ｃｏｂ 또는 ｃｏｍ 형태의 ｌｅｄ 모듈
US20090267229A1 (en) Chip package structure
CN210956669U (zh) 一种镜面铝基板cob光源
CN101764117B (zh) 封装载板的线路结构以及多芯片封装体
KR101285224B1 (ko) 칩온보드 타입 발광 모듈
KR101308552B1 (ko) 칩온보드 타입 발광 모듈 제조 방법
KR101469058B1 (ko) 발광소자 패키지 및 그 제조 방법
KR20090001169A (ko) Ｌｅｄ 패키지 및 그것의 어레이
KR20150042368A (ko) 발광다이오드 구조
JP2016066693A (ja) 発光モジュール
KR20140135932A (ko) 발광소자 패키지 및 그 제조 방법
KR20120068393A (ko) 발광소자 패키지

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20121114

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140304

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20140604

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20140609

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140924

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20141023

LAPS Cancellation because of no payment of annual fees