CN102691981A - 一种高密集成封装rgb模组及制作方法 - Google Patents
一种高密集成封装rgb模组及制作方法 Download PDFInfo
- Publication number
- CN102691981A CN102691981A CN2012101164550A CN201210116455A CN102691981A CN 102691981 A CN102691981 A CN 102691981A CN 2012101164550 A CN2012101164550 A CN 2012101164550A CN 201210116455 A CN201210116455 A CN 201210116455A CN 102691981 A CN102691981 A CN 102691981A
- Authority
- CN
- China
- Prior art keywords
- pad
- pcb board
- luminescence chip
- circuit layer
- highly dense
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012101164550A CN102691981B (zh) | 2012-04-19 | 2012-04-19 | 一种高密集成封装rgb模组及制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012101164550A CN102691981B (zh) | 2012-04-19 | 2012-04-19 | 一种高密集成封装rgb模组及制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102691981A true CN102691981A (zh) | 2012-09-26 |
CN102691981B CN102691981B (zh) | 2013-10-30 |
Family
ID=46857610
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2012101164550A Active CN102691981B (zh) | 2012-04-19 | 2012-04-19 | 一种高密集成封装rgb模组及制作方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102691981B (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103065561A (zh) * | 2013-01-11 | 2013-04-24 | 林谊 | 一种led显示屏显示单元及其自动化生产方法 |
CN103346151A (zh) * | 2013-06-14 | 2013-10-09 | 合肥瑞华电子科技有限责任公司 | 组合型led灯珠的封装结构 |
CN106710458A (zh) * | 2016-12-21 | 2017-05-24 | 长沙信元电子科技有限公司 | 一种散热型led显示单元 |
CN106847803A (zh) * | 2017-03-28 | 2017-06-13 | 山东晶泰星光电科技有限公司 | 一种集成ic的表面贴装式rgb‑led封装模组 |
CN106875858A (zh) * | 2017-04-19 | 2017-06-20 | 黄灿海 | 一种新型led显示屏单元电路板及其制备方法 |
CN108231988A (zh) * | 2018-01-10 | 2018-06-29 | 苏州市悠文电子有限公司 | 超薄型显示板工艺及超薄型显示板 |
CN108282961A (zh) * | 2018-01-23 | 2018-07-13 | 苏州市悠文电子有限公司 | 超薄柔性rgb面板制作工艺 |
CN109272877A (zh) * | 2018-07-31 | 2019-01-25 | 深圳市创显光电有限公司 | 一种高集成度的led显示装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050239227A1 (en) * | 2002-08-30 | 2005-10-27 | Gelcore, Llc | Light emitting diode component |
CN101069292A (zh) * | 2005-06-24 | 2007-11-07 | Lg伊诺特有限公司 | 发光器件封装及发光器件封装的制造方法 |
CN201885000U (zh) * | 2010-11-19 | 2011-06-29 | 方彧 | 一种led日光灯管 |
-
2012
- 2012-04-19 CN CN2012101164550A patent/CN102691981B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050239227A1 (en) * | 2002-08-30 | 2005-10-27 | Gelcore, Llc | Light emitting diode component |
CN101069292A (zh) * | 2005-06-24 | 2007-11-07 | Lg伊诺特有限公司 | 发光器件封装及发光器件封装的制造方法 |
CN201885000U (zh) * | 2010-11-19 | 2011-06-29 | 方彧 | 一种led日光灯管 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103065561A (zh) * | 2013-01-11 | 2013-04-24 | 林谊 | 一种led显示屏显示单元及其自动化生产方法 |
CN103346151A (zh) * | 2013-06-14 | 2013-10-09 | 合肥瑞华电子科技有限责任公司 | 组合型led灯珠的封装结构 |
CN103346151B (zh) * | 2013-06-14 | 2017-03-01 | 合肥瑞华电子科技有限责任公司 | 组合型led灯珠的封装结构 |
CN106710458A (zh) * | 2016-12-21 | 2017-05-24 | 长沙信元电子科技有限公司 | 一种散热型led显示单元 |
CN106847803A (zh) * | 2017-03-28 | 2017-06-13 | 山东晶泰星光电科技有限公司 | 一种集成ic的表面贴装式rgb‑led封装模组 |
CN106847803B (zh) * | 2017-03-28 | 2023-09-15 | 山东捷润弘光电科技有限公司 | 一种集成ic的表面贴装式rgb-led封装模组 |
CN106875858A (zh) * | 2017-04-19 | 2017-06-20 | 黄灿海 | 一种新型led显示屏单元电路板及其制备方法 |
CN108231988A (zh) * | 2018-01-10 | 2018-06-29 | 苏州市悠文电子有限公司 | 超薄型显示板工艺及超薄型显示板 |
CN108282961A (zh) * | 2018-01-23 | 2018-07-13 | 苏州市悠文电子有限公司 | 超薄柔性rgb面板制作工艺 |
CN109272877A (zh) * | 2018-07-31 | 2019-01-25 | 深圳市创显光电有限公司 | 一种高集成度的led显示装置 |
Also Published As
Publication number | Publication date |
---|---|
CN102691981B (zh) | 2013-10-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102691981B (zh) | 一种高密集成封装rgb模组及制作方法 | |
CN102593336B (zh) | 发光器件封装件及其制造方法 | |
US7217005B2 (en) | Light emitting diode lamp module | |
US20110248289A1 (en) | Light emitting diode package, lighting device and light emitting diode package substrate | |
US8421174B2 (en) | Light emitting diode package structure | |
TW201515279A (zh) | 發光二極體組件及製作方法 | |
JP2006294804A (ja) | 発光ダイオード | |
CN102214651A (zh) | 一种led像素单元器件结构及其制备方法 | |
US8084777B2 (en) | Light emitting diode source with protective barrier | |
US20100084683A1 (en) | Light emitting diode package and fabricating method thereof | |
CN102723423B (zh) | 大功率白光led器件无金线双面出光的封装方法及封装结构 | |
CN102881812B (zh) | 发光二极管封装结构的制造方法 | |
US7985001B2 (en) | LED light fixture and method for manufacturing the same | |
US20120211785A1 (en) | High power plastic leaded chip carrier with integrated metal reflector cup and direct heat sink | |
CN202660269U (zh) | 一种高密集成封装rgb模组 | |
KR101775428B1 (ko) | 발광 소자 패키지 및 그 제조 방법 | |
KR20140121507A (ko) | 플래시용 led 모듈 및 그 제조방법 | |
JP2009283988A (ja) | 発光ダイオード | |
CN203812913U (zh) | 一种led封装结构 | |
CN102931296B (zh) | 一种smd发光二极管的封装夹具组件及封装方法 | |
CN103904204A (zh) | 发光二极管灯条 | |
CN202678310U (zh) | 基于cob技术封装的大功率led集成阵列照明光源 | |
CN102829369B (zh) | 发光二极管灯条及其制造方法 | |
CN206992109U (zh) | 一种户外大间距led器件及led显示屏 | |
CN203150540U (zh) | 发光二极管封装结构 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: High density integrated package RGB module and manufacturing method thereof Effective date of registration: 20220111 Granted publication date: 20131030 Pledgee: Yiwu Branch of China Construction Bank Co.,Ltd. Pledgor: ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022330000050 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230720 Granted publication date: 20131030 Pledgee: Yiwu Branch of China Construction Bank Co.,Ltd. Pledgor: ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022330000050 |