JP5629135B2 - フレキシブル基板モジュール - Google Patents

フレキシブル基板モジュール Download PDF

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Publication number
JP5629135B2
JP5629135B2 JP2010135694A JP2010135694A JP5629135B2 JP 5629135 B2 JP5629135 B2 JP 5629135B2 JP 2010135694 A JP2010135694 A JP 2010135694A JP 2010135694 A JP2010135694 A JP 2010135694A JP 5629135 B2 JP5629135 B2 JP 5629135B2
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JP
Japan
Prior art keywords
layer
heat
printed wiring
flexible
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010135694A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012004195A (ja
Inventor
良啓 赤羽
良啓 赤羽
松原　秀樹
秀樹 松原
齊藤　裕久
裕久 齊藤
裕之 松村
裕之 松村
和宏 鬼頭
和宏 鬼頭
浩 奥山
浩 奥山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Original Assignee
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd, Sumitomo Electric Printed Circuits Inc filed Critical Sumitomo Electric Industries Ltd
Priority to JP2010135694A priority Critical patent/JP5629135B2/ja
Priority to CN201180019703.3A priority patent/CN102893707B/zh
Priority to PCT/JP2011/063035 priority patent/WO2011158697A1/ja
Priority to TW100120331A priority patent/TWI482536B/zh
Publication of JP2012004195A publication Critical patent/JP2012004195A/ja
Application granted granted Critical
Publication of JP5629135B2 publication Critical patent/JP5629135B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
JP2010135694A 2010-06-15 2010-06-15 フレキシブル基板モジュール Active JP5629135B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010135694A JP5629135B2 (ja) 2010-06-15 2010-06-15 フレキシブル基板モジュール
CN201180019703.3A CN102893707B (zh) 2010-06-15 2011-06-07 挠性基板模块
PCT/JP2011/063035 WO2011158697A1 (ja) 2010-06-15 2011-06-07 フレキシブル基板モジュール
TW100120331A TWI482536B (zh) 2010-06-15 2011-06-10 Flexible substrate module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010135694A JP5629135B2 (ja) 2010-06-15 2010-06-15 フレキシブル基板モジュール

Publications (2)

Publication Number Publication Date
JP2012004195A JP2012004195A (ja) 2012-01-05
JP5629135B2 true JP5629135B2 (ja) 2014-11-19

Family

ID=45348102

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010135694A Active JP5629135B2 (ja) 2010-06-15 2010-06-15 フレキシブル基板モジュール

Country Status (4)

Country Link
JP (1) JP5629135B2 (zh)
CN (1) CN102893707B (zh)
TW (1) TWI482536B (zh)
WO (1) WO2011158697A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6259576B2 (ja) * 2013-03-05 2018-01-10 株式会社小糸製作所 光源ユニット及び車両用灯具
JP6528503B2 (ja) * 2015-03-30 2019-06-12 大日本印刷株式会社 Ｌｅｄバックライト及びそれを用いたｌｅｄ表示装置
JP7297431B2 (ja) * 2018-12-11 2023-06-26 株式会社小糸製作所 回路基板及び車両用灯具
JP2020205206A (ja) * 2019-06-19 2020-12-24 株式会社小糸製作所 灯具ユニット
JP2020205207A (ja) * 2019-06-19 2020-12-24 株式会社小糸製作所 灯具ユニット

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19909399C1 (de) * 1999-03-04 2001-01-04 Osram Opto Semiconductors Gmbh Flexibles LED-Mehrfachmodul, insb. für ein Leuchtengehäuse eines Kraftfahrzeuges
JP2002184209A (ja) * 2000-12-19 2002-06-28 Matsushita Electric Ind Co Ltd 照明装置
JP2003086747A (ja) * 2001-09-10 2003-03-20 Hitachi Ltd 絶縁回路基板とその製法およびそれを用いた半導体パワー素子
WO2007139195A1 (ja) * 2006-05-31 2007-12-06 Denki Kagaku Kogyo Kabushiki Kaisha Ｌｅｄ光源ユニット
JP5279225B2 (ja) * 2007-09-25 2013-09-04 三洋電機株式会社 発光モジュールおよびその製造方法
JP5154387B2 (ja) * 2008-12-01 2013-02-27 日本発條株式会社 プリント配線板及びその製造方法、プリント配線板半製品連鎖体

Also Published As

Publication number Publication date
TWI482536B (zh) 2015-04-21
CN102893707A (zh) 2013-01-23
CN102893707B (zh) 2016-02-03
WO2011158697A1 (ja) 2011-12-22
TW201223350A (en) 2012-06-01
JP2012004195A (ja) 2012-01-05

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