201223350 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種可撓性基板模組，更詳細而言，係 關於搭載熱源之可撓性基板模組。 【先前技術】 以往’在使用例如發光二極體構成照明單元之情形， 使用可撓性基板，在其印刷配線層使發光二極體集成化， 藉此可容易增加光量。又，藉由使用可撓性基板，具有能 容易構成三維立體化之優點。 在曰本特開2002- 184209號公報（專利文獻丨）揭示有 在可撓性基板上搭載有複數個發光二極體之照明裝置。 專利文獻1 :日本特開2002 — 1 84209號公報 【發明内容】 然而，上述專利文獻1 .纪載之^照明裝置之情形，在集 成化搭載有發光二極體之可撓性基板，一般而言上述發光 極體不耐熱，若pn接合部之溫度超過例如13代，會引 起亮度降低或壽命縮短之問題。尤其是，在最近之高亮度 .之It形，如何解決散熱之問題成為报大的課題。 在專利文獻i揭示，作為搭載發光二極體之可撓性基 =之構造’為了獲得熱傳導性，以由包含金屬層(由例如銅 私構成）或石墨層之多層基板構成為佳，但僅不過是抽象之 教不’終究沒有具體性。 201223350 在 如上述，僅將搭載LED等發光熱源之可撓性基板安裝 照明裝置等之筐體’散熱作用容易變得不充分。藉由使 用可撓性基板，具有能容易構成三維立體化之優點之原因 在於在將發光熱源一次構裝在可撓性基板後將可撓性基 板彎曲並安裝在筐體，但配合複雜之筐體形狀對可撓性基 板加壓並黏貼並不容易，尤其是緊鄰led等發光熱源之下 方及其附近幾乎不能有任何壓力施加，因此在接著時空氣 層容易介於與筐體之間，亦具有更不易謀求散熱性之提升 之問題。另一方面，將可撓性基板以加壓黏貼於筐體後黏 貼發光熱源’ & 了如上述合複雜之M體形狀黏貼可挽性 基板並不容易之問題之外，在發光熱源之配置不是水平之 情形，由於焊料炼融時發光熱源、#脫落因_由焊料回焊 之步驟進行發光熱源之構裝並不容易，變成逐—以徒手作 業進行發光熱源之焊料構裝，會有無法發揮可撓性基板之 優點之問題。如上述’在必須充分確保散熱性之情形，大 多被迫使用金屬PCB(印刷基板）。 此外，上述說明中，以由發光二極體構成之發光熱源 作為熱源為例進行制，但必須冷卻之熱源除了發光熱源 以外亦有多種’可舉出例如cpu、Mpu(微處理器）、功率電 晶體、雷射二極體等發熱量大之電氣元件、元件類。近年 來’隨著此等熱源之發熱量之增加，其散熱技術成為大的 課題之點與上述發光二極體之情形相同。 因此，本發明解決上述習知技術之問題點，其課題在 於提供-種使用可撓性基板、且對欲搭載之熱源之散熱性 4 201223350 充分優異且柔軟性、集成性亦充分優異之可撓性基板模組。 為了解決上述課題，本發明第1特徵之可撓性基板模 組’係形成印刷配線層以作為積層在可撓性絕緣基材表面 側之表面層’並於該印刷配線層搭載熱源，其特徵在於： 在對作為安裝對象之筐體以面接觸方式安裝者中，作為積 層在該可撓性絕緣基材背面側之背面層，係將用以助長從 該熱源傳導至印刷配線層之熱點面積朝作為該安裝對象之 筐體擴大之高熱傳導材構成的熱擴散助長層積層複數層。 又，本發明第2特徵之可撓性基板模組，除了上述第1 特徵之外，熱擴散助長層至少具備作為該背面層中之最上 位層而緊接著可撓性絕緣基材背面直接貼合之熱擴散助長 層、及作為該背面層之中之最下位層而對該筐體面接觸之 由高熱傳導性金屬片構成之熱擴散助長層。 又本务明第3特徵之可換性基板模組，除了上述第2 特徵之外，以作為該背面層之最上位層之熱擴散助長層與 談可撓性絕緣基材與漆印刷..配線層.構成可撓.性印刷配線 板，對該可撓性印刷配線板搭載複數個熱源，且分別對應 熱源之一個或每複數個分割配置有該高熱傳導性金羼片。 又本發明第4特徵之可挽性基板模組，除了上述第2 特徵之外，以作為該背面層之最上位層之熱擴散助長層與 該可撓性絕緣基材與該印刷配線層構成可撓性印刷配線 板，於該可撓性印刷配線板之印刷配線層搭載複數個熱 源且在可撓性印刷配線板之背面整體共通配置有可彎曲 之高熱傳導性金屬片（以一片高熱傳導性金屬片配置在可撓 201223350 性印刷配線板之背面整體）。 又，本發明第5特徵之可撓性基板模組，除了上述第i 至第4之任一特徵之外，筐體為照明單元之筐體。 根據上述第1特徵之可撓性基板模組’使用可撓性基 板將熱源搭載於此，藉此可提供熱源之集成性與立體之安 裝柔軟性優異之模組。尤其是，積層有複數層熱擴散助長 層以作為積層在可撓性絕緣基材之背面側之背面層，該熱 擴散助長層係由用以助長從該熱源傳導至印刷配線層之熱 點之面積朝向該安裝對象之筐體擴大之高熱傳導材構成Y 藉此，由於存在熱擴散助長層因此可發揮充分良好之散熱 性’可良好地維持熱源之性能或壽命。 根據上述第2特徵之可撓性基板模組，除了上述第i 特徵之作用效果之外，藉由緊接著可撓性絕緣基材背面直 接貼合以作為該背面層之中之最上位層之熱擴散助長層， 能使從熱源傳導至印刷配線層之熱點透過可撓性基材快速 地傳導至可撓性基材之背面層。接著，能助長傳導至可撓 性基材之背面層之熱點之面積朝向下方擴大。此外，藉由 對該值體面接觸以作為該背面層之中之最下位層之由』熱 傳導性金屬片構成之熱擴散助長層’能進一步助長熱點之 面積朝向下方擴大成#近於與筐體之面接觸面積。亦即， 月b使從熱源傳導之熱點快速擴大成接近於與筐體之面接觸 面積之狀態並同時傳導至筐體。其結果，能使從熱源傳導 至印刷配線層之熱以大面積更高效率順利傳導至筐體，可 謀求良好之散熱。 201223350 此外，上述第2特徵中，油而_ — Τ …而s之，由於以金屬片構 成與筐體面接觸之可撓性基板模組之最下I，因此在將可 挽性基板模組以面接觸方式安裝於筐體時，容易使兩者密 合，因此即使不對兩者間施加大 产 X的壓力，亦可充分防止空 虱層之存在。藉此，可消除空氣層 孔層之存在以確保良好之散 熱性。 根據上述第3特徵之可撓性其 仇f生暴板模組，除了上述第2 特徵之作用效果之外，.對槔哉 釘搭載有複數個熱源之可撓性印刷 配線板，就該熱源之一個至福叙 _ 複數個分別對應地分割配置該 高熱傳導性金屬片，因此即使 同熱傳導性金屬片之厚 度，在分割後之if)熱傳導性金屬Η夕女Μ 隹屬片之各間隙，亦可接著使 可撓性基板模組柔軟地彎曲 W曲。因此，能容易構成熱源之立 體配置。此外，由於能使离刼 交回熱傳導性金屬片之厚度變厚， 因此能助長熱源之熱點之面 心曲積朝向下方更順利地擴大，能 更接近於與筐體之面接觸面 面積。因此’能夠有效提升散熱 效率。 根據上述第4特徵之i α # 了撓性基板模組，除了上述第2 特徵之作用效果之外，在杈 #格載有複數個熱源之可撓性印刷 配線板之背面整體共通配署7 _ 、配置可彎曲之高熱傳導性金屬片， 因此藉由使用饒富彎曲性夕古& & * 之円熱傳導性金屬片，可提供在 該金屬片之厚度不會變稂 ，專即可保有整體之良好散熱性與 考曲柔軟性、容易將複數袖 默個熱源立體配置之可撓性基板模 組。 組，除了上述第1 根據上述帛5特以Μ性基板模 201223350 至第4之任—構成之作用效果之外，由於筐體為照明單元 之筐體，因此配合照明單元之值體之立體構造能將可挽 性基板單it柔軟地彎曲安裝，且使從熱源產生之熱快速散 熱以良好地維持照明單元之性能或壽命。 根據本發明之可撓性基板模組，可提供對搭載之熱源 確保良好之政熱性且亦確保良好之柔軟性之可撓性基板模 組。 【實施方式】 以下，參照圖式說明本發明之可撓性基板模組之實施 形態以理解本發明。然而，以下之說明為本發明之實施形 態，並未限定申請專利範圍記載之内容。 首先’參照圖1說明本發明之實施形態之可撓性基板 模組。 實施形態之可撓性基板模組1係以面接觸方式安裝於 安裝對象之筐體κ之模組。 作為積層在可撓性絕緣基材11之表面側之表面層，隔 著接著層a形成印刷配線層12。在此印刷配線層12之既定 女裝位置透過焊料1 3搭載發光熱源14。上述印刷配線層 12係隔著接著層a被覆蓋膜15被覆。此外，接著層&，在 其接著時使用與可撓性絕緣基材u或覆蓋膜15相同之材 質時’由於與可撓性絕緣基材u或覆蓋膜15成為一體， 因此其結果’為接著層a不存在之狀態亦可。 上述可撓性絕緣基材11係使用聚醯亞胺或聚酯等具有 201223350 柔軟性之絕緣性樹脂膜。其厚度可為例如25以m等、數十 微米之等級。 上述印刷配線層12能使用在上述可撓性絕緣基材u 隔著接著層a黏貼有銅箔者，從該銅箔形成配線圖案來構 成。印刷配線層12之厚度為18# m或35以m等、使用一般 可撓性印刷配線板所使用之厚度較易使用，但其厚度並不 限於此。 上述焊料13能使用由例如sn、Ag、Cu等之合金構成 之一般無鉛焊料或含鉛焊料。作為焊料丨3，較佳為，就散 熱性之觀點熱傳導性良好者、或就壽命或劣化之觀誠耐 久性良好者。 上述發光熱源14具體而言為各種LED。當然，只要以 發光為目的’則伴隨熱而產生者亦為此發光熱源Μ之範疇。 作為上述覆蓋膜15,為一般使用之覆蓋膜材料即可， 除了上述聚醯亞胺或聚醋之外，㈣玻璃環氧等材料。本 實施形態中使用聚醯亞胺。其厚度在聚醢亞胺之情形，可 為例如12’5 # m或25 // m等、—般可撓性印刷配線板所使 用之厚度H若使用白覆蓋膜，則外觀較佳且反射率 亦提升，因此能有效利用來自LED等之發光熱源14之散射 光’對照明或背光等之照明單元較佳。 上述接著層a可使用由例如熱硬化型之丙稀酸樹脂或 環氧樹脂構成之接著劑。由於制於與印刷配線層Μ之接 著，因此為絕緣性接著劑。其厚度可為例# 2一等、一 般可撓性印刷配線板所㈣之厚度。作為接著層&，為一般 201223350 之環氧樹脂或丙烯酸樹脂亦可，為適於紫外線用途之石夕氧 系亦可。又，以熱熔型之樹脂、例如聚醯亞胺樹脂進 層壓來使用亦可。 〜 作為積層在可撓性絕緣基材u之背面側之f面層 層有複數層熱擴散助長層21，23。 上述熱擴散助長層21，23具有助長從上述發光熱源14 透過焊料13傳導至印刷配線層12之熱點(溫度較周圍高之 區域）之面積朝向下方擴大之功能。 從上述發光熱源14透過焊料13傳導至印刷配線層a 之熱點相當於焊料13下面之面積。焊料13下面之面積， 相較於上述筐體K與上述可撓性絕緣基材U之背面層之最 下位層之面接觸面積可說是非常小4此小面積之1點幾 乎不擴大即到達筐體K日夺’透過筐體κ之散 無法較佳地使發光熱源14及其周圍之可撓性基板模组i之 溫度降低。藉由使熱點料㈣κ之時點之熱點之面積更 接近可撓性絕緣基材"之背面層之最下位層與箧體〖之面 接觸面積，能最大限提升透_ Κ之散熱性此為本發 明人進行各種實驗與反覆思考之結果所得知之事實。具有 使熱點之面積快速擴大之功能者即熱擴散助長層η ”。 上述熱擴散助長層21，作為積層在可撓性絕緣基材u ί背面側之背面層之中之最上位層，係隔著接著層b緊接 著可撓性絕緣基材11背面直接貼合。 熱擴散助長層2卜係以熱點之面積之增加為目的，可 設為㈣。但即使是銅箱，亦與作為習知可撓性印刷配線 10 201223350 板之基板使用之兩面鋼基板大幅不同。習知兩面銅基板， 主要目的在於在表面背面之鋼fi皆形成配線層，是以銅猪 之厚度適於製作印刷配線非常薄。亦即，習知印刷配線板 之銅基板n之厚度再厚亦為35 ^ m程度以下。相對於 此本發明中，銅箱之厚度之功能在於使熱點之熱擴散，201223350 6. EMBODIMENT OF THE INVENTION: TECHNICAL FIELD The present invention relates to a flexible substrate module, and more particularly to a flexible substrate module in which a heat source is mounted. [Prior Art] Conventionally, in the case where an illumination unit is formed using, for example, a light-emitting diode, a flexible substrate is used, and a light-emitting diode is integrated in the printed wiring layer, whereby the amount of light can be easily increased. Further, by using a flexible substrate, it is advantageous in that it can easily form a three-dimensional shape. An illumination device in which a plurality of light-emitting diodes are mounted on a flexible substrate is disclosed in Japanese Laid-Open Patent Publication No. 2002-184209 (Patent Document No.). [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. 2002-84209. SUMMARY OF THE INVENTION However, in the case of the illumination device of the above-mentioned Patent Document 1, the flexible substrate on which the light-emitting diode is mounted is integrated. The above-mentioned light-emitting electrode body is not heat-resistant, and if the temperature of the pn junction portion exceeds, for example, 13 generations, there is a problem that the brightness is lowered or the life is shortened. In particular, in the recent high-intensity It shape, how to solve the problem of heat dissipation has become a major issue. In the patent document i, it is preferable that the structure of the flexible base on which the light-emitting diode is mounted is preferably composed of a multilayer substrate including a metal layer (made of, for example, copper) or a graphite layer in order to obtain thermal conductivity. However, the teaching of abstraction is not concrete after all. As described above, the heat dissipation effect of the casing such as the illuminating device mounted on the flexible substrate on which the illuminating heat source such as the LED is mounted is not sufficient. The advantage of being able to easily form a three-dimensional three-dimensional shape by using a flexible substrate is that the flexible substrate is bent and attached to the casing after the light-emitting heat source is once mounted on the flexible substrate, but the complicated basket is incorporated. The shape of the body is not easy to press and stick the flexible substrate. In particular, there is almost no pressure application under and near the light-emitting heat source such as led, so that the air layer is easily interposed between the housing and the casing. It has a problem that it is harder to seek heat dissipation. On the other hand, the flexible substrate is adhered to the casing after being pressure-bonded to the casing, and the light-emitting heat source is attached to the illuminating heat source in addition to the problem that the complicated M-shaped shape is adhered to the splicable substrate. It is not a horizontal situation. Since the illuminating heat source during the refining of the solder, the detachment due to the solder reflow process, the illuminating heat source is not easy to assemble, and it becomes impossible to carry out the soldering of the illuminating heat source by hand. The problem of the advantages of the flexible substrate is exerted. As described above, in the case where heat dissipation must be sufficiently ensured, a metal PCB (printed substrate) is often used. Further, in the above description, a light-emitting heat source composed of a light-emitting diode is used as a heat source, but a heat source that must be cooled may have various types in addition to the light-emitting heat source, such as cpu, Mpu (microprocessor), and power. Electrical components and components such as transistors and laser diodes that generate large amounts of heat. In recent years, as the heat generation of these heat sources has increased, the heat dissipation technology has become a big problem in the same manner as the above-described light-emitting diodes. Therefore, the present invention solves the problems of the above-described conventional technology, and it is an object of the present invention to provide a flexible substrate which is excellent in heat dissipation property 4 201223350 for a heat source to be mounted, and which is excellent in flexibility and integration. Substrate module. In order to solve the problem, the flexible substrate module of the first aspect of the present invention is characterized in that a printed wiring layer is formed as a surface layer on the surface side of the flexible insulating substrate, and a heat source is mounted on the printed wiring layer. In the case where the casing to be mounted is mounted in a surface contact manner, the back surface layer laminated on the back side of the flexible insulating substrate serves to promote the hot spot area from the heat source to the printed wiring layer. A plurality of thermal diffusion-promoting laminated layers formed of a high heat conductive material expanded as a casing to be mounted. Further, in the flexible substrate module according to the second aspect of the present invention, in addition to the first feature, the thermal diffusion promoting layer has at least the uppermost layer of the back surface layer and is directly attached to the back surface of the flexible insulating substrate. The thermal diffusion promoting layer and the thermal diffusion promoting layer composed of a highly thermally conductive metal sheet which is in contact with the surface of the casing as the lowermost layer of the back surface layer. In addition to the above second feature, the replaceable substrate module of the third feature of the present invention is used as a thermal diffusion promoting layer of the uppermost layer of the back layer and a flexible insulating substrate and lacquer printing.. The wiring layer constitutes a flexible printed wiring board, and a plurality of heat sources are mounted on the flexible printed wiring board, and the high thermal conductivity gold foil is disposed corresponding to one or a plurality of heat sources. Further, in addition to the second feature, the flexible substrate module according to the fourth aspect of the present invention comprises the thermal diffusion promoting layer which is the uppermost layer of the back surface layer, the flexible insulating substrate, and the printed wiring layer. In the flexible printed wiring board, a plurality of heat sources are mounted on the printed wiring layer of the flexible printed wiring board, and a flexible high-heat-conducting metal piece is disposed in common on the back surface of the flexible printed wiring board (a high heat conduction is performed) The metal sheet is placed on the back of the flexible 201223350 printed wiring board. Further, in the flexible substrate module according to the fifth aspect of the present invention, in addition to any of the above-described first to fourth features, the casing is a casing of the illumination unit. The flexible substrate module ’ according to the first feature described above is provided with a heat source by using a flexible substrate, thereby providing a module excellent in integration of heat source and excellent in stereoscopic mounting flexibility. In particular, a plurality of layers of thermal diffusion promoting layers are laminated to form a back layer on the back side of the flexible insulating substrate, the thermal diffusion promoting layer being used to promote the area of the hot spot that is conducted from the heat source to the printed wiring layer. The high heat conductive material which is enlarged toward the casing to be mounted constitutes Y, whereby the heat diffusion promoting layer is present, so that sufficient heat dissipation performance can be exhibited, and the performance or life of the heat source can be favorably maintained. The flexible substrate module according to the second aspect described above is directly bonded to the back surface of the flexible insulating substrate as the uppermost layer among the back surface layers in addition to the effect of the i-th feature described above. The thermal diffusion promoting layer enables the hot spot conducted from the heat source to the printed wiring layer to be quickly conducted through the flexible substrate to the back layer of the flexible substrate. Then, the area of the hot spot that can contribute to the back layer of the flexible substrate is expanded downward. In addition, the thermal diffusion promoting layer formed of the "thermally conductive metal sheet" which is the lowermost layer among the back surface layers by the surface contact can further promote the area of the hot spot to be expanded downward to become close to the housing. The contact area of the surface. That is, the month b rapidly expands the hot spot conducted from the heat source to a state close to the surface contact area with the casing and simultaneously conducts to the casing. As a result, the heat transmitted from the heat source to the printed wiring layer can be smoothly conducted to the casing with a large area and higher efficiency, and good heat dissipation can be achieved. 201223350 In addition, in the second feature described above, the oil is _ Τ 而 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 When the surface contact method is attached to the casing, the two are easily adhered to each other. Therefore, even if a pressure of a large X is applied between the two, the presence of the void layer can be sufficiently prevented. Thereby, the presence of the pore layer of the air layer can be eliminated to ensure good heat dissipation. According to the third aspect of the present invention, in addition to the effect of the second feature described above, the flexible printed wiring board in which a plurality of heat sources are mounted on the nail is used as the heat source. The one of the high-heat-conducting metal sheets is divided and arranged in a plurality of places, so even if the thickness of the thermally conductive metal sheet is the same as the gap of the if) thermally conductive metal Η Μ 隹 隹 片The flexible substrate module can then be flexibly bent to W. Therefore, the stereo configuration of the heat source can be easily constructed. Further, since the thickness of the thermally conductive metal piece can be made thicker, the surface of the hot spot of the heat source can be more smoothly expanded downward, and the surface area of the contact surface with the casing can be made closer. Therefore, it can effectively improve the heat dissipation efficiency. According to the fourth aspect of the present invention, the flexible substrate module has a function of the second feature described above, and the entire back surface of the flexible printed wiring board having a plurality of heat sources is provided in the 杈# grid. _ , configured with a bendable high thermal conductivity metal sheet, so by using the 円 弯曲 性 & & & & & & * 円 円 円 円 円 & & & & & & & & & & & & & & & & & & & & & 円 円 円A flexible substrate module that maintains a good overall heat dissipation and softness of the test, and is easy to stereoscopically arrange a plurality of heat sources. In addition to the above-described first aspect, in addition to the above-described effect of the configuration of the 帛5 Μ 基板 基板 2012 201223350 to the fourth one, since the casing is the casing of the illumination unit, the three-dimensional structure of the value body of the illumination unit is matched. The flexible substrate can be flexibly mounted and the heat generated from the heat source can be quickly dissipated to maintain the performance or life of the lighting unit well. According to the flexible substrate module of the present invention, it is possible to provide a flexible substrate module which ensures good thermal compatibility with the heat source to be mounted and also ensures good flexibility. [Embodiment] Hereinafter, embodiments of the flexible substrate module of the present invention will be described with reference to the drawings to understand the present invention. However, the following description is of an embodiment of the invention and is not intended to limit the scope of the claims. First, a flexible substrate module according to an embodiment of the present invention will be described with reference to Fig. 1 . The flexible substrate module 1 of the embodiment is mounted on the module of the casing κ to be mounted in a surface contact manner. As the surface layer laminated on the surface side of the flexible insulating base material 11, the printed wiring layer 12 is formed via the adhesive layer a. At this predetermined position of the printed wiring layer 12, the luminescent heat source 14 is mounted through the solder 13. The printed wiring layer 12 is covered with the cover film 15 via the adhesive layer a. Further, when the next layer & is the same material as the flexible insulating substrate u or the cover film 15, the result is 'because it is integrated with the flexible insulating substrate u or the cover film 15, so the result is ' It is also possible that the layer a does not exist. As the flexible insulating base material 11, an insulating resin film having flexibility of 201223350 such as polyimide or polyester is used. The thickness may be, for example, 25 or more in the order of tens of micrometers. The printed wiring layer 12 can be formed by forming a wiring pattern from the copper foil by bonding a copper foil to the flexible insulating substrate u via the adhesive layer a. The thickness of the printed wiring layer 12 is 18#m or 35, and the thickness of the conventional flexible printed wiring board is relatively easy to use, but the thickness is not limited thereto. As the above-mentioned solder 13, a general lead-free solder or a lead-containing solder composed of an alloy such as Sn, Ag, Cu or the like can be used. As the solder crucible 3, it is preferable that the thermal conductivity is good from the viewpoint of heat dissipation, or that the lifetime or deterioration is good. The above-described illuminating heat source 14 is specifically a variety of LEDs. Of course, as long as the purpose of illuminating is accompanied by heat, it is also a category of illuminating heat sources. The cover film 15 may be a cover film material generally used, and may be a material such as glass epoxy or the like in addition to the above-mentioned polyimide or polyester. In the present embodiment, polyimine is used. The thickness of the polyimide may be, for example, 12'5 #m or 25 // m, etc., the thickness H used for the flexible printed wiring board. If a white cover film is used, the appearance is better and the reflection is good. Since the rate is also increased, it is possible to effectively utilize the scattered light from the illuminating heat source 14 such as an LED, which is preferable for an illumination unit such as illumination or backlight. As the above-mentioned adhesive layer a, an adhesive composed of, for example, a thermosetting type acrylic resin or an epoxy resin can be used. It is an insulating adhesive because it is bonded to the printed wiring layer. The thickness can be the thickness of (4) of the general flexible printed wiring board of Example #2. The adhesive layer or the like may be an epoxy resin or an acrylic resin of 201223350 in general, and may be an anthracene oxide suitable for ultraviolet use. Further, it may be used by laminating a hot-melt type resin such as a polyimide resin. ~ As the f-layer layer laminated on the back side of the flexible insulating substrate u, there are a plurality of layers of thermal diffusion promoting layers 21, 23. The thermal diffusion promoting layers 21, 23 have a function of promoting an area in which the area of the hot spot (the region where the temperature is higher than the surrounding area) which is transmitted from the above-mentioned luminescent heat source 14 through the solder 13 to the printed wiring layer 12 is expanded downward. The hot spot that is conducted from the above-described luminescent heat source 14 through the solder 13 to the printed wiring layer a corresponds to the area under the solder 13. The area under the solder 13 is relatively small compared to the surface contact area of the lowermost layer of the back surface layer of the flexible insulating substrate U, and the first point of the small area is almost enlarged. The housing K is not able to reduce the temperature of the light-emitting heat source 14 and the surrounding flexible substrate module i through the housing κ. By making the hot spot of the hot spot (4) κ point closer to the contact area of the lowermost layer of the back layer of the flexible insulating substrate and the 〖 body, the heat dissipation of the _ Κ can be maximized. The inventors have learned the facts of various experiments and repeated thinking. The thermal diffusion promoting layer η has a function of rapidly expanding the area of the hot spot. The thermal diffusion promoting layer 21 serves as the uppermost layer among the back layers of the back side of the flexible insulating substrate u ί. The bonding layer b is directly bonded to the back surface of the flexible insulating substrate 11. The thermal diffusion promoting layer 2 is intended to be (4) for the purpose of increasing the area of the hot spot. However, even a copper box is known. Flexible printed wiring 10 The two-sided steel substrate used for the substrate of the 201223350 board is greatly different. The conventional two-sided copper substrate is mainly used to form a wiring layer on the steel surface of the back surface, which is suitable for making printed wiring with the thickness of the copper pig. That is, the thickness of the copper substrate n of the conventional printed wiring board is also less than 35 μm. In contrast to the present invention, the function of the thickness of the copper box is to spread the heat of the hot spot.
因此較佳為超過上沭3 s w Λ P ”上疋35以m之厚度。本實施形態中，作為 熱擴散助長層21之銅箱之厚度為7〇"m。 熱擴散助長層21不—定要使用Cu。料以熱擴散為目 的者可使用鋁等之咼熱傳導性金屬。又，可使用天然石 墨或人；5墨等石墨，或使用包含長碳纖維或短碳纖維等 之碳纖維材、其他非金屬高熱傳導性材。 積層在上述可撓性絕緣基材^之背面側之背面層之接 著層b，由於不含上述印刷配線| 12，以不—定要絕緣 吐’反'而亦可使用保有高散熱性之接著劑。作為此種高散 熱性之接著劑，能將銀粉、鋼粉、A1N粉、金剛石粉、ΜΑ 粉、含有_纖料之高散熱填鲁者讀狀或:片狀.來使 用^如’若將短碳纖維與A1N粉混合，則由於續粉埋 :短：：維之間，因此相較於僅短碳纖維之情形可提升填 :=Γ，能進一步提升熱傳導性、散熱特性。當然，、 接者層與接著層a為相同材質亦可。 此外，接著層b，在其接著時使用與可撓性絕 11或覆蓋膜22相同之姑皙拄 , 或露甚膜” 於與可撓性絕緣基材η 狀態亦可。 其'、。果，為接著層b不存在之 201223350 另一方面，上述熱擴散助長層23,作為積層在可撓性 絕緣基材丨1之背面側之背面層之中之最下位層，係對上述 筐體K面接觸之高熱傳導性金屬片。 作為此熱擴散助長層23之高熱傳導性金屬片，可使用 由例如鋁材料構成之片體。當然，除此之外，可使用銅、 銀等之高熱傳導性金屬片。作為上述高熱傳導性金屬另之 具體例，可使用例如純鋁系（A1系）之i 5mm厚度之鋁。當 然，上述鋁之厚度可在例如0.2mm〜 2〇mm之範圍。又，即 使在高熱傳導性金屬片為鋼片之情形，其厚度相對於上述 熱擴散助長層21所使用之銅箔之例如川以爪厚更厚，可在 例如0.3mm〜20mm程度之範圍。 為了將作為熱擴散助長層23之高熱傳導性金屬片以面 接觸狀態安裝於筐體K，可隔著接著層b來接著安裝。此情 形，為了使空氣層不存在於兩者間，較佳為，作為接著劑： 使用熱硬化性之接著劑（接合片），以熱壓將兩者接著。又， 較佳為，兩者之接著在構裝發光熱源14之前進行。 又，作為將作為熱擴散助長層23之高熱傳導性金屬片 與營體K以面接觸狀態安裝之方法，只要兩者彼此為金屬 片且平滑度良好，則螺絲固定之安裝亦可。此情形，視需 要可使加熱油膏或熱傳導片等緩衝材位於兩者間以確保兩 者之密合性。螺絲固定之情形’具有可更換可挽性基板模 組1之優點。 本實施形態中，雖設有熱擴散助長層21，23，但進一步 使層至複數層熱擴散助長層介在設於此.等之間亦可。藉 12 201223350 此，能進-步快速進行熱點之面積之助長。 述…、擴散助長層2 1，在使從發光熱源、14㉟傳導至印 刷配線層12之熱點往有筐體Κ之可撓性絕緣基材11之背 面側快速傳熱之點非常重要。此外，在使熱點之面積朝向 有筐體Κ之下方擴大之點非常重要。 又，上述熱擴散助長層23’在助長使傳熱來之熱點之 面積進一步擴大以傳導至㈣κ之點非常重要。此外，藉 由使熱擴散助長層23為金屬片，藉由壓延等容易製得平坦 面丄在以面接觸方式安裝於筐體κ時，可充分提高兩者間 之密合性。藉此’即使為不易加壓之緊鄰發光熱源14之下 方之位置’，亦可確保在無空氣等介於之間之狀態下之兩者 之密合，可獲得良好之散熱性。 此外，使上述可撓性絕緣基材η、位於其表面側之上 述印，刷配線層12、其上之覆蓋膜15、位於背面側之上述熱 擴散助長層21、覆蓋其之覆蓋膜22、介於其等之間之接著 層a’ b作為‘高散熱性可.撓:性印刷配線.板η而獨立亦可。此 情形’覆蓋上述熱擴散助長層21之覆蓋膜22及將其接合 之接著層b’與表面側之覆蓋膜15及將其接合之接著層& 同樣地’係設為保護銅箔表面免於生鏽。 設上述高散熱性可撓性印刷配線板Η為獨立之構件之 情形’將熱擴散助長層23即高熱傳導性金屬片隔著接著層 b安裝於此高散熱性可撓性印刷配線板Η，或透過焊料13 搭載發光熱源14，藉此構成可撓性基板模組1。接著，此 可撓性基板模組1係隔著接著層b安裝於筐體κ。 13 201223350 本發明中，藉由設置熱擴散助長層21，23大幅改善散 熱特性之原因在於，上述中，助長從發光熱源14熱傳導至 印刷配線層1 2之熱點之面積以傳導至筐體κ。亦即，藉此，Therefore, it is preferable to exceed the upper 沭3 sw Λ P 疋 upper 疋 35 in thickness. In the present embodiment, the thickness of the copper box as the thermal diffusion promoting layer 21 is 7 〇 " m. The thermal diffusion promoting layer 21 is not - It is necessary to use Cu. For the purpose of thermal diffusion, a heat conductive metal such as aluminum can be used. Further, natural graphite or human; graphite such as 5 ink or carbon fiber containing long carbon fiber or short carbon fiber, or the like can be used. a non-metallic high-heat conductive material. The adhesive layer 14 is laminated on the back surface layer of the back surface side of the flexible insulating substrate, and the printed wiring 12 is not included, and the insulating layer may not be insulated. Use an adhesive that retains high heat dissipation. As a high heat-dissipating adhesive, it can read silver powder, steel powder, A1N powder, diamond powder, strontium powder, and high-heat-filled _ fiber-filled materials. If you mix the short carbon fiber with the A1N powder, the continuation of the powder: short:: between the dimensions, so the filling can be improved compared with the case of only the short carbon fiber: Γ, can further improve the thermal conductivity , heat dissipation characteristics. Of course, the connector layer and the subsequent layer a are The same material may be used. Further, the layer b may be used in the same manner as the flexible film 11 or the cover film 22, or in the state of the flexible insulating substrate η. its',. In the case of 201223350 which is not present in the layer b, the thermal diffusion promoting layer 23 is the lowermost layer among the back layers on the back side of the flexible insulating substrate 丨1, and is attached to the above-mentioned housing. High thermal conductivity metal sheet in contact with the K surface. As the highly thermally conductive metal piece of the thermal diffusion promoting layer 23, a sheet made of, for example, an aluminum material can be used. Of course, in addition to this, a highly thermally conductive metal piece such as copper or silver can be used. As another specific example of the above high thermal conductivity metal, for example, aluminum of a pure aluminum type (A1 type) having a thickness of 5 mm can be used. Of course, the thickness of the above aluminum may be in the range of, for example, 0.2 mm to 2 mm. Further, even in the case where the highly thermally conductive metal piece is a steel sheet, the thickness thereof is thicker than the thickness of the copper foil used for the heat diffusion promoting layer 21, for example, in the range of, for example, about 0.3 mm to 20 mm. In order to attach the highly thermally conductive metal piece as the thermal diffusion promoting layer 23 to the casing K in a surface contact state, it can be attached next to the layer b. In this case, in order to prevent the air layer from being present between the two, it is preferable to use a thermosetting adhesive (bonding sheet) as a bonding agent and to heat both of them by hot pressing. Further, preferably, the two are performed before the illuminating heat source 14 is constructed. Further, as a method of attaching the highly thermally conductive metal piece as the thermal diffusion promoting layer 23 to the camping body K in a surface contact state, as long as the two are each a metal piece and the smoothness is good, the screw can be attached thereto. In this case, a cushioning material such as a heating paste or a heat conductive sheet may be placed between the two to ensure the adhesion between the two. The case where the screw is fixed' has the advantage of the replaceable stackable substrate module 1. In the present embodiment, the thermal diffusion promoting layers 21 and 23 are provided. However, the layer to the plurality of layers of the thermal diffusion promoting layer may be interposed therebetween. By 12 201223350, you can quickly advance the area of hotspots. The diffusion promoting layer 2 1 is very important in the point of rapid heat transfer from the hot spot of the light-emitting heat source 1435 to the printed wiring layer 12 to the back side of the flexible insulating substrate 11 having the casing. In addition, it is important to enlarge the area of the hot spot toward the bottom of the casing. Further, it is important that the above-described thermal diffusion promoting layer 23' is further enlarged to promote the area of the hot spot of heat transfer to be transmitted to the (4) κ. Further, by making the thermal diffusion promoting layer 23 a metal piece, it is easy to obtain a flat surface by rolling or the like, and when it is attached to the casing κ in a surface contact manner, the adhesion between the two can be sufficiently improved. Therefore, even if it is a position which is not easily pressurized and is located immediately below the light-emitting heat source 14, it is ensured that the two are in close contact with each other without air or the like, and good heat dissipation can be obtained. Further, the flexible insulating base material η, the printing on the surface side, the brush wiring layer 12, the cover film 15 thereon, the thermal diffusion promoting layer 21 on the back side, the cover film 22 covering the surface, The adhesive layer a'b between them may be independent of the "high heat dissipation property": the printed wiring. In this case, the cover film 22 covering the thermal diffusion promoting layer 21 and the bonding layer b' which is bonded thereto and the cover film 15 on the surface side and the bonding layer and the bonding layer thereof are similarly designed to protect the copper foil surface from Rusted. In the case where the high-heat-dissipating flexible printed wiring board Η is an independent member, the thermal diffusion-promoting layer 23, that is, the highly thermally conductive metal sheet is attached to the highly heat-dissipating flexible printed wiring board via the adhesive layer b. The flexible substrate module 1 is configured by mounting the light-emitting heat source 14 through the solder 13 . Next, the flexible substrate module 1 is attached to the casing κ via the adhesive layer b. 13 201223350 In the present invention, the reason why the heat dissipation characteristics are greatly improved by providing the thermal diffusion promoting layers 21, 23 is that, in the above, the area of the hot spot which is thermally conducted from the luminescent heat source 14 to the printed wiring layer 12 is promoted to be conducted to the casing κ. That is, by this,
通過筐體K之散熱路徑變廣，藉此熱電阻下降，可達成快 速之散熱。 N 在LED等之發光熱源14產生之熱藉由熱傳導往其他構 件擴散，熱傳導率愈高愈容易擴散至較遠。設熱傳導率為 等向性之情形，雖呈同心圓狀擴散，但藉由設置熱擴散助 長層21，2 3，因其南熱傳導率使熱之擴散更順利，在位於下 方之筐體K熱亦傳導至更廣區域。由於到達筐體κ之熱區 域之面積變大，因此可期待來自更大熱面積之散熱，其結 果’促進散熱’達成在發光熱源14附近之溫度降低。 如上述，本發明之可撓性基板模組1中，能使來自發 光熱源14之散熱路徑充分擴大，可減輕施加至發光熱源 14、焊料13、基板之熱負載。 進一步說明以上述高散熱性可撓性印刷配線板Η與發 光熱源14與由高熱傳導性金屬片構成之熱擴散助長層23 構成本發明之可撓性基板模組1之情形。 可對高散熱性可撓性印刷配線板Η搭載一個至複數個 發光熱源14。 此情形’如圖2所示，作為可撓性基板模組1之第1 實施形態’與上述所有發光熱源14對應，可將由一片高熱 傳導性金屬片構成之熱擴散助長層23共通配置在高散熱性 可橈性印刷配線板Η。 201223350 此 士圖3所不，作為可撓性基板模組1之第2實施 形悲’與上述發光熱源14之一個至複數個分別對應，可將 ‘由高熱傳導性金屬片構成之熱擴散助長層23分割配置在高 散熱性可撓性印刷配線板Η。 參照圖2說明可撓性基板模組1之第1實施形態。 首先’準備具備熱擴散助長層21之高散熱性可挽性印 刷配線板Η，在其背面側接合由高熱傳導性金屬片構成之熱 擴政助長層23(A)。接合係如上述藉由使用熱硬化性接著劑 (接合片）之熱壓隔著接著層b進行。 接著’在高散熱性可撓性印刷配線板Η之表面側之印 刷配線| 12將複數個發光熱源丄4分別透過焊料^ 3通過回 焊爐進行表面構裝來一次安裝（B)。藉此，構成可繞性基板 模組1。 將製得之可撓性基板模組丨以面接觸方式安裝於筐體 K(C) 〇 參照圓3說明可撓性基板模組4之第2實施形態。 首先’準備具備熱擴散助長層21之高散熱性可換性印 刷配線板H’在將由高熱傳導性金屬片構成之熱擴散助長層 23分割成複數個之狀態下分別接合、配置於其背面側μ卜 在此情形，分割後狀態之各熱擴散助長層23(高熱傳導性金 屬片）係配置在與分別搭載發光熱源14之一個至複數個之 區域對應之區域。各熱擴散助長層23之接合係如上述藉由 使用熱硬化性接著劑（接合片）之熱壓隔著接著層^進行。 接著’在高散熱性可撓性印刷配線板Η之表面側之印 15 201223350 刷配線層12將複數個發光熱源14分別透過焊料13通過回 焊爐進行表面構裝來一次安裝（B)。圖式上描繪—個熱擴散 助長層2 3 (咼熱傳導性金屬片）與一個發光熱源14對應之狀 態。然而，當然，如上述，一個熱擴散助長層23(高熱傳導 性金屬片）與複數個發光熱源14對應亦可。藉此，構成可換 性基板模組1。 製得之可撓性基板模組1係分割安裝有熱擴散助長層 23(高熱傳導性金屬片），因此例如即使是各熱擴散助長層 23(高熱傳導性金屬片）為不適於彎曲之程度之厚度之情 形’在未安裝熱擴散助長層23之部分容易使高散熱性可撓 性印刷配線板Η彎曲，可成為立體構成。 因此，對立體彎曲構造之筐體K亦可配合其使高散熱 性可撓性印刷配線板Η彎曲，能以面接觸方式將各熱擴散 助長層23(高熱傳導性金屬片）安裝於筐體K(D) 〇亦即，能 使政熱性優異且搭載有複數個發光熱源14之可撓性基板模 組1配合筐體κ之立體形狀而容易彎曲成立體形狀，能以 面接觸狀態安裝於筐體K之表面。 此外’如上述第1實施形態之可撓性基板模組1所示， 即使為將一片共通之熱擴散助長層23(高熱傳導性金屬片） 安裝於高散熱性可撓性印刷配線板H之情形，亦可使此熱 擴散助長層23即高熱傳導性金屬片之材質及片厚為可彎曲 之條件’藉此能使可撓性基板模組1為可彎曲。例如設熱 擴散助長層23即高熱傳導性金屬片為純鋁系之鋁壓延片之 隋形，使厚度為〇 2mm〜0.7mm程度，藉此可製得具有適 201223350 於與值體κ面接觸之平坦度且亦適於追隨筐體κ之立體形 狀之彎曲加工之可撓性基板模組1。 根據本發明之可撓性基板模組，在各種照明單元或使 用该單兀之照明裝置之製造領域中產業利用性高。 【圖式簡單說明】 圖1係說明本發明之可撓性基板模組的剖面圖。 圖2係說明本發明之可撓性基板模組之第1實施形態 的圖（A)、（B)、（C)之左右係分別顯示剖面圖與俯視圖。 f^tl μ ^ " 係說明本發明之可撓性基板模組之第2實施形態 的圖、（B)、（C)、（D)之左右係分別顯示剖面圖與俯視 圖0 【主 要元件符號說明】 1 可撓性基板模組 11 可撓性絕緣基材 12 印刷配線層 13 焊料 14 發光熱源 15 覆蓋膜 21 熱擴散助長層 22 覆蓋膜 23 熱擴散助長層（高熱傳導性金屬片） Η 高散熱性可撓性印刷配線板 17 201223350 κ 筐體 a 接著層 b 接著層 18The heat dissipation path through the casing K is widened, whereby the thermal resistance is lowered, and rapid heat dissipation can be achieved. N The heat generated by the illuminating heat source 14 such as an LED is diffused to other members by heat conduction, and the higher the thermal conductivity, the easier it is to spread farther. In the case where the thermal conductivity is isotropic, although it is concentrically diffused, by providing the thermal diffusion promoting layers 21, 23, the heat diffusion is smoother due to its south thermal conductivity, and the heat in the lower chamber K is It is also transmitted to a wider area. Since the area of the hot zone reaching the casing κ becomes large, heat dissipation from a larger heat area can be expected, and the result of "promoting heat dissipation" achieves a temperature decrease in the vicinity of the light-emitting heat source 14. As described above, in the flexible substrate module 1 of the present invention, the heat dissipation path from the light-emitting heat source 14 can be sufficiently enlarged, and the heat load applied to the light-emitting heat source 14, the solder 13, and the substrate can be reduced. Further, the case where the flexible substrate module 1 of the present invention is constituted by the above-described highly heat-dissipating flexible printed wiring board Η and the light-emitting heat source 14 and the heat-diffusing-promoting layer 23 composed of a highly thermally conductive metal sheet will be described. One to a plurality of light-emitting heat sources 14 can be mounted on the highly heat-dissipating flexible printed wiring board. In this case, as shown in FIG. 2, the first embodiment of the flexible substrate module 1 corresponds to all of the above-described light-emitting heat sources 14, and the thermal diffusion-promoting layer 23 composed of a single highly thermally conductive metal sheet can be disposed in common. Heat-dissipative printed wiring board Η. 201223350 This figure 3 is not the case, and the second embodiment of the flexible substrate module 1 corresponds to one or more of the above-mentioned light-emitting heat sources 14 respectively, and the heat diffusion by the highly thermally conductive metal sheet can be promoted. The layer 23 is divided and arranged in a highly heat-dissipating flexible printed wiring board. A first embodiment of the flexible substrate module 1 will be described with reference to Fig. 2 . First, a high heat dissipation printable wiring board having a thermal diffusion promoting layer 21 is prepared, and a thermal expansion promoting layer 23 (A) composed of a highly thermally conductive metal sheet is joined to the back side. The bonding system is carried out by laminating the bonding layer b by hot pressing using a thermosetting adhesive (bonding sheet) as described above. Then, the printed wirings 12 on the surface side of the highly heat-dissipating flexible printed wiring board 12 are mounted on the surface of the soldering furnace by a plurality of illuminating heat sources 丄 4 through the soldering furnace, respectively (B). Thereby, the splicable substrate module 1 is constructed. The obtained flexible substrate module is mounted on the casing K(C) in a surface contact manner. The second embodiment of the flexible substrate module 4 will be described with reference to the circle 3. First, the high-heat-dissipative printed wiring board H' having the thermal diffusion-promoting layer 21 is joined and arranged on the back side in a state in which the thermal diffusion-promoting layer 23 made of a highly thermally conductive metal sheet is divided into a plurality of layers. In this case, each of the thermal diffusion promoting layers 23 (high thermal conductivity metal sheets) in the divided state is disposed in a region corresponding to one of a plurality of regions in which the light-emitting heat sources 14 are mounted. The bonding of each of the thermal diffusion promoting layers 23 is carried out by thermal pressing using a thermosetting adhesive (bonding sheet) as described above. Next, the printing on the surface side of the highly heat-dissipating flexible printed wiring board 15 201223350 The brush wiring layer 12 is mounted on the surface of each of the plurality of light-emitting heat sources 14 through the solder 13 through the soldering furnace to be mounted once (B). The figure depicts a state in which a thermal diffusion promoting layer 2 3 (a thermally conductive metal piece) corresponds to a luminous heat source 14. However, of course, as described above, one thermal diffusion promoting layer 23 (high thermal conductivity metal sheet) may correspond to a plurality of illuminating heat sources 14. Thereby, the replaceable substrate module 1 is constructed. Since the obtained flexible substrate module 1 is provided with the thermal diffusion promoting layer 23 (high thermal conductivity metal sheet), the thermal diffusion promoting layer 23 (high thermal conductivity metal sheet) is not suitable for bending. In the case of the thickness, the high heat-dissipating flexible printed wiring board is easily bent in a portion where the thermal diffusion promoting layer 23 is not provided, and the three-dimensional structure can be obtained. Therefore, the housing K of the three-dimensionally curved structure can be bent in conjunction with the high-heat-dissipating flexible printed wiring board, and the thermal diffusion-promoting layer 23 (high thermal conductivity metal sheet) can be attached to the housing by surface contact. K(D) 〇 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可The surface of the casing K. In addition, as shown in the flexible substrate module 1 of the above-described first embodiment, even a common thermal diffusion promoting layer 23 (high thermal conductivity metal sheet) is attached to the highly heat-dissipating flexible printed wiring board H. In this case, the material and the sheet thickness of the thermal diffusion promoting layer 23, that is, the highly thermally conductive metal sheet, may be made flexible, whereby the flexible substrate module 1 can be made flexible. For example, the thermal diffusion promoting layer 23, that is, the high thermal conductivity metal sheet is a crucible shape of a pure aluminum-based aluminum rolled sheet, so that the thickness is about mm2 mm to 0.7 mm, thereby making it possible to have a suitable surface contact with the value body at 201223350. The flatness is also suitable for the flexible substrate module 1 that follows the curved shape of the three-dimensional shape of the casing κ. The flexible substrate module according to the present invention is industrially usable in the field of manufacturing various lighting units or lighting devices using the single unit. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a flexible substrate module of the present invention. Fig. 2 is a cross-sectional view and a plan view, respectively, showing the left and right sides of the first embodiment (A), (B), and (C) of the flexible substrate module of the present invention. f^tl μ ^ " The second embodiment of the flexible substrate module of the present invention, and the left and right sides of (B), (C), and (D) of the present invention are respectively shown in a cross-sectional view and a plan view. DESCRIPTION OF SYMBOLS 1 Flexible substrate module 11 Flexible insulating substrate 12 Printed wiring layer 13 Solder 14 Luminous heat source 15 Cover film 21 Thermal diffusion promoting layer 22 Cover film 23 Thermal diffusion promoting layer (high thermal conductivity metal sheet) Η High heat dissipation flexible printed wiring board 17 201223350 κ housing a Next layer b Next layer 18