JP5580631B2 - 硬化性組成物、ダイシング−ダイボンディングテープ、接続構造体及び粘接着剤層付き半導体チップの製造方法 - Google Patents

硬化性組成物、ダイシング−ダイボンディングテープ、接続構造体及び粘接着剤層付き半導体チップの製造方法 Download PDF

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Publication number
JP5580631B2
JP5580631B2 JP2010064279A JP2010064279A JP5580631B2 JP 5580631 B2 JP5580631 B2 JP 5580631B2 JP 2010064279 A JP2010064279 A JP 2010064279A JP 2010064279 A JP2010064279 A JP 2010064279A JP 5580631 B2 JP5580631 B2 JP 5580631B2
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Japan
Prior art keywords
adhesive layer
layer
dicing
adhesive
semiconductor chip
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Expired - Fee Related
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JP2010064279A
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Japanese (ja)
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JP2011195712A (ja
JP2011195712A5 (enExample
Inventor
義之 竹部
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Priority to JP2010064279A priority Critical patent/JP5580631B2/ja
Publication of JP2011195712A publication Critical patent/JP2011195712A/ja
Publication of JP2011195712A5 publication Critical patent/JP2011195712A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2010064279A 2010-03-19 2010-03-19 硬化性組成物、ダイシング−ダイボンディングテープ、接続構造体及び粘接着剤層付き半導体チップの製造方法 Expired - Fee Related JP5580631B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010064279A JP5580631B2 (ja) 2010-03-19 2010-03-19 硬化性組成物、ダイシング−ダイボンディングテープ、接続構造体及び粘接着剤層付き半導体チップの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010064279A JP5580631B2 (ja) 2010-03-19 2010-03-19 硬化性組成物、ダイシング−ダイボンディングテープ、接続構造体及び粘接着剤層付き半導体チップの製造方法

Publications (3)

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JP2011195712A JP2011195712A (ja) 2011-10-06
JP2011195712A5 JP2011195712A5 (enExample) 2013-01-24
JP5580631B2 true JP5580631B2 (ja) 2014-08-27

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JP2010064279A Expired - Fee Related JP5580631B2 (ja) 2010-03-19 2010-03-19 硬化性組成物、ダイシング−ダイボンディングテープ、接続構造体及び粘接着剤層付き半導体チップの製造方法

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JP (1) JP5580631B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5754072B2 (ja) * 2010-02-25 2015-07-22 日立化成株式会社 粘接着剤組成物、回路部材接続用粘接着剤シート及び半導体装置の製造方法
JP4976522B2 (ja) * 2010-04-16 2012-07-18 日東電工株式会社 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム、及び、半導体装置の製造方法
KR101948374B1 (ko) 2012-09-25 2019-02-14 스미또모 베이크라이트 가부시키가이샤 다이싱 필름
WO2014109212A1 (ja) * 2013-01-09 2014-07-17 株式会社ダイセル 硬化性エポキシ樹脂組成物
SG11201606470RA (en) 2014-03-24 2016-10-28 Lintec Corp Protective film forming film, protective film forming sheet and work product manufacturing method
JP6310748B2 (ja) * 2014-03-31 2018-04-11 日東電工株式会社 ダイボンドフィルム、ダイシングシート付きダイボンドフィルム、半導体装置、及び、半導体装置の製造方法
DE102016207548A1 (de) * 2016-05-02 2017-11-02 Tesa Se Härtbare Klebemasse und darauf basierende Reaktivklebebänder
JP7127266B2 (ja) * 2017-10-11 2022-08-30 三菱ケミカル株式会社 活性エネルギー線重合性組成物及びその硬化被膜を有する成形品
JP7110600B2 (ja) * 2018-01-17 2022-08-02 東レ株式会社 電子部品用樹脂組成物および電子部品用樹脂シート。

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4471565B2 (ja) * 2002-12-10 2010-06-02 株式会社ディスコ 半導体ウエーハの分割方法
JP2006054437A (ja) * 2005-07-08 2006-02-23 Sumitomo Bakelite Co Ltd ダイシングシート機能付きダイアタッチフィルム、それを用いた半導体装置の製造方法及び半導体装置
JP5549106B2 (ja) * 2008-04-16 2014-07-16 日立化成株式会社 半導体用接着シート及びダイシング一体型半導体用接着シート

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JP2011195712A (ja) 2011-10-06

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