JP5562115B2 - 基板処理装置および貼り合わせ基板の製造方法 - Google Patents

基板処理装置および貼り合わせ基板の製造方法 Download PDF

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JP5562115B2
JP5562115B2 JP2010110829A JP2010110829A JP5562115B2 JP 5562115 B2 JP5562115 B2 JP 5562115B2 JP 2010110829 A JP2010110829 A JP 2010110829A JP 2010110829 A JP2010110829 A JP 2010110829A JP 5562115 B2 JP5562115 B2 JP 5562115B2
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substrate
bonding
unit
surface state
bonding strength
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JP2011238865A (ja
JP2011238865A5 (enExample
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尊彦 和歌月
大輔 松嶋
航之介 林
勝順 鈴木
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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JP2010110829A 2010-05-13 2010-05-13 基板処理装置および貼り合わせ基板の製造方法 Active JP5562115B2 (ja)

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JP2011238865A5 JP2011238865A5 (enExample) 2013-06-27
JP5562115B2 true JP5562115B2 (ja) 2014-07-30

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5580251B2 (ja) * 2011-06-13 2014-08-27 株式会社日立ハイテクマニファクチャ＆サービス ウェーハ接合強度検査装置及び方法
WO2013145622A1 (ja) * 2012-03-28 2013-10-03 株式会社ニコン 基板貼り合わせ装置および基板貼り合わせ方法
KR102323040B1 (ko) 2013-09-25 2021-11-08 에베 그룹 에. 탈너 게엠베하 기판 본딩 장치 및 방법
JP2020057810A (ja) * 2019-12-23 2020-04-09 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板をボンディングする装置および方法
JP7024040B2 (ja) * 2020-11-04 2022-02-22 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板をボンディングする方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2633536B2 (ja) * 1986-11-05 1997-07-23 株式会社東芝 接合型半導体基板の製造方法
JP3720515B2 (ja) * 1997-03-13 2005-11-30 キヤノン株式会社 基板処理装置及びその方法並びに基板の製造方法

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