JP2011238865A5 - - Google Patents

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Publication number
JP2011238865A5
JP2011238865A5 JP2010110829A JP2010110829A JP2011238865A5 JP 2011238865 A5 JP2011238865 A5 JP 2011238865A5 JP 2010110829 A JP2010110829 A JP 2010110829A JP 2010110829 A JP2010110829 A JP 2010110829A JP 2011238865 A5 JP2011238865 A5 JP 2011238865A5
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JP
Japan
Prior art keywords
bonding
substrate
surface state
bonding strength
substrates
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JP2010110829A
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English (en)
Japanese (ja)
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JP2011238865A (ja
JP5562115B2 (ja
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Priority to JP2010110829A priority Critical patent/JP5562115B2/ja
Priority claimed from JP2010110829A external-priority patent/JP5562115B2/ja
Publication of JP2011238865A publication Critical patent/JP2011238865A/ja
Publication of JP2011238865A5 publication Critical patent/JP2011238865A5/ja
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Publication of JP5562115B2 publication Critical patent/JP5562115B2/ja
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JP2010110829A 2010-05-13 2010-05-13 基板処理装置および貼り合わせ基板の製造方法 Active JP5562115B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010110829A JP5562115B2 (ja) 2010-05-13 2010-05-13 基板処理装置および貼り合わせ基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010110829A JP5562115B2 (ja) 2010-05-13 2010-05-13 基板処理装置および貼り合わせ基板の製造方法

Publications (3)

Publication Number Publication Date
JP2011238865A JP2011238865A (ja) 2011-11-24
JP2011238865A5 true JP2011238865A5 (enExample) 2013-06-27
JP5562115B2 JP5562115B2 (ja) 2014-07-30

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JP2010110829A Active JP5562115B2 (ja) 2010-05-13 2010-05-13 基板処理装置および貼り合わせ基板の製造方法

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JP (1) JP5562115B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5580251B2 (ja) * 2011-06-13 2014-08-27 株式会社日立ハイテクマニファクチャ＆サービス ウェーハ接合強度検査装置及び方法
WO2013145622A1 (ja) * 2012-03-28 2013-10-03 株式会社ニコン 基板貼り合わせ装置および基板貼り合わせ方法
EP3028295B1 (de) 2013-09-25 2020-10-21 Ev Group E. Thallner GmbH Verfahren zum bonden von substraten
JP2020057810A (ja) * 2019-12-23 2020-04-09 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板をボンディングする装置および方法
JP7024040B2 (ja) * 2020-11-04 2022-02-22 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板をボンディングする方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2633536B2 (ja) * 1986-11-05 1997-07-23 株式会社東芝 接合型半導体基板の製造方法
JP3720515B2 (ja) * 1997-03-13 2005-11-30 キヤノン株式会社 基板処理装置及びその方法並びに基板の製造方法

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