JP5554133B2 - 半導体装置の製造装置及び半導体装置の製造方法 - Google Patents

半導体装置の製造装置及び半導体装置の製造方法 Download PDF

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Publication number
JP5554133B2
JP5554133B2 JP2010100034A JP2010100034A JP5554133B2 JP 5554133 B2 JP5554133 B2 JP 5554133B2 JP 2010100034 A JP2010100034 A JP 2010100034A JP 2010100034 A JP2010100034 A JP 2010100034A JP 5554133 B2 JP5554133 B2 JP 5554133B2
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wafer
unit
adhesive
stage
application
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JP2010100034A
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Japanese (ja)
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JP2011233577A (ja
JP2011233577A5 (https=
Inventor
暁 原
真吾 玉井
昭宏 重山
路夫 小川
均 青柳
裕之 田中
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Publication of JP2011233577A5 publication Critical patent/JP2011233577A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors

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  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2010100034A 2010-04-23 2010-04-23 半導体装置の製造装置及び半導体装置の製造方法 Expired - Fee Related JP5554133B2 (ja)

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Application Number Priority Date Filing Date Title
JP2010100034A JP5554133B2 (ja) 2010-04-23 2010-04-23 半導体装置の製造装置及び半導体装置の製造方法

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JP2010100034A JP5554133B2 (ja) 2010-04-23 2010-04-23 半導体装置の製造装置及び半導体装置の製造方法

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JP2011233577A JP2011233577A (ja) 2011-11-17
JP2011233577A5 JP2011233577A5 (https=) 2014-03-27
JP5554133B2 true JP5554133B2 (ja) 2014-07-23

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JP2010100034A Expired - Fee Related JP5554133B2 (ja) 2010-04-23 2010-04-23 半導体装置の製造装置及び半導体装置の製造方法

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JP (1) JP5554133B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7062330B2 (ja) * 2017-11-08 2022-05-06 株式会社ディスコ ダイボンド用樹脂層形成装置
JP7360868B2 (ja) * 2019-09-24 2023-10-13 株式会社三井ハイテック 積層鉄心の製造装置及び積層鉄心の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004130298A (ja) * 2002-08-13 2004-04-30 Dainippon Ink & Chem Inc 塗膜形成方法、被塗布物及びディスク
US8088438B2 (en) * 2004-06-03 2012-01-03 Shibaura Mechatronics Corporation Resin layer formation method, resin layer formation device, and disk manufacturing method
JP5135993B2 (ja) * 2007-10-29 2013-02-06 住友ベークライト株式会社 液状接着剤の塗布方法および半導体装置の製造方法
JP5576173B2 (ja) * 2010-04-23 2014-08-20 芝浦メカトロニクス株式会社 半導体装置の製造装置

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