JP2011233577A5 - - Google Patents
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- JP2011233577A5 JP2011233577A5 JP2010100034A JP2010100034A JP2011233577A5 JP 2011233577 A5 JP2011233577 A5 JP 2011233577A5 JP 2010100034 A JP2010100034 A JP 2010100034A JP 2010100034 A JP2010100034 A JP 2010100034A JP 2011233577 A5 JP2011233577 A5 JP 2011233577A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- application
- outer peripheral
- peripheral edge
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010100034A JP5554133B2 (ja) | 2010-04-23 | 2010-04-23 | 半導体装置の製造装置及び半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010100034A JP5554133B2 (ja) | 2010-04-23 | 2010-04-23 | 半導体装置の製造装置及び半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011233577A JP2011233577A (ja) | 2011-11-17 |
| JP2011233577A5 true JP2011233577A5 (https=) | 2014-03-27 |
| JP5554133B2 JP5554133B2 (ja) | 2014-07-23 |
Family
ID=45322648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010100034A Expired - Fee Related JP5554133B2 (ja) | 2010-04-23 | 2010-04-23 | 半導体装置の製造装置及び半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5554133B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7062330B2 (ja) * | 2017-11-08 | 2022-05-06 | 株式会社ディスコ | ダイボンド用樹脂層形成装置 |
| JP7360868B2 (ja) * | 2019-09-24 | 2023-10-13 | 株式会社三井ハイテック | 積層鉄心の製造装置及び積層鉄心の製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004130298A (ja) * | 2002-08-13 | 2004-04-30 | Dainippon Ink & Chem Inc | 塗膜形成方法、被塗布物及びディスク |
| US8088438B2 (en) * | 2004-06-03 | 2012-01-03 | Shibaura Mechatronics Corporation | Resin layer formation method, resin layer formation device, and disk manufacturing method |
| JP5135993B2 (ja) * | 2007-10-29 | 2013-02-06 | 住友ベークライト株式会社 | 液状接着剤の塗布方法および半導体装置の製造方法 |
| JP5576173B2 (ja) * | 2010-04-23 | 2014-08-20 | 芝浦メカトロニクス株式会社 | 半導体装置の製造装置 |
-
2010
- 2010-04-23 JP JP2010100034A patent/JP5554133B2/ja not_active Expired - Fee Related
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