JP5550230B2 - 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置 - Google Patents

熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置 Download PDF

Info

Publication number
JP5550230B2
JP5550230B2 JP2008320018A JP2008320018A JP5550230B2 JP 5550230 B2 JP5550230 B2 JP 5550230B2 JP 2008320018 A JP2008320018 A JP 2008320018A JP 2008320018 A JP2008320018 A JP 2008320018A JP 5550230 B2 JP5550230 B2 JP 5550230B2
Authority
JP
Japan
Prior art keywords
group
optical semiconductor
thermosetting resin
resin composition
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008320018A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010047740A5 (https=
JP2010047740A (ja
Inventor
勇人 小谷
直之 浦崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2008320018A priority Critical patent/JP5550230B2/ja
Publication of JP2010047740A publication Critical patent/JP2010047740A/ja
Publication of JP2010047740A5 publication Critical patent/JP2010047740A5/ja
Application granted granted Critical
Publication of JP5550230B2 publication Critical patent/JP5550230B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Epoxy Resins (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2008320018A 2008-07-22 2008-12-16 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置 Expired - Fee Related JP5550230B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008320018A JP5550230B2 (ja) 2008-07-22 2008-12-16 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008188405 2008-07-22
JP2008188405 2008-07-22
JP2008320018A JP5550230B2 (ja) 2008-07-22 2008-12-16 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013198253A Division JP6096090B2 (ja) 2008-07-22 2013-09-25 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置

Publications (3)

Publication Number Publication Date
JP2010047740A JP2010047740A (ja) 2010-03-04
JP2010047740A5 JP2010047740A5 (https=) 2011-12-01
JP5550230B2 true JP5550230B2 (ja) 2014-07-16

Family

ID=42065083

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008320018A Expired - Fee Related JP5550230B2 (ja) 2008-07-22 2008-12-16 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置
JP2013198253A Active JP6096090B2 (ja) 2008-07-22 2013-09-25 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2013198253A Active JP6096090B2 (ja) 2008-07-22 2013-09-25 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置

Country Status (1)

Country Link
JP (2) JP5550230B2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011111723A1 (ja) * 2010-03-10 2011-09-15 味の素株式会社 樹脂組成物
WO2012053377A1 (ja) * 2010-10-18 2012-04-26 株式会社ダイセル 高屈折率樹脂組成物および樹脂硬化物
KR101849807B1 (ko) 2010-10-25 2018-04-17 이데미쓰 고산 가부시키가이샤 (메트)아크릴레이트계 조성물
KR20160019407A (ko) * 2013-06-13 2016-02-19 닛토덴코 가부시키가이샤 광반도체 리플렉터용 에폭시 수지 조성물, 광반도체 장치용 열경화성 수지 조성물 및 그것을 이용하여 얻어지는 광반도체 장치용 리드 프레임, 밀봉형 광반도체 소자 및 광반도체 장치
JP6399650B2 (ja) * 2013-10-15 2018-10-03 日本化薬株式会社 脂環式多官能酸無水物及び熱硬化性樹脂組成物
CN111406085B (zh) * 2017-11-30 2023-04-14 昭和电工材料株式会社 复合粉
JP2020029524A (ja) * 2018-08-23 2020-02-27 信越化学工業株式会社 熱伝導性シリコーン組成物及び熱伝導性シリコーン硬化物
JP7567317B2 (ja) * 2020-09-24 2024-10-16 株式会社レゾナック 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及び光半導体装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4475771B2 (ja) * 2000-08-08 2010-06-09 日本化学工業株式会社 光半導体封止用エポキシ樹脂組成物
JP4288940B2 (ja) * 2002-12-06 2009-07-01 日亜化学工業株式会社 エポキシ樹脂組成物
JP2005037792A (ja) * 2003-07-18 2005-02-10 Shin Etsu Chem Co Ltd 液晶表示素子用シール剤組成物
JP2005054060A (ja) * 2003-08-04 2005-03-03 Hokko Chem Ind Co Ltd 熱硬化性エポキシ樹脂用硬化促進剤および高温熱硬化用潜在型エポキシ樹脂組成物
JP5060707B2 (ja) * 2004-11-10 2012-10-31 日立化成工業株式会社 光反射用熱硬化性樹脂組成物
JP5303097B2 (ja) * 2005-10-07 2013-10-02 日立化成株式会社 熱硬化性光反射用樹脂組成物、ならびにこれを用いた光半導体搭載用基板とその製造方法および光半導体装置。
JP4802667B2 (ja) * 2005-11-08 2011-10-26 住友金属鉱山株式会社 エポキシ樹脂接着組成物及びそれを用いた光半導体用接着剤
JP5233186B2 (ja) * 2006-07-25 2013-07-10 日立化成株式会社 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板とその製造方法および光半導体装置
JP5298468B2 (ja) * 2006-09-26 2013-09-25 日立化成株式会社 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板とその製造方法および光半導体装置
JP5769353B2 (ja) * 2007-07-13 2015-08-26 チェイル インダストリーズ インコーポレイテッド 粘着剤組成物及び光学部材

Also Published As

Publication number Publication date
JP2014012856A (ja) 2014-01-23
JP6096090B2 (ja) 2017-03-15
JP2010047740A (ja) 2010-03-04

Similar Documents

Publication Publication Date Title
JP5599561B2 (ja) 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置
JP6096090B2 (ja) 熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法並びに光半導体装置
JP6322237B2 (ja) 熱硬化性光反射用樹脂組成物およびその製造方法
JP5298468B2 (ja) 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板とその製造方法および光半導体装置
JP4586925B2 (ja) 熱硬化性樹脂組成物、エポキシ樹脂成形材料、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP5672318B2 (ja) 光半導体装置の製造方法
JP5942445B2 (ja) 光反射用熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2009246334A (ja) 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP5936804B2 (ja) 熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2017103470A (ja) 光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP5544987B2 (ja) 多価カルボン酸縮合体、熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JPWO2013145607A1 (ja) 光反射用樹脂組成物、光半導体素子搭載用基板および光半導体装置
JP5401907B2 (ja) 熱硬化性樹脂組成物の製造方法、光半導体素子搭載用基板及びその製造方法、並びに、光半導体装置
WO2012015011A1 (ja) 多価カルボン酸縮合体、熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2012162729A (ja) 光反射用熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2015017271A (ja) 熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2016028426A (ja) 光反射用熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2017147454A (ja) 光反射用熱硬化性樹脂組成物の製造方法及び光半導体素子搭載用基板の製造方法
JP2014195081A (ja) 光反射用熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111014

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20111014

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20121017

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121023

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121225

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20130625

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130925

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20131002

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20131129

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140520

R150 Certificate of patent or registration of utility model

Ref document number: 5550230

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees