JP5540487B2 - 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 - Google Patents

熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 Download PDF

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JP5540487B2
JP5540487B2 JP2008245774A JP2008245774A JP5540487B2 JP 5540487 B2 JP5540487 B2 JP 5540487B2 JP 2008245774 A JP2008245774 A JP 2008245774A JP 2008245774 A JP2008245774 A JP 2008245774A JP 5540487 B2 JP5540487 B2 JP 5540487B2
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resin composition
group
optical semiconductor
compound
light reflecting
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JP2009097005A5 (https=
JP2009097005A (ja
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勇人 小谷
直之 浦崎
真人 水谷
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Resonac Corp
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP2008245774A 2007-09-25 2008-09-25 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 Active JP5540487B2 (ja)

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JP2008245774A JP5540487B2 (ja) 2007-09-25 2008-09-25 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

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JP2007247027 2007-09-25
JP2007247027 2007-09-25
JP2008245774A JP5540487B2 (ja) 2007-09-25 2008-09-25 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

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JP2009097005A JP2009097005A (ja) 2009-05-07
JP2009097005A5 JP2009097005A5 (https=) 2011-12-08
JP5540487B2 true JP5540487B2 (ja) 2014-07-02

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CN101809088B (zh) 2007-09-25 2012-10-24 日立化成工业株式会社 热固性光反射用树脂组合物、使用该组合物的光半导体元件搭载用基板及其制造方法、以及光半导体装置
JP5572936B2 (ja) * 2007-11-26 2014-08-20 日立化成株式会社 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2011074355A (ja) * 2009-09-07 2011-04-14 Nitto Denko Corp 光半導体装置用樹脂組成物およびそれを用いて得られる光半導体装置用リードフレーム、ならびに光半導体装置
JP5671812B2 (ja) * 2010-03-01 2015-02-18 日立化成株式会社 ウレタン樹脂組成物、硬化体及び硬化体を用いた光半導体装置
JP2012092309A (ja) * 2010-09-29 2012-05-17 Shikoku Chem Corp エポキシ樹脂組成物
KR101242725B1 (ko) 2010-11-23 2013-03-12 (주)네오빛 광반사용 열경화성 수지 조성물
JP2012172012A (ja) * 2011-02-18 2012-09-10 Shin-Etsu Chemical Co Ltd 熱硬化性エポキシ樹脂組成物及び光半導体装置
JP2014517110A (ja) * 2011-05-18 2014-07-17 株式會社ネペスエーエムシー 熱硬化型光反射用樹脂組成物及びその製造方法、熱硬化型光反射用樹脂組成物によって製造された光半導体素子搭載用反射板及びそれを含む光半導体装置
JP5834560B2 (ja) * 2011-07-12 2015-12-24 日立化成株式会社 エポキシ樹脂硬化剤、エポキシ樹脂組成物及び光半導体装置
JP2013135119A (ja) * 2011-12-27 2013-07-08 Kaneka Corp 表面実装型発光装置用樹脂成形体およびそれを用いた発光装置
JP5917137B2 (ja) * 2011-12-27 2016-05-11 株式会社カネカ 表面実装型発光装置用樹脂成形体およびそれを用いた発光装置
JP2012162729A (ja) * 2012-04-11 2012-08-30 Hitachi Chemical Co Ltd 光反射用熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2015211112A (ja) * 2014-04-25 2015-11-24 株式会社カネカ 発光ダイオード用硬化性樹脂組成物、発光ダイオードのパッケージ
JP5899281B2 (ja) * 2014-07-16 2016-04-06 積水化学工業株式会社 光半導体装置用白色硬化性組成物、光半導体装置用白色硬化性組成物の製造方法、光半導体装置用成型体及び光半導体装置
GB201416670D0 (en) * 2014-09-22 2014-11-05 Hexcel Composites Ltd Fast curing compositions
WO2016047357A1 (ja) * 2014-09-25 2016-03-31 Dic株式会社 エポキシ樹脂組成物、硬化物、繊維強化複合材料、繊維強化樹脂成形品、及び繊維強化樹脂成形品の製造方法
JP6724634B2 (ja) * 2016-07-28 2020-07-15 日亜化学工業株式会社 発光装置の製造方法

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US5037898A (en) * 1990-02-27 1991-08-06 Shell Oil Company Polysiloxane-polylactone block copolymer modified thermostat compositions
JP3334998B2 (ja) * 1994-03-30 2002-10-15 住友ベークライト株式会社 エポキシ樹脂組成物
JP2000281750A (ja) * 1999-03-31 2000-10-10 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP3870825B2 (ja) * 2002-02-27 2007-01-24 日立化成工業株式会社 封止用エポキシ樹脂成形材料及び電子部品装置
JP5060707B2 (ja) * 2004-11-10 2012-10-31 日立化成工業株式会社 光反射用熱硬化性樹脂組成物
EP2768031B1 (en) * 2005-08-04 2021-02-17 Nichia Corporation Light-emitting device
JP5303097B2 (ja) * 2005-10-07 2013-10-02 日立化成株式会社 熱硬化性光反射用樹脂組成物、ならびにこれを用いた光半導体搭載用基板とその製造方法および光半導体装置。
KR20140146210A (ko) * 2006-06-02 2014-12-24 히타치가세이가부시끼가이샤 광반도체소자 탑재용 패키지 및 이것을 이용한 광반도체장치
JP5239688B2 (ja) * 2007-11-13 2013-07-17 日立化成株式会社 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

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