JP5534176B2 - 露光装置、露光方法、およびデバイス製造方法 - Google Patents

露光装置、露光方法、およびデバイス製造方法 Download PDF

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Publication number
JP5534176B2
JP5534176B2 JP2010026086A JP2010026086A JP5534176B2 JP 5534176 B2 JP5534176 B2 JP 5534176B2 JP 2010026086 A JP2010026086 A JP 2010026086A JP 2010026086 A JP2010026086 A JP 2010026086A JP 5534176 B2 JP5534176 B2 JP 5534176B2
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Japan
Prior art keywords
light
optical system
pattern
substrate
exposure apparatus
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Expired - Fee Related
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JP2010026086A
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English (en)
Japanese (ja)
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JP2010217877A5 (OSRAM
JP2010217877A (ja
Inventor
徹 木内
英夫 水谷
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Nikon Corp
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Nikon Corp
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Publication of JP2010217877A5 publication Critical patent/JP2010217877A5/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2010026086A 2009-03-13 2010-02-09 露光装置、露光方法、およびデバイス製造方法 Expired - Fee Related JP5534176B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US20258009P 2009-03-13 2009-03-13
US61/202,580 2009-03-13
US12/692,443 US8264666B2 (en) 2009-03-13 2010-01-22 Exposure apparatus, exposure method, and method of manufacturing device
US12/692,443 2010-01-22

Publications (3)

Publication Number Publication Date
JP2010217877A JP2010217877A (ja) 2010-09-30
JP2010217877A5 JP2010217877A5 (OSRAM) 2013-02-28
JP5534176B2 true JP5534176B2 (ja) 2014-06-25

Family

ID=42169502

Family Applications (1)

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JP2010026086A Expired - Fee Related JP5534176B2 (ja) 2009-03-13 2010-02-09 露光装置、露光方法、およびデバイス製造方法

Country Status (6)

Country Link
US (1) US8264666B2 (OSRAM)
JP (1) JP5534176B2 (OSRAM)
KR (1) KR20110137309A (OSRAM)
CN (1) CN102362227B (OSRAM)
TW (1) TWI453547B (OSRAM)
WO (1) WO2010104162A1 (OSRAM)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5451175B2 (ja) * 2009-05-15 2014-03-26 サンエー技研株式会社 露光装置
US9348462B2 (en) * 2012-06-13 2016-05-24 Maxim Integrated Products, Inc. Gesture detection and recognition based upon measurement and tracking of light intensity ratios within an array of photodetectors
CN107272348B (zh) * 2012-07-13 2020-04-07 株式会社尼康 扫描曝光装置及器件制造方法
JP6256338B2 (ja) 2012-09-14 2018-01-10 株式会社ニコン 基板処理装置及びデバイス製造方法
CN107255911B (zh) * 2012-11-06 2019-07-09 株式会社尼康 曝光装置
CN108873613B (zh) * 2013-06-14 2020-11-13 株式会社尼康 扫描曝光装置以及扫描曝光方法
CN106933073A (zh) * 2013-10-22 2017-07-07 应用材料公司 具有主动对准的卷对卷无掩模光刻
CN110451316B (zh) * 2014-09-04 2021-01-05 株式会社尼康 基板处理装置
GB2530768B (en) * 2014-10-01 2019-07-17 Kratos Analytical Ltd Method and apparatuses relating to cleaning an ion source
CN108919610B (zh) * 2015-02-27 2021-02-02 株式会社尼康 基板处理装置及元件制造方法
JP6723831B2 (ja) * 2016-06-01 2020-07-15 株式会社オーク製作所 露光装置
CN109031899A (zh) * 2018-09-29 2018-12-18 苏州源卓光电科技有限公司 一种高分辨率高效率投影光刻成像系统及曝光方法
DE102022200539A1 (de) 2022-01-18 2022-11-17 Carl Zeiss Smt Gmbh Optisches System für die Projektionslithographie

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US5652645A (en) 1995-07-24 1997-07-29 Anvik Corporation High-throughput, high-resolution, projection patterning system for large, flexible, roll-fed, electronic-module substrates
RU2084941C1 (ru) 1996-05-06 1997-07-20 Йелстаун Корпорейшн Н.В. Адаптивный оптический модуль
US5923403A (en) * 1997-07-08 1999-07-13 Anvik Corporation Simultaneous, two-sided projection lithography system
TW448487B (en) * 1997-11-22 2001-08-01 Nippon Kogaku Kk Exposure apparatus, exposure method and manufacturing method of device
JP3376935B2 (ja) * 1999-01-25 2003-02-17 ウシオ電機株式会社 帯状ワークの露光装置
JP4307813B2 (ja) 2001-11-14 2009-08-05 株式会社リコー 光偏向方法並びに光偏向装置及びその光偏向装置の製造方法並びにその光偏向装置を具備する光情報処理装置及び画像形成装置及び画像投影表示装置及び光伝送装置
US6900915B2 (en) 2001-11-14 2005-05-31 Ricoh Company, Ltd. Light deflecting method and apparatus efficiently using a floating mirror
EP1324136A1 (en) * 2001-12-28 2003-07-02 ASML Netherlands B.V. Lithographic projection apparatus and device manufacturing method
JP2005222963A (ja) * 2002-06-12 2005-08-18 Asml Netherlands Bv リソグラフィ装置およびその装置の製造方法
WO2004094301A1 (en) 2003-04-24 2004-11-04 Metconnex Canada Inc. A micro-electro-mechanical-system two dimensional mirror with articulated suspension structures for high fill factor arrays
US7095546B2 (en) 2003-04-24 2006-08-22 Metconnex Canada Inc. Micro-electro-mechanical-system two dimensional mirror with articulated suspension structures for high fill factor arrays
US7292308B2 (en) * 2004-03-23 2007-11-06 Asml Holding N.V. System and method for patterning a flexible substrate in a lithography tool
CN100339754C (zh) * 2004-04-28 2007-09-26 友达光电股份有限公司 应用于反射式平面显示器的反射电极的制作方法及光罩
JP4335114B2 (ja) 2004-10-18 2009-09-30 日本碍子株式会社 マイクロミラーデバイス
EP1811547A4 (en) * 2005-02-03 2010-06-02 Nikon Corp OPTICAL INTEGRATOR, OPTICAL LIGHTING DEVICE, EXPOSURE DEVICE AND EXPOSURE METHOD
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JP4542495B2 (ja) 2005-10-19 2010-09-15 株式会社目白プレシジョン 投影露光装置及びその投影露光方法
EP1986224A4 (en) 2006-02-16 2012-01-25 Nikon Corp EXPOSURE APPARATUS, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD
JP4929762B2 (ja) 2006-03-03 2012-05-09 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
JP5362259B2 (ja) * 2008-05-14 2013-12-11 大日本スクリーン製造株式会社 画像記録装置
JP5487981B2 (ja) * 2009-01-30 2014-05-14 株式会社ニコン 露光方法及び装置、並びにデバイス製造方法
JP5397748B2 (ja) * 2009-02-25 2014-01-22 株式会社ニコン 露光装置、走査露光方法、およびデバイス製造方法

Also Published As

Publication number Publication date
TW201035698A (en) 2010-10-01
TWI453547B (zh) 2014-09-21
WO2010104162A1 (en) 2010-09-16
US20100265483A1 (en) 2010-10-21
US8264666B2 (en) 2012-09-11
CN102362227A (zh) 2012-02-22
CN102362227B (zh) 2014-06-18
KR20110137309A (ko) 2011-12-22
JP2010217877A (ja) 2010-09-30

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