JP5533769B2 - マスクとワークの位置合せ方法 - Google Patents

マスクとワークの位置合せ方法 Download PDF

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Publication number
JP5533769B2
JP5533769B2 JP2011089992A JP2011089992A JP5533769B2 JP 5533769 B2 JP5533769 B2 JP 5533769B2 JP 2011089992 A JP2011089992 A JP 2011089992A JP 2011089992 A JP2011089992 A JP 2011089992A JP 5533769 B2 JP5533769 B2 JP 5533769B2
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JP
Japan
Prior art keywords
mask
workpiece
work
mark
pattern
Prior art date
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Active
Application number
JP2011089992A
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English (en)
Japanese (ja)
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JP2012220923A (ja
Inventor
亮一 三塩
豊治 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ushio Denki KK
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Ushio Denki KK
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Filing date
Publication date
Application filed by Ushio Denki KK filed Critical Ushio Denki KK
Priority to JP2011089992A priority Critical patent/JP5533769B2/ja
Priority to TW101107484A priority patent/TWI452447B/zh
Priority to KR1020120038534A priority patent/KR101445914B1/ko
Priority to CN201210109339.6A priority patent/CN102736445B/zh
Publication of JP2012220923A publication Critical patent/JP2012220923A/ja
Application granted granted Critical
Publication of JP5533769B2 publication Critical patent/JP5533769B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2011089992A 2011-04-14 2011-04-14 マスクとワークの位置合せ方法 Active JP5533769B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011089992A JP5533769B2 (ja) 2011-04-14 2011-04-14 マスクとワークの位置合せ方法
TW101107484A TWI452447B (zh) 2011-04-14 2012-03-06 The method of aligning the mask with the workpiece
KR1020120038534A KR101445914B1 (ko) 2011-04-14 2012-04-13 마스크와 워크의 위치 맞춤 방법
CN201210109339.6A CN102736445B (zh) 2011-04-14 2012-04-13 掩模与工件的对齐方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011089992A JP5533769B2 (ja) 2011-04-14 2011-04-14 マスクとワークの位置合せ方法

Publications (2)

Publication Number Publication Date
JP2012220923A JP2012220923A (ja) 2012-11-12
JP5533769B2 true JP5533769B2 (ja) 2014-06-25

Family

ID=46992167

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011089992A Active JP5533769B2 (ja) 2011-04-14 2011-04-14 マスクとワークの位置合せ方法

Country Status (4)

Country Link
JP (1) JP5533769B2 (zh)
KR (1) KR101445914B1 (zh)
CN (1) CN102736445B (zh)
TW (1) TWI452447B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6142194B2 (ja) * 2012-11-15 2017-06-07 株式会社ブイ・テクノロジー 蒸着マスクの製造方法及び蒸着マスク
JP5958824B2 (ja) 2012-11-15 2016-08-02 株式会社ブイ・テクノロジー 蒸着マスクの製造方法
CN104730871B (zh) * 2013-12-18 2017-07-21 财团法人金属工业研究发展中心 异空间异尺寸基材对位方法
CN105005182B (zh) * 2014-04-25 2017-06-27 上海微电子装备有限公司 多个传感器间相互位置关系校准方法
JP6561904B2 (ja) * 2016-04-21 2019-08-21 三菱電機株式会社 電子部品装置および電子部品装置の製造方法
JP7029587B2 (ja) * 2017-10-19 2022-03-04 パナソニックＩｐマネジメント株式会社 スクリーン印刷装置およびスクリーン印刷方法
CN110147002B (zh) * 2019-04-28 2022-04-26 武汉华星光电技术有限公司 对位测试键、液晶显示面板及对位组立方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH082085A (ja) * 1994-06-20 1996-01-09 Fujitsu Ltd ペーストの塗布方法
TW588414B (en) * 2000-06-08 2004-05-21 Toshiba Corp Alignment method, overlap inspecting method and mask
JP4158514B2 (ja) 2002-12-24 2008-10-01 ウシオ電機株式会社 両面投影露光装置
JP4015079B2 (ja) * 2003-07-18 2007-11-28 株式会社東芝 レチクル、露光装置検査システム、露光装置検査方法及びレチクルの製造方法
JP2005189462A (ja) * 2003-12-25 2005-07-14 Nec Toppan Circuit Solutions Inc プリント配線板の製造方法
US7785526B2 (en) * 2004-07-20 2010-08-31 Molecular Imprints, Inc. Imprint alignment method, system, and template
JP2006047881A (ja) * 2004-08-06 2006-02-16 Sharp Corp 露光装置および積層基板の製造方法
KR101130890B1 (ko) * 2005-03-18 2012-03-28 엘지전자 주식회사 근접노광형 노광장치
SG182982A1 (en) * 2006-08-31 2012-08-30 Nikon Corp Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
WO2008120785A1 (ja) * 2007-04-03 2008-10-09 Nsk Ltd. 露光装置及び露光方法
JP5133193B2 (ja) * 2008-10-08 2013-01-30 株式会社目白プレシジョン 投影露光装置
US8271919B2 (en) * 2009-10-30 2012-09-18 Ibiden Co., Ltd. Method for correcting image rendering data, method for rendering image, method for manufacturing wiring board, and image rendering system
JP2011221267A (ja) * 2010-04-09 2011-11-04 Fujikura Ltd プリント配線板の製造方法及びプリント配線板の製造装置。

Also Published As

Publication number Publication date
TW201243523A (en) 2012-11-01
CN102736445B (zh) 2015-01-28
JP2012220923A (ja) 2012-11-12
CN102736445A (zh) 2012-10-17
TWI452447B (zh) 2014-09-11
KR20120117680A (ko) 2012-10-24
KR101445914B1 (ko) 2014-11-03

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