JP5530432B2 - Ｍｅｍｓ装置を作成するための方法 - Google Patents

Ｍｅｍｓ装置を作成するための方法 Download PDF

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Publication number
JP5530432B2
JP5530432B2 JP2011517119A JP2011517119A JP5530432B2 JP 5530432 B2 JP5530432 B2 JP 5530432B2 JP 2011517119 A JP2011517119 A JP 2011517119A JP 2011517119 A JP2011517119 A JP 2011517119A JP 5530432 B2 JP5530432 B2 JP 5530432B2
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JP
Japan
Prior art keywords
layer
covering layer
container
mst
coating layer
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Expired - Fee Related
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JP2011517119A
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English (en)
Japanese (ja)
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JP2011527241A (ja
JP2011527241A5 (https=
Inventor
パール，ボルフガング
ファイエルターク，グレゴール
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
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Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of JP2011527241A publication Critical patent/JP2011527241A/ja
Publication of JP2011527241A5 publication Critical patent/JP2011527241A5/ja
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Publication of JP5530432B2 publication Critical patent/JP5530432B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00309—Processes for packaging MEMS devices suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00047—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Micromachines (AREA)
JP2011517119A 2008-07-09 2009-07-06 Ｍｅｍｓ装置を作成するための方法 Expired - Fee Related JP5530432B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008032319A DE102008032319B4 (de) 2008-07-09 2008-07-09 Verfahren zur Herstellung eines MST Bauteils
DE102008032319.5 2008-07-09
PCT/EP2009/058520 WO2010003925A2 (de) 2008-07-09 2009-07-06 Verfahren zur herstellung eines mst bauteils und mst bauteil

Publications (3)

Publication Number Publication Date
JP2011527241A JP2011527241A (ja) 2011-10-27
JP2011527241A5 JP2011527241A5 (https=) 2012-04-05
JP5530432B2 true JP5530432B2 (ja) 2014-06-25

Family

ID=41412672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011517119A Expired - Fee Related JP5530432B2 (ja) 2008-07-09 2009-07-06 Ｍｅｍｓ装置を作成するための方法

Country Status (5)

Country Link
US (1) US9051174B2 (https=)
JP (1) JP5530432B2 (https=)
DE (1) DE102008032319B4 (https=)
GB (1) GB2475186B (https=)
WO (1) WO2010003925A2 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8542850B2 (en) * 2007-09-12 2013-09-24 Epcos Pte Ltd Miniature microphone assembly with hydrophobic surface coating
DE102007058951B4 (de) * 2007-12-07 2020-03-26 Snaptrack, Inc. MEMS Package
DE102010006132B4 (de) 2010-01-29 2013-05-08 Epcos Ag Miniaturisiertes elektrisches Bauelement mit einem Stapel aus einem MEMS und einem ASIC
DE102012101505B4 (de) * 2012-02-24 2016-03-03 Epcos Ag Verfahren zur Herstellung eines Sensors
JP2013211505A (ja) * 2012-03-02 2013-10-10 Fujifilm Corp 半導体装置の製造方法
US8987871B2 (en) * 2012-05-31 2015-03-24 Stmicroelectronics Pte Ltd. Cap for a microelectromechanical system device with electromagnetic shielding, and method of manufacture
CN104604248B (zh) 2012-09-10 2018-07-24 罗伯特·博世有限公司 具有模制互联器件的mems麦克风封装
DE102014106818B3 (de) * 2014-05-14 2015-11-12 Epcos Ag Mikrofon
US10575374B2 (en) * 2018-03-09 2020-02-25 Ledengin, Inc. Package for flip-chip LEDs with close spacing of LED chips

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0510838A (ja) 1991-07-08 1993-01-19 Mitsubishi Electric Corp 圧力検出装置
JPH11230846A (ja) 1998-02-09 1999-08-27 Denso Corp 半導体力学量センサの製造方法
US7166910B2 (en) 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
US6781231B2 (en) 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
DE10342981B4 (de) * 2003-09-17 2007-05-24 Disco Hi-Tec Europe Gmbh Verfahren zum selektiven Aufbringen einer Folie auf definierte Bereiche eines Wafers
US20050189622A1 (en) * 2004-03-01 2005-09-01 Tessera, Inc. Packaged acoustic and electromagnetic transducer chips
EP1722596A4 (en) * 2004-03-09 2009-11-11 Panasonic Corp electret
US7202552B2 (en) * 2005-07-15 2007-04-10 Silicon Matrix Pte. Ltd. MEMS package using flexible substrates, and method thereof
DE102005053765B4 (de) * 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
US7936062B2 (en) * 2006-01-23 2011-05-03 Tessera Technologies Ireland Limited Wafer level chip packaging
DE102006005419B4 (de) * 2006-02-03 2019-05-02 Infineon Technologies Ag Mikroelektromechanisches Halbleiterbauelement mit Hohlraumstruktur und Verfahren zur Herstellung desselben
DE102006017115B4 (de) 2006-04-10 2008-08-28 Infineon Technologies Ag Halbleiterbauteil mit einem Kunststoffgehäuse und Verfahren zu seiner Herstellung
DE102006046292B9 (de) 2006-09-29 2014-04-30 Epcos Ag Bauelement mit MEMS-Mikrofon und Verfahren zur Herstellung

Also Published As

Publication number Publication date
WO2010003925A3 (de) 2010-05-06
WO2010003925A2 (de) 2010-01-14
US20110180885A1 (en) 2011-07-28
DE102008032319B4 (de) 2012-06-06
GB201101277D0 (en) 2011-03-09
JP2011527241A (ja) 2011-10-27
US9051174B2 (en) 2015-06-09
DE102008032319A1 (de) 2010-01-14
GB2475186A (en) 2011-05-11
GB2475186B (en) 2012-10-10

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