JP5530221B2 - 発光モジュール及びこれを備えるライトユニット - Google Patents
発光モジュール及びこれを備えるライトユニット Download PDFInfo
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- JP5530221B2 JP5530221B2 JP2010045199A JP2010045199A JP5530221B2 JP 5530221 B2 JP5530221 B2 JP 5530221B2 JP 2010045199 A JP2010045199 A JP 2010045199A JP 2010045199 A JP2010045199 A JP 2010045199A JP 5530221 B2 JP5530221 B2 JP 5530221B2
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- 239000000758 substrate Substances 0.000 claims description 81
- 230000008878 coupling Effects 0.000 claims description 40
- 238000010168 coupling process Methods 0.000 claims description 40
- 238000005859 coupling reaction Methods 0.000 claims description 40
- 230000003287 optical effect Effects 0.000 claims description 14
- 230000037431 insertion Effects 0.000 claims 5
- 238000003780 insertion Methods 0.000 claims 5
- 239000000463 material Substances 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 239000011190 CEM-3 Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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- H—ELECTRICITY
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
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- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
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- F21V19/00—Fastening of light sources or lamp holders
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- H01—ELECTRIC ELEMENTS
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01087—Francium [Fr]
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- H05K2201/1059—Connections made by press-fit insertion
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
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- Illuminated Signs And Luminous Advertising (AREA)
Description
110 基板
111 中間支持部
112 第1リード部
114 第2リード部
115 第1ホルダー
116 第2ホルダー
117 収納溝
118 第1結合部
119 第2結合部
120 コネクター
130 発光デバイス
131 パッケージボディ
132 キャビティ
133 発光ダイオード
135 第1リード電極
136 第2リード電極
151 ボトムカバー
153 光学部材
155 表示パネル
170 表示装置
Claims (26)
- パッケージボディ、前記パッケージボディに設けられる発光ダイオード、及び前記発光ダイオードと電気的に連結されて前記パッケージボディの外側に突出される複数のリード電極を含む複数の発光デバイスと、
複数の前記発光デバイスを一列に収納する収納溝であって、各発光デバイスの複数のリード電極が嵌合結合されるとともに、発光デバイスの配置に応じて隣り合う発光デバイス間の周期を調節可能な収納溝、を1又は複数備える基板とを含み、
前記収納溝は、前記発光デバイスのボディが挿入される挿入溝と、前記挿入溝の方向に突出する凸状の複数のホルダーと、前記ホルダーとの間で凹状に形成され、前記発光デバイスのリード電極が結合される複数の結合部と、
を含む発光モジュール。 - 前記発光デバイスのボディの少なくとも一部が前記収納溝内に配置される請求項1に記載の発光モジュール。
- 前記複数のリード電極は前記収納溝内で前記基板と電気的に連結される請求項1に記載の発光モジュール。
- 前記挿入溝の両側において前記ホルダー及び前記結合部が交互に形成される、
請求項1に記載の発光モジュール。 - 前記ホルダーまたは前記結合部はランダムな間隔で形成される請求項4に記載の発光モジュール。
- 前記発光デバイスの複数のリード電極は前記ボディの側面及び下面中少なくとも1つに形成される請求項1に記載の発光モジュール。
- 前記発光デバイスの幅を1周期とした場合、各周期には少なくとも1つの結合部が配置される請求項4に記載の発光モジュール。
- 前記各周期には複数のホルダーが配置される請求項7に記載の発光モジュール。
- 前記基板には前記発光デバイスの配列方向に複数の収納溝が形成され、前記複数の収納溝の間に形成される中間支持部を含む、請求項1に記載の発光モジュール。
- 前記複数の発光デバイス中隣接する少なくとも三つは同一間隔に配置される請求項7に記載の発光モジュール。
- 前記複数の発光デバイスはランダムな間隔に配置される請求項7に記載の発光モジュール。
- 前記複数の収納溝には複数の発光デバイスが同一間隔に配置される請求項9に記載の発光モジュール。
- 前記基板及び前記収納溝中少なくとも1つには前記発光デバイスのリード電極が接触される複数のリード部を含む請求項1に記載の発光モジュール。
- 前記収納溝は前記複数の発光デバイスの配列方向に形成される孔または溝の形態を含む請求項1に記載の発光モジュール。
- パッケージボディ、前記パッケージボディに設けられる発光ダイオード、及び前記発光ダイオードと電気的に連結されて前記パッケージボディの外側に突出される複数のリード電極を含む複数の発光デバイスと、
複数の前記発光デバイスを一列に収納する収納溝であって、各発光デバイスの複数のリード電極が嵌合結合されるとともに、発光デバイスの配置に応じて隣り合う発光デバイス間の周期を調節可能な収納溝、を1又は複数備える基板と、
前記発光デバイスの一側に光学部材とを含み、
前記収納溝は、前記発光デバイスのボディが挿入される挿入溝と、前記挿入溝の方向に突出する凸状の複数のホルダーと、前記複数のホルダーの間で凹状に形成され、前記発光デバイスのリード電極が結合される複数の結合部と、
を含むライトユニット。 - 前記収納溝の両側には前記発光デバイスのボディが嵌合結合される凹凸構造を含む請求項15に記載のライトユニット。
- 前記基板の収納溝の一側に形成される第1リード部と、及び前記収納溝の他側に形成される第2リード部を含む請求項15に記載のライトユニット。
- 前記光学部材は光ガイドプレート及び光学シート中少なくとも1つを含む請求項15に記載のライトユニット。
- 前記発光デバイスのボディの少なくとも一部が前記収納溝内に配置される請求項15に記載のライトユニット。
- 前記複数のリード電極は前記収納溝内で前記基板と電気的に連結される請求項15に記載のライトユニット。
- 前記収納溝の両側には前記ホルダー及び前記結合部が交互に形成される請求項15に記載のライトユニット。
- 前記ホルダーまたは前記結合部はランダムな間隔で形成される請求項21に記載のライトユニット。
- 前記発光デバイスの複数のリード電極は前記ボディの側面及び下面中少なくとも1つに形成される請求項15に記載のライトユニット。
- 前記発光デバイスの幅を1周期とした場合、各周期には少なくとも1つの結合部が配置される請求項15に記載のライトユニット。
- 前記各周期には複数のホルダーが配置される請求項24に記載のライトユニット。
- 前記基板には前記発光デバイスの配列方向に複数の収納溝が形成され、前記複数の収納溝の間に形成される中間支持部を含む請求項15に記載のライトユニット。
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KR10-2009-0017733 | 2009-03-02 | ||
KR1020090017733A KR101020992B1 (ko) | 2009-03-02 | 2009-03-02 | 발광 모듈 및 이를 구비한 라이트 유닛 |
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JP2010206204A JP2010206204A (ja) | 2010-09-16 |
JP5530221B2 true JP5530221B2 (ja) | 2014-06-25 |
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JP2010045199A Active JP5530221B2 (ja) | 2009-03-02 | 2010-03-02 | 発光モジュール及びこれを備えるライトユニット |
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US (1) | US7997749B2 (ja) |
EP (1) | EP2227074B1 (ja) |
JP (1) | JP5530221B2 (ja) |
KR (1) | KR101020992B1 (ja) |
CN (1) | CN101826588B (ja) |
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-
2009
- 2009-03-02 KR KR1020090017733A patent/KR101020992B1/ko not_active IP Right Cessation
- 2009-12-22 US US12/644,880 patent/US7997749B2/en not_active Expired - Fee Related
-
2010
- 2010-02-21 CN CN201010117439.4A patent/CN101826588B/zh not_active Expired - Fee Related
- 2010-02-23 EP EP10154373.4A patent/EP2227074B1/en not_active Not-in-force
- 2010-03-02 JP JP2010045199A patent/JP5530221B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
EP2227074B1 (en) | 2013-09-25 |
CN101826588A (zh) | 2010-09-08 |
CN101826588B (zh) | 2014-04-30 |
US7997749B2 (en) | 2011-08-16 |
US20100220463A1 (en) | 2010-09-02 |
EP2227074A1 (en) | 2010-09-08 |
JP2010206204A (ja) | 2010-09-16 |
KR20100098989A (ko) | 2010-09-10 |
KR101020992B1 (ko) | 2011-03-09 |
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