JP5523181B2 - Anisotropic conductive sheet, circuit board electrical inspection method, and circuit board electrical inspection apparatus - Google Patents

Description

    The present invention relates to an anisotropic conductive sheet, a circuit board electrical inspection method, and a circuit board electrical inspection apparatus.

  In order to inspect the electrical performance of a printed circuit board and the like, various anisotropic conductive sheets have been proposed. For example, the surface of the insulating sheet body and the surface of the end portion of the conductive portion that forms a part of the anisotropic conductive sheet body and protrudes from the opening of the insulating sheet body are shaped to have substantially the same level. A conductive sheet has been proposed (see Patent Document 1).

Further, since the anisotropic conductive sheet is basically composed of an insulating material except for a part, there is a possibility that charging will occur due to static electricity. In this case, (1) the circuit board to be inspected sticks to the anisotropic conductive sheet, (2) the inspection device, the anisotropic conductive sheet, or the circuit board fails due to discharge, or ( 3) In order to avoid the problems shown in the above (1) and (2), it is necessary to carry out static elimination processing at the time of measurement, and it is known that problems such as a decrease in measurement efficiency occur (see Patent Document 2, etc.) ). In order to solve such problems, the anisotropic conductive sheet is provided with a charge-removing layer by various liquid phase film formation methods such as coating film formation and plating film formation, and sheet pasting. Sheet (see Patent Documents 2 and 3), semi-conductive in the surface direction, volume resistance of 10 ⁻⁷ to 10 ⁴ Ω · m, and surface resistance of 10 ⁻¹ to 10 ¹⁰ Ω / □. An anisotropic conductive sheet having a conductive portion has been proposed (see Patent Document 4). In the anisotropic conductive sheet including the semiconductive portion, the semiconductive portion is not provided on the surface of the anisotropic conductive sheet, but is provided so as to constitute a part of the sheet main body.

Japanese Patent No. 3456235 (Claim 1 etc.) JP 2001-93338 A (Claim 1, paragraph numbers 0005, 0011, 0013, FIG. 2, etc.) JP 2002-208447 A (Claim 1, paragraph numbers 0011 to 0015, FIG. 29, etc.) JP 2001-84842 A (Claims 1, 14 to 17, paragraph number 0033, FIG. 1, etc.)

  In the anisotropic conductive sheet disclosed in Patent Document 1, it is necessary to prevent measurement from being adversely affected by leakage current flowing between two adjacent conductive portions. For this reason, the member located between two adjacent electroconductive parts is comprised from the insulating material. In other words, except for the conductive portion, the anisotropic conductive sheet is made of an insulating material. Therefore, in the measurement using the anisotropic conductive sheet, a charge charged due to static electricity may cause electrostatic breakdown of the circuit board to be inspected. In order to cope with this, it is necessary to adopt a structure that is difficult to be charged.

Further, in the anisotropic conductive sheet disclosed in Patent Documents 2 and 3, it is necessary to newly provide a static elimination layer on the sheet body. For this reason, when manufacturing the anisotropic conductive sheet, it is necessary to newly provide a step of forming a charge removal layer, which causes a reduction in productivity. Furthermore, in the anisotropic conductive sheet disclosed in Patent Document 4, the volume resistance of the semiconductive portion is significantly lower than 10 ¹² Ω · m, which is generally defined as a boundary between an insulator and a semiconductor. There is a possibility that a leakage current flows between the conductive parts, resulting in a decrease in measurement accuracy.

  The present invention has been made in view of the above circumstances, an anisotropic conductive sheet that can suppress charging without providing a static elimination layer, and can reliably suppress leakage current between conductive parts, and It is an object of the present invention to provide a circuit board electrical inspection method and a circuit board electrical inspection apparatus using the same.

The above-mentioned subject is achieved by the following present invention. That is,
The anisotropic conductive sheet of the first aspect of the present invention has a volume resistance exceeding 1.0 × 10 ⁴ Ω · m and a surface resistance in the range of 1.0 × 10 ^{6 to} 1.0 × 10 ¹⁰ , A plurality of openings, a sheet-like base material containing an organic material and a glass cloth, and filled so as to block the openings of the base material, and at least both surfaces near the openings of the base material are continuous. The sheet-like rubber material provided so as to cover and the conductive material extending in the thickness direction of the base material within the opening are unevenly distributed in the rubber material provided so as to close the opening. And a rubber layer substantially composed of a rubber material continuously covering at least one side of the vicinity of the plurality of openings of the substrate. It is characterized by being provided continuously.

The anisotropic conductive sheet of the second aspect of the present invention has a volume resistance exceeding 1.0 × 10 ⁴ Ω · m and a surface resistance in the range of 1.0 × 10 ^{6 to} 1.0 × 10 ¹⁰ Ω. , Having a plurality of openings, filled with a sheet-like base material containing an organic material and glass cloth, and so as to close the openings of the base material, and at least continuously in the vicinity of the plurality of openings in the base material The sheet-like rubber material provided so as to cover and the conductive material extending in the thickness direction of the base material in the opening are unevenly distributed in the rubber material provided so as to close the opening. And at least one convex portion provided at an end portion on one side of the base material, and in the thickness direction of the base material, the protrusion of the surface of the end portion of the conductive portion with respect to the single side surface of the base material The height and the protrusion height of the convex portion are substantially the same.

In one embodiment of the anisotropic conductive sheet of the second aspect of the present invention, it is preferable that the convex portion is a member integrated with the base material.

In one embodiment of the anisotropic conductive sheet of the second aspect of the present invention, it is preferable that the convex portion is a member made of an inelastic material that is separate from the base material.

The circuit board electrical inspection method of the present invention is based on at least a plurality of electrodes to be inspected and an anisotropic conductive sheet of the first to second aspects of the present invention for a circuit board having a plurality of electrodes to be inspected. The circuit board is electrically inspected in a state in which the plurality of conductive portions of any one of the anisotropically conductive sheets selected are electrically connected in correspondence with each other.

  An electrical inspection apparatus for a circuit board according to the present invention includes at least an anisotropic conductive sheet and an inspection apparatus main body. During the electrical inspection, between the inspection apparatus main body and a circuit board including a plurality of electrodes to be inspected. The anisotropic conductive sheet is disposed on the circuit board, and the circuit board is electrically connected between the inspection apparatus main body and the anisotropic conductive sheet and between the anisotropic conductive sheet and the circuit board. It is characterized by conducting an electrical inspection.

  As described above, according to the present invention, an anisotropic conductive sheet that can suppress charging without providing a static elimination layer and can reliably suppress leakage current flowing between conductive parts, and The circuit board electrical inspection method and the circuit board electrical inspection apparatus used can be provided.

It is a schematic cross section which shows the structural example of the principal part of the anisotropically conductive sheet of 1st this embodiment. It is a schematic diagram which shows an example of the whole image of the anisotropically conductive sheet of 1st this embodiment. Here, the upper part in the drawing shows a cross-sectional view, and the lower part shows a perspective view. It is a schematic cross section which shows the structural example of the principal part of the anisotropically conductive sheet of 2nd this embodiment. It is a schematic cross section which shows the structural example of the principal part of the anisotropically conductive sheet of 3rd this embodiment. It is a schematic cross section which shows an example of a structure of the principal part of the anisotropically conductive sheet of 4th this embodiment. It is a schematic cross section which shows the other example of a structure of the principal part of the anisotropically conductive sheet of 4th this embodiment. It is explanatory drawing explaining an example of the manufacturing method of the anisotropically conductive sheet of 1st this embodiment. It is explanatory drawing explaining an example of the manufacturing method of the anisotropically conductive sheet of 1st this embodiment. It is explanatory drawing explaining an example of the manufacturing method of the anisotropically conductive sheet of 1st this embodiment. It is explanatory drawing explaining an example of the manufacturing method of the anisotropically conductive sheet of 1st this embodiment. It is explanatory drawing explaining an example of the manufacturing method of the anisotropically conductive sheet of 3rd and 4th this embodiment. It is a schematic diagram which shows an example of the electrical test | inspection method of the circuit board using the anisotropic conductive sheet of 1st-4th this embodiment.

<Anisotropic conductive sheet of first embodiment>
The anisotropic conductive sheet of the first embodiment includes a sheet-like rubber material, and a plurality of conductive portions that extend in the thickness direction of the sheet and protrude with respect to at least one surface of the sheet. An anisotropic conductive sheet body including conductive particles that are unevenly distributed so as to form, a volume resistance exceeding 1.0 × 10 ⁴ Ω · m, and a surface resistance of 1.0 × 10 ⁶ to 1 0.0 × 10 ¹⁰ Ω, having a plurality of openings corresponding to the plurality of conductive parts, and having at least a sheet-like base material including an organic material and a glass cloth, and the conductive part is The base material is joined to one side of the anisotropic conductive sheet body so as to be disposed in the opening, and the side of the base material on which the anisotropic conductive sheet body is joined in the thickness direction of the base material ( Hereinafter, it may be referred to as the “back surface” and the opposite surface (hereinafter referred to as the “front surface”). And the surface of the end portion of the conductive portion are flush with each other.

In the anisotropic conductive sheet of the first embodiment, the surface resistance of the substrate surface is in the range of 10 ⁶ to 10 ⁹ Ω, and the surface resistance of the substrate composed of only a normal resin material (usually, The surface resistance is lower than that of 10 ¹¹ Ω or more. For this reason, charging can be suppressed without providing a charge removal layer on the surface of the substrate. Therefore, (1) sticking of the circuit board and (2) failure of the inspection apparatus, anisotropic conductive sheet or circuit board due to charging can be suppressed. In addition to this, static elimination processing for avoiding the problems shown in (1) and (2) is not necessary. Furthermore, since it is not necessary to provide a charge removal layer on the surface of the base material, it is possible to suppress a decrease in productivity of the anisotropic conductive sheet.

Further, in the anisotropic conductive sheet of the first embodiment, since the volume resistance of the substrate exceeds 1.0 × 10 ⁴ Ω · m, the anisotropic conductive sheet shown in Patent Document 4 is configured. It has a higher resistance value than the semiconductive portion, and the insulating property of the base material portion is very excellent. And since the electroconductive particle is unevenly distributed in the electroconductive part of an anisotropic electroconductive sheet body and does not exist substantially in the other part, the insulation of this part is also ensured. And the electroconductive part is surrounded by parts other than the electroconductive part of an anisotropic conductive sheet body, and a base material. For this reason, compared with the anisotropic conductive sheet of patent document 4, the anisotropic conductive sheet of 1st this embodiment can suppress reliably that a leak current flows between electroconductive parts.

  Moreover, in the anisotropic conductive sheet of 1st this embodiment, the surface of the edge part of an electroconductive part and the surface of a base material form a flush surface. For this reason, if an opening is provided corresponding to the electrode of the circuit board to be inspected, the electrical connection should be ensured as in the anisotropic conductive sheet described in Patent Document 1. Can do. That is, the connection reliability is high, and the electrical inspection of the circuit board can be performed while ensuring the required positional accuracy.

  FIG. 1 is a schematic cross-sectional view showing a configuration example of a main part of the anisotropic conductive sheet of the first embodiment. An anisotropic conductive sheet 10A (10) shown in FIG. 1 has a base material 20 and an anisotropic conductive sheet body 30A (30). Here, the substrate 20 is provided with a plurality of openings 22. However, in FIG. 1, only one opening 22 and the structure in the vicinity thereof are shown. On the other hand, the anisotropic conductive sheet body 30 </ b> A has one surface 32 bonded to the back surface 24 of the substrate 20 and a part protruding into the opening 22. The anisotropic conductive sheet 30A includes a rubber material and conductive particles 34 that are unevenly distributed in the rubber material, and a region in which the conductive particles 34 are unevenly distributed in the rubber material is provided. A conductive portion 40A (40) is formed. In addition, the area | region where the electroconductive particle 34 is unevenly distributed and does not exist forms the insulating part 42B (42). In FIG. 1, two dotted lines L extending in the thickness direction of the anisotropic conductive sheet body 30 </ b> A mean boundaries where the concentration of the conductive particles 34 rapidly changes in a matrix made of a rubber material. A region surrounded by two dotted lines L is a conductive portion 40A, and both sides of the conductive portion 40A are insulating portions 42. The conductive portion 40A extends in the thickness direction of the anisotropic conductive sheet body 30A, protrudes with respect to one side 32 of the anisotropic conductive sheet body 30A, and one side of the anisotropic conductive sheet body 30 of the conductive portion 40A. A portion protruding with respect to 32 is disposed in the opening 22. And the surface 26 of the base material 20 and the surface 44 of the edge part of 40 A of conductive parts are flush. In the example shown in FIG. 1, the conductive portion 40 </ b> A is located in the opening 22, but is not in contact with the inner wall surface of the opening 22, but the conductive portion 40 </ b> A is in contact with the inner wall surface of the opening 22. May be.

  FIG. 2 is a schematic diagram showing an example of the whole image of the anisotropic conductive sheet of the first embodiment, in which the upper part in FIG. 2 shows a cross-sectional view and the lower part shows a perspective view. In FIG. 2, the same components as those shown in FIG. For convenience of description with different scales, FIG. 2 is simplified from FIG.

  In the example shown in the upper part of FIG. 2, the anisotropic conductive sheet body 30 </ b> A has the back surface 24 side of the base material 20 so as to continuously cover only the back surface 24 side portion in the vicinity of the opening portion 22 of the base material 20. Placed in. Further, the surface 36 of the anisotropic conductive sheet 30A opposite to the side on which the base material 20 is disposed is provided such that the conductive portion 40A forms a convex portion with respect to the insulating portion 42 as shown in FIG. However, the insulating portion 43 and the conductive portion 40A may be flush with each other. Moreover, you may provide the opening part 28 for facilitating positioning and fixing of 10 A of anisotropic conductive sheets in the both-ends part of the base material 20 at the time of the electrical test | inspection of a circuit board. The lower part of FIG. 2 is a perspective view of the anisotropic conductive sheet 10 </ b> A shown in the upper part as viewed from the surface side of the substrate 20. In the example shown in the lower part of FIG. 2, 18 conductive portions 40A arranged in a 3 × 6 grid are provided so as to be positioned in the opening 22, and are provided on both sides of the second row line. Each of the openings 28 is arranged. Here, the cut surface between reference numerals A1-A2 in the lower part of FIG. 2 corresponds to the cross-sectional view shown in the upper part of FIG.

<Anisotropic conductive sheet of second embodiment>
In the anisotropic conductive sheet of the second embodiment, in the thickness direction of the base material, the surface (back surface) opposite to the surface (back surface) on the side where the anisotropic conductive sheet body of the base material is bonded is provided. On the other hand, it has the same configuration as the anisotropic conductive sheet 10A of the first embodiment except that the surface of the end portion of the conductive portion protrudes in the range of more than 0 μm and not more than 100 μm.

And the anisotropic conductive sheet of 2nd this embodiment is in the range whose surface resistance of a base-material surface is 10 < ⁶ > -10 < ⁹ > (omega | ohm) similarly to the anisotropic conductive sheet of 1st this embodiment. . For this reason, charging can be suppressed without providing a charge removal layer on the surface of the substrate. In the anisotropic conductive sheet of the second embodiment, the volume resistance of the substrate exceeds 1.0 × 10 ⁴ Ω · m, and the insulation is extremely high. And since the electroconductive particle is unevenly distributed in the electroconductive part of an anisotropic electroconductive sheet body and does not exist substantially in the other part, the insulation of this part is also ensured. And the electroconductive part is surrounded by parts other than the electroconductive part of an anisotropic conductive sheet body, and a base material. For this reason, it can suppress reliably that a leak current flows between electroconductive parts.

  In the anisotropic conductive sheet of the second embodiment, the surface of the end portion of the conductive portion protrudes within the range of more than 0 μm and not more than 100 μm with respect to the surface of the base material. For this reason, compared with the anisotropic conductive sheet 10A of the first embodiment, the anisotropic conductive sheet of the second embodiment further stabilizes the contact of the conductive portion with the member on the inspection head side. Can do. In addition, although the protrusion height of the surface of the edge part of the electroconductive part with respect to the surface of a base material needs to be more than 0 micrometer and 100 micrometers or less, 10 micrometers or more and 90 micrometers or less are preferable, and 30 micrometers or more and 70 micrometers or less are more preferable. By making the protrusion height exceed 0 μm, it is possible to further improve the contact stability of the conductive portion with respect to a member (such as a performance board or an adapter socket) disposed to face the surface of the substrate. In addition, by setting the protruding height to 100 μm or less, the displacement of the conductive portion with respect to the member disposed opposite to the surface of the base material due to the bending deformation of the end portion of the conductive portion is suppressed, and anisotropic conduction is performed during measurement. When a pressure is applied to the conductive sheet, a moderate partial contact between the member disposed opposite to the surface of the base material and the surface of the base material occurs, thereby charging the anisotropically conductive sheet with the charged base material. It is possible to easily escape to a member arranged opposite to the surface. For this reason, charging can be suppressed without providing a charge removal layer on the surface of the substrate.

  FIG. 3 is a schematic cross-sectional view showing a configuration example of a main part of the anisotropic conductive sheet of the second embodiment. In FIG. 3, components having the same / similar functions and configurations as those shown in FIGS. 1 and 2 are denoted by the same reference numerals. In the anisotropic conductive sheet 30 </ b> B (30) shown in FIG. 3, the surface 44 at the end of the conductive portion 40 </ b> B (40) has a height H in the thickness direction of the base 20. Only the point which protrudes differs from the anisotropic conductive sheet body 30A shown in FIG. Except for this point, the anisotropic conductive sheet 30A shown in FIG. 1 and the anisotropic conductive sheet 30B shown in FIG. 3 have the same configuration. Note that the height H shown in FIG. 3 is in the range of more than 0 μm and not more than 100 μm.

<Anisotropic conductive sheet of third embodiment>
The anisotropic conductive sheet of the third embodiment has a volume resistance exceeding 1.0 × 10 ⁴ Ω · m, a surface resistance in the range of 10 ⁶ to 10 ⁹ Ω, and a plurality of openings. And a sheet-like base material including an organic material and a glass cloth, and the base material is filled so as to close the openings of the base material, and is provided so as to continuously cover at least both surfaces in the vicinity of the openings of the base material. Sheet-like rubber material and conductive particles that are unevenly distributed in the rubber material provided so as to close the opening so as to form a conductive part extending in the thickness direction of the base material in the opening. And a rubber layer substantially composed of a rubber material continuously covering at least one side near the plurality of openings of the base material is provided continuously to the surface on the end side of the base material. It is characterized by.

In the anisotropic conductive sheet of the third embodiment, the surface resistance of the substrate surface is in the range of 1.0 × 10 ^{6 to} 1.0 × 10 ¹⁰ Ω, and is composed only of a normal resin material. Compared with the surface resistance of the substrate (usually 1.0 × 10 ¹¹ Ω or more), the surface resistance is low. For this reason, even when the anisotropic conductive sheet is charged by static electricity during measurement of the circuit board, the charge charged in the planar direction of the base material can easily move along the base material surface. Here, the base material 20 constituting the anisotropic conductive sheet is usually provided with an opening 28 for facilitating positioning and fixing as shown in FIG. The pin located inside contacts the substrate 20. In such a case, the charge generated by charging can easily move to the pin along the surface of the substrate. In addition, not only in such an example, in the measurement, the surface portion of the base material that is not covered with the rubber material is in contact with a measuring jig such as a guide socket. For this reason, the electric charge generated by charging can be easily released to the outside of the anisotropic conductive sheet along the surface of the base material. For this reason, charging can be suppressed without providing a charge removal layer on the surface of the substrate.

  In the anisotropic conductive sheet of the third embodiment, both surfaces of the substrate are covered with a rubber material that forms a sheet (or a layer). That is, the anisotropic conductive sheet of the third embodiment is more anisotropically conductive than the anisotropic conductive sheet 10A of the first embodiment and the anisotropic conductive sheet 10B of the second embodiment. The symmetry of the layer structure with respect to the thickness direction of the conductive sheet becomes higher. For this reason, the anisotropic conductive sheet of the third embodiment is warped compared to the anisotropic conductive sheet 10A of the first embodiment and the anisotropic conductive sheet 10B of the second embodiment. Hard to occur. For this reason, variations in electrical connection in the planar direction of the anisotropic conductive sheet are less likely to occur.

  Furthermore, in the anisotropic conductive sheet of the third embodiment, a rubber layer that continuously covers at least one side near the plurality of openings of the base material is continuously provided to the surface on the end side of the base material. It has been. For this reason, if the measurement is performed with the anisotropic conductive sheet disposed with the surface provided with the rubber layer as the lower surface, the anisotropic conductive sheet is used for the purpose of preventing misalignment and fixing of the anisotropic conductive sheet. Even if a heavy block-shaped fixing member made of resin, metal, or the like is arranged on the outer peripheral edge of the upper surface of the conductive sheet, the anisotropic conductive sheet can be prevented from warping so as to protrude upward. .

  FIG. 4 is a schematic cross-sectional view showing a configuration example of a main part of the anisotropic conductive sheet of the third embodiment. 4 that have the same / similar functions and configurations as those shown in FIGS. 1 to 3 are denoted by the same reference numerals.

  An anisotropic conductive sheet 10 </ b> C (10) shown in FIG. 4 is filled so as to block the base material 20 and the openings 22 of the base material 20, and at least both surfaces 24 near the plurality of openings 22 of the base material 20. , 26 and the sheet-like rubber material (rubber matrix 50) provided so as to continuously cover the opening 22 so as to form a conductive portion 40C (40) extending in the thickness direction in the opening 22. Conductive particles 34 that are unevenly distributed in the rubber material. In the rubber matrix 50, regions where the conductive particles are unevenly distributed and do not exist form insulating portions 42 (42T, 42B). Here, the insulating portion 42 includes an insulating portion 42B located on the back surface 24 side of the base material 20 and an insulating portion 42T located on the front surface 24 side of the base material 20. A rubber layer 42T (insulating portion 42T) substantially composed of a rubber material that continuously covers at least one side (surface 26 side) in the vicinity of the plurality of openings 22 of the base material 20 is provided at the end of the base material 20. It is provided continuously up to the surface 26E on the part 20E side.

  The thickness of the rubber layer 42T is not particularly limited, but is preferably in the range of 20 μm to 100 μm, and preferably in the range of 40 μm to 60 μm. By setting the thickness of the rubber layer 42T to 20 μm or more, the warpage of the anisotropic conductive sheet 10C can be further suppressed. Further, by setting the thickness of the rubber layer 42T to 100 μm or less, a heavy block-shaped fixing member or the like is disposed on the back surface 24E of the end portion 20E of the base member 20 of the anisotropic conductive sheet 10C at the time of measurement. However, the rubber layer 42E located at the end of the anisotropic conductive sheet 10C is greatly elastically deformed, and the film thickness is unlikely to be thin. That is, due to the deformation that the rubber layer 42E is thinned, the end portion 20E of the base material 20 is deformed so as to sink into the surface 26 side of the base material 20, and the anisotropic conductive sheet 10C becomes the back surface of the base material 20. It can prevent more reliably that it curves so that it may become convex on the 26th side.

  In the example shown in FIG. 4, the surface 44 at the end of the conductive portion 40C and the surface 46 of the rubber layer 42T are formed to be flush with each other. However, the surface 44 of the end portion of the conductive portion 40C may be protruded in the range of more than 0 μm and 100 μm or less with respect to the surface 46 of the rubber layer 42T with respect to the thickness direction of the base material 20. In this case, similarly to the anisotropic conductive sheet 10B of the second embodiment, the contact of the conductive portion 40C with a member (such as a performance board or an adapter socket) disposed to face the surface 46 of the rubber layer 42T is further stabilized. Can be made. In this case, the surface 46 of the rubber layer 42E positioned at the end of the anisotropic conductive sheet 10C is also electrically conductive with respect to the surface 46 of the rubber layer 42 positioned other than the end of the anisotropic conductive sheet 10C. It is preferable to project the portion 44C by substantially the same height as the surface 44 of the portion 40C. In this case, there is almost no height difference between the surface 44 of the conductive portion 40C and the surface 46E of the rubber layer 42E located at the end of the anisotropic conductive sheet 10C in the thickness direction of the base material 20. For this reason, even when a heavy block-like member such as a guide socket is disposed on the back surface 24E of the end portion 20E of the base material 20 of the anisotropic conductive sheet 10C, the end portion of the anisotropic conductive sheet 10C is measured. However, since there is no height difference between the surface 44 of the conductive portion 40C and the surface 46E of the rubber layer 42E, it is difficult to be deformed so as to sink into the surface 26 side of the base material 20. Therefore, it is possible to more reliably prevent the anisotropic conductive sheet 10 </ b> C from warping so as to protrude toward the back surface 26 side of the base material 20.

<Anisotropic conductive sheet of the fourth embodiment>
In the anisotropic conductive sheet of the fourth embodiment, the anisotropic conductive sheet 10C of the third embodiment is continuous on at least one surface (surface 26) side in the vicinity of the plurality of openings 22 of the substrate 20. A rubber layer 42T substantially composed of a rubber material covering the substrate 20 is provided continuously to the surface 26E on the end portion 20E side of the base material 20, instead of the end portion (surface 26E) on one side of the base material 20. ) Is characterized in that a convex portion is provided. Here, in the thickness direction of the base material 20, the protruding height of the surface 44 at the end of the conductive portion 40 </ b> C and the protruding height of the convex portion with respect to one surface (surface 26) of the base material 20 are substantially the same. Except for the above points, the other basic configuration of the anisotropic conductive sheet of the fourth embodiment is the same as that of the anisotropic conductive sheet 10C of the third embodiment.

  For this reason, the anisotropic conductive sheet of the fourth embodiment can basically obtain substantially the same effect as the anisotropic conductive sheet 10C of the third embodiment. Here, the convex portion provided on at least one surface on the end 20E side of the substrate 20 has substantially the same effect as the rubber layer 42T in the anisotropic conductive sheet 10C of the third embodiment. . This convex portion is preferably a member that is integrated with the base material 20 or a member that is made of an inelastic material that is separate from the base material 20.

  FIG. 5 is a schematic cross-sectional view showing an example of the configuration of the main part of the anisotropic conductive sheet of the fourth embodiment. Specifically, the convex part is a member that is integrated with the base material 20. It is a figure explaining about. FIG. 6 is a schematic cross-sectional view showing another example of the configuration of the main part of the anisotropic conductive sheet of the fourth embodiment. Specifically, the convex part is separate from the base material 20. It is a figure explaining the case where it is a member comprised from the inelastic material which comprises. 5 and 6, the same reference numerals are given to the components having the same or similar functions and configurations as those shown in FIGS. 1 to 4. In the anisotropic conductive sheet 10 </ b> D (10) shown in FIG. 5, a convex portion 20 </ b> P made of a member integrated with the base material 20 is provided on the surface 26 side of the end 20 </ b> E of the base material 20. Further, in the anisotropic conductive sheet 10E (10) shown in FIG. 6, a protrusion made of a member made of an inelastic material that is separate from the base material 20 is provided on the surface 26 side of the end portion 20E of the base material 20. A part 60P is provided. The structures of the anisotropic conductive sheet 10D and the anisotropic conductive sheet 10E are the same as the anisotropic conductive sheet 10C shown in FIG. 4 except that the structure on the end 20E side of the substrate 20 is different. .

  Since the convex portion 20P made of a member that is integrated with the base material 20 includes a glass cloth that is an inelastic material, as in the case of the base material 20, if the organic material constituting the base material 20 is a rubber material, the rubber layer If it is hard to elastically deform compared with 42E and the organic material which comprises the base material 20 is resin materials, such as a hard plastic, elastic deformation will not arise. Moreover, since the convex part 60P is a member comprised from an inelastic material, elastic deformation does not arise. For this reason, even when a block member having a weight such as a guide socket is disposed on the back surface 24E of the end portion 20E of the base member 20 of the anisotropic conductive sheet 10D or 10E, the anisotropic conductive sheet 10D is measured. The convex portions 20P and 60P located at the end of 10E are hardly deformed or not deformed at all. For this reason, the end portion 20E of the base material 20 is deformed so as to sink into the surface 26 side of the base material 20, and compared with the anisotropic conductive sheet 10C shown in FIG. In the directionally conductive sheets 10 </ b> D and 10 </ b> E, it is possible to prevent the warp so as to be convex toward the back surface 26 side of the substrate 20 even more reliably.

  Here, as the inelastic material constituting the convex portion 60P, a known hard plastic such as an epoxy resin, an insulating inorganic material such as ceramics or glass, a metal, or the like can be used. In the example shown in FIGS. 5 and 6, the protruding height of the surface 44 of the end portion of the conductive portion 40 </ b> C with respect to the surface 26 of the base material 20 (hereinafter sometimes referred to as “conductive portion protruding height”); The protrusion height of the protrusions 20P and 60P with respect to the surface 26 of the base material 20 (hereinafter may be referred to as “projection protrusion protrusion height”) is the same as the thickness of the rubber layer 42T. However, with respect to the thickness of the rubber layer 42T, the conductive portion protruding height and the protruding portion protruding height may exceed the thickness of the rubber layer 42T and be within the range of the thickness of the rubber layer 42T + 100 μm or less. In this case, as in the anisotropic conductive sheet 10B of the second embodiment shown in FIG. 3, the contact of the conductive portion 40C with the member arranged to face the surface 46 of the rubber layer 42T can be further stabilized. it can.

<Conductive part and insulating part>
Next, the detail of a structure of each part of the anisotropic conductive sheet 10 (10A, 10B, 10C, 10D, 10E) of the first to fourth embodiments will be described. First, as a rubber material that is a matrix material constituting the conductive portion 40 (40A, 40B, 40C) and the insulating portion 42 (the insulating portion 42T (or the rubber layer 42T), the insulating portion 42B), a known rubber material can be used. For example, silicone rubber, polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, acrylonitrile-butadiene copolymer rubber, ethylene-propylene copolymer rubber, urethane rubber, polyester rubber, chloroprene rubber, And epichlorohydrin rubber. Of these, silicone rubber is preferred as the rubber material.

  The conductive particles 34 that are unevenly distributed in the conductive portion 40 are not particularly limited as long as at least the surface thereof is composed of a conductive material and has magnetic properties as a whole. It is preferable to have particles and a coating layer that covers the core particles. Here, as the core material particles, magnetic particles containing a material exhibiting magnetism or nonmagnetic particles made of only a nonmagnetic material can be used. Here, as magnetic particles, for example, particles made of metals such as nickel, iron, cobalt, and alloys thereof can be used, and as nonmagnetic particles, nonmagnetic metal particles, glass beads, resin particles, and the like can be used. On the other hand, as the coating layer, when using magnetic particles as the core material particles, for example, a conductive material such as gold, silver, palladium, rhodium is used, and when using non-magnetic particles as the core material particles, For example, a conductive magnetic material such as nickel or cobalt is used. Here, the coating layer can be formed on the surface of the core material particles by a known coating method such as a plating method. In addition, it is preferable to use nickel particles as the core material particles and silver as the coating layer from the viewpoint of achieving a balance between cost, conductive performance, and corrosion resistance.

  The average particle diameter of the conductive particles 34 is not particularly limited, but is preferably in the range of 10 μm to 100 μm from the practical viewpoint, such as ensuring electrical contact between the conductive particles 34 in the conductive portion 40, and 20 μm. A range of ˜80 μm is more preferable.

  Further, the volume ratio of the conductive particles 34 in the conductive portion 40 can exhibit a conductive characteristic (pressurized conductivity) in which the resistance value decreases when the conductive portion 40 is pressurized in the thickness direction. Although it will not specifically limit if it is 3 volume% or more and 30 volume% or less, 5 volume% or more and 20 volume% or less are more preferable. By setting the volume ratio within the above range, pressurization conductivity can be expressed within a pressure range suitable for electrical inspection of the circuit board. The conductive particles 34 may exist in the insulating portion 42, but the volume ratio exhibits pressure conductivity in order to prevent leakage current from flowing between the adjacent conductive portions 40. Allowed only to the extent that it is not. For this reason, no leakage current flows between the conductive parts 40 adjacent to each other via the insulating part 42. It is particularly preferable that the conductive particles 34 are not substantially present in the insulating portion 42.

  As the total thickness of the conductive portion 40 (for example, the length corresponding to the symbol D shown in the upper part of FIG. 2), the conductivity suitable for the electrical inspection is within the pressure range suitable for the electrical inspection of the circuit board. From the viewpoint of obtaining it, a range of 0.1 mm to 5 mm is preferable, and a range of 0.3 mm to 3 mm is more preferable.

<Base material>
The substrate 20 used in the anisotropic conductive sheet 10 of the first to fourth embodiments has a volume resistance exceeding 1.0 × 10 ⁴ Ω · m and a surface resistance of 1.0 × 10 ⁶ Ω to This is a sheet-like member having a plurality of openings 22 corresponding to the plurality of conductive portions 40 within a range of 1.0 × 10 ¹⁰ Ω. Here, the surface resistance means a value measured according to JIS K 6911. Moreover, volume resistance means the value (value measured by the double ring method) measured based on JISK6911. The surface resistance of the substrate 20 needs to be in the range of 1.0 × 10 ⁶ Ω to 1.0 × 10 ¹⁰ Ω, but is 1.0 × 10 ⁶ Ω to 1.0 × 10 ⁹ Ω. Within the range, 1.0 × 10 ⁶ Ω to 1.0 × 10 ⁷ Ω is more preferable. By making the surface resistance within the above range, it is possible to suppress the leakage current that adversely affects the electrical low measurement of the circuit board and to prevent the anisotropic conductive sheet from being generated even when static electricity occurs during the electrical measurement of the circuit board. Can be suppressed. Moreover, although the volume resistance of the base material 20 is required to exceed 1.0 × 10 ⁴ Ω · m, it is practically 2.0 × 10 ⁴ Ω · m from the viewpoint of material availability. It is preferably within the range of 10 ¹⁰ Ω · m. By setting the volume resistance within the above range, leakage current can be reliably suppressed from flowing between the conductive portions 40 via the base material 20.

  Moreover, as a main material which comprises the base material 20, an organic material and glass cloth are used. Specifically, at least one selected from thermoplastic resins, thermosetting resins, and rubber materials can be used as the organic material. Known organic materials can be used. Here, as the thermoplastic resin, for example, polyethylene terephthalate resin, vinyl chloride resin, polystyrene resin, polyacrylonitrile resin, polyethylene resin, acrylic resin, polybutadiene resin and the like can be used, and as the thermosetting resin, for example, polyimide resin An epoxy resin or the like can be used, and as the rubber material, for example, a rubber material similar to that exemplified as the matrix material constituting the conductive portion 40 and the insulating portion 42 can be used. In the present specification, the “glass cloth” means a glass fabric, an unwoven glass fabric, or a mixture thereof.

Here, as a base material which has volume resistance and surface resistance as mentioned above, and is comprised from an organic material and glass cloth, L-6706 by Nikkan Kogyo Co., Ltd. is mentioned, for example. Here, the surface resistance measured based on JIS K 6911 of L-6706 is in the range of 10 ⁶ Ω to 10 ⁹ Ω (product catalog value of L-6706 provided by Nikkan Kogyo Co., Ltd.). The volume resistance of L-6706 measured according to JIS K 6911 using Hiresta UP MCP-HT450 (manufactured by Mitsubishi Chemical Corporation, using a URS probe as a probe) is 2.17 × 10 ⁴ to 4. It is 87 × 10 ⁴ Ω · m.

For reference, the present inventors have investigated and examined the volume resistance and surface resistance of various types of sheets when studying the present invention. As a result, the surface resistance of a resin sheet made of only an epoxy resin or only a silicone resin, which is a typical organic insulating material, is 1.0 × 10 ¹¹ Ω or more, and the volume resistance is 1.0 × 10 ¹⁴ Ω.・ It was m. In addition, the volume resistance and surface resistance of other commercially available sheets containing organic materials other than L-6706 and related series and glass cloth are also presumed to be substantially the same as the resin sheet. On the other hand, the semiconductive portion shown in Patent Document 4 is composed of a base material made of a polymer material containing a semiconductivity imparting substance or a polymer material showing semiconductivity. The volume resistance is 10 ⁻⁷ Ω · m to 10 ⁴ Ωm, and the surface resistance is 10 ⁻¹ to 10 ¹⁰ Ω. However, the base material 20 used for the anisotropic conductive sheet 10 of the first to fourth embodiments is a combination of surface resistance and volume resistance, and the above-described resin sheet, commercially available organic material, and glass cloth are used. Or a combination different from the semiconductive portion shown in Patent Document 4 is used.

  Although it does not specifically limit as thickness of the base material 20, The inside of the range of 0.01 mm-0.8 mm is preferable, and the inside of the range of 0.02-0.2 mm is more preferable. By setting the thickness of the base material 20 to 0.01 mm or more, the displacement of the conductive portion 40 based on the molding strain generated during the molding of the anisotropic conductive sheet 10 of the first to fourth embodiments is produced. Can be within a range that can sufficiently withstand the electrical inspection of the circuit board. Further, by setting the thickness of the base material 20 to 0.8 mm or less, effective conductivity can be obtained even with a small pressure. In addition, the thickness of the base material 20 in the example shown in FIG. 5 means thickness other than the part in which the convex part 20P was provided.

<Method for producing anisotropic conductive sheet>
Next, a method for manufacturing the anisotropic conductive sheet 10 according to the first to fourth embodiments shown in FIGS. 1 to 6 will be described. For manufacturing the anisotropic conductive sheet 10 of the first to fourth embodiments, for example, the manufacturing technique disclosed in Patent Document 1 can be used as it is or after being appropriately modified.

  Below, an example of the manufacturing method of 10 A of anisotropic conductive sheets of 1st this embodiment is demonstrated. 7-10 is explanatory drawing explaining an example of the manufacturing method of 10 A of anisotropic conductive sheets of 1st this embodiment, and is the same as FIGS. 1-6 in FIGS. 7-10. The same reference numerals are given to the objects.

  First, a plurality of openings 22 are formed by laser processing or the like using a sheet including a commercially available organic material and glass cloth. Moreover, you may form the opening part 28 as needed. Thereby, the base material 20 is obtained. Next, as shown in FIG. 7, the surface 26 near the opening 22 of the base material 20 is covered with an adhesive sheet 100 </ b> A having a smooth surface and a uniform thickness. Furthermore, as shown in FIG. 8, two such base materials 20 with the pressure sensitive adhesive sheet 100 </ b> A are used, and the surfaces of the base material 20 that are not covered with the pressure sensitive adhesive sheet are arranged between the openings 22 of the base materials 20. Align so that they face each other. Then, a raw material mixture 102 containing a rubber raw material and conductive particles 34 (not shown in FIG. 8) is disposed between these two base materials 20 in a layered manner. Thereby, the work-in-process 110 for the pressurization process and magnetic field application process implemented at a next process can be obtained.

  Next, as shown in FIG. 9, the work-in-progress 110 is placed between the upper mold 120 and the lower mold 122 and pressed against the thickness direction of the base material 20, thereby bringing the raw material mixture 102 into the base material. Stretch in 20 plane directions. At the same time as the pressurization, a magnetic field (not shown in FIG. 9) is applied in which the direction of the magnetic lines of force is substantially parallel to the thickness direction of the substrate 20. In addition, on the pressing surface side of the upper mold 120 and the lower mold 122, a portion corresponding to the opening 22 is constituted by a ferromagnetic portion M, and the other portion is constituted by a non-magnetic portion N at the time of pressurization. Are each provided with a magnetic pole plate 120A and a magnetic pole plate 122A.

  Then, by applying a magnetic field, the raw material mixture 102 is cured while orienting the conductive particles 34 (not shown in FIG. 9) in the thickness direction of the substrate 20. Thus, a laminate composed of two substrates 20 with adhesive sheets 100A as shown in FIG. 10 and a cured layer 102H formed by curing the raw material mixture 102 between the substrates 20 with adhesive sheets 100A. A body 130 is obtained. Thereafter, the anisotropic conductive sheet 10 </ b> A can be obtained by removing one base material 20 constituting the laminate 130 and the pressure-sensitive adhesive sheet 100 </ b> A bonded to the other base material 20.

  In addition, when manufacturing the anisotropic conductive sheet 10B of 2nd this embodiment, the thing by which the recessed part was previously formed in the part corresponding to the opening part 22 as the adhesive sheet 100A can be utilized. In addition, after preparing the base material 20 with the adhesive sheet 100A shown in FIG. 7, the surface of the adhesive sheet 100A exposed to the opening 22 is pressed with a pin or the like, or is etched. For example, the recess may be formed. And except this point, the anisotropic conductive sheet 10B of the second embodiment can be obtained by manufacturing in the same manner as the anisotropic conductive sheet 10A of the first embodiment.

  Further, when the anisotropic conductive sheets 10C, 10D, and 10E of the third and fourth embodiments shown in FIGS. 4 to 6 are manufactured, in order to perform the pressurizing process and the magnetic field applying process shown in FIG. For example, the work in process described below can be used. First, the work-in-process 110 shown in FIG. 8 is prepared, and the two base materials 20 are joined using the raw material mixture 102 as an adhesive. Next, after peeling off the adhesive sheet 100A on one side, the raw material mixture 102 is thinly applied to the surface of the substrate 20 on the side where the adhesive sheet 100A is peeled off. Thereafter, a release sheet is joined so as to cover the thinly applied raw material mixture 102, whereby the release layer 100B, the first layer 102A made of the raw material mixture 102, The work-in-process 110B laminated | stacked in order of the 2nd layer 102B which consists of the material 20, the raw material mixture 102, the base material 20, and the adhesive sheet 100A is obtained (FIG. 11). In addition, when using what has the convex parts 20P and 60P as the base material 20, the convex parts 20P and 60P are made into the 1st layer by arrange | positioning the release sheet 100B on the convex parts 20P and 60P. It can also function as a spacer when forming 102A. And this work-in-process 110B is arrange | positioned between the upper mold | type 120 and the lower mold | type 122, and a pressurizing process and a magnetic field application process are performed.

  Here, as the releasable sheet 110B, a cured product obtained by curing the raw material mixture 102, such as a resin sheet made of Teflon (registered trademark) having a low surface tension, a sheet whose surface is coated with a silane coupling agent, or the like. Those having excellent releasability with respect to 108 can be used. The first layer 102A constituting the work-in-process 110B is a portion that can be the rubber layer 42T (insulating portion 42T), and the second layer 102B is a portion that can be the insulating portion 42B.

  Then, in place of the work-in-process 110A shown in FIG. 9, the work-in-process 110B shown in FIG. 11 is used to perform the pressure treatment and the magnetic field application process, and the raw material mixture 102 is cured. In addition, when releasability is imparted to the pressing surface of the upper mold 120 or the lower mold 122, the work-in-progress 110B from which the releasable sheet 100B is omitted may be used. Thereafter, by removing the releasable sheet 100B, the pressure-sensitive adhesive sheet 100A, and the base material 20 in contact with the pressure-sensitive adhesive sheet 100A from the laminate obtained by curing the raw material mixture 102, FIGS. The anisotropic conductive sheets 10C, 10D, and 10E of the third or fourth embodiment shown can be obtained. Depending on whether the anisotropic conductive sheet 10C, the anisotropic conductive sheet 10D, or the anisotropic conductive sheet 10E is manufactured, the projecting portions 20P and 60P are provided on the end portion 20E. Any one selected from the base material 20 not having, the base material 20 having the convex portion 20P at the end portion 20E, and the base material 20 having the convex portion 60P at the end portion 20E is appropriately selected and used.

<Electrical Inspection Method and Electrical Inspection Device for Circuit Board>
The electrical inspection of the circuit board using the anisotropic conductive sheet 10 of the first to fourth embodiments is different from at least a plurality of electrodes to be inspected with respect to a circuit board having a plurality of electrodes to be inspected. This is performed in a state where the plurality of conductive portions 40 of the side conductive sheet 10 are electrically connected to each other. Here, the electrical inspection apparatus for the circuit board includes at least the anisotropic conductive sheet 10 of the first to fourth embodiments and an inspection apparatus main body. The anisotropic conductive sheet 10 is disposed between the circuit board provided with the electrode to be inspected, the inspection apparatus main body and the anisotropic conductive sheet 10, and the anisotropic conductive sheet 10 and the circuit board. The circuit board is electrically inspected with the electrical connection between

  FIG. 12 is a schematic diagram illustrating an example of an electrical inspection method for a circuit board using the anisotropic conductive sheets of the first to fourth embodiments. Here, in FIG. 12, the anisotropic conductive sheet 10 is illustrated with a simplified structure. As shown in FIG. 12, when an electrical inspection of a circuit board 200 such as an IC package to be measured is performed, a test head 210 electrically connected to a tester (not shown) and the test head 210 are arranged on the test head 210. At the same time, a performance board (measurement board) 220 electrically connected to the test head 210 and an adapter socket 230 arranged on the performance board 220 and electrically connected to the performance board 220 are used. In measurement, the anisotropic conductive sheet 10 is placed on the adapter socket 230 so that the surface 26 side of the base material 20 or the surface 46 side of the rubber layer 42T is the lower surface. In the example shown in FIG. 12, the tester (not shown), the test head 210, the performance board 220, and the adapter socket 230 constitute an inspection apparatus main body.

  A plurality of upper surface side electrodes (not shown in the figure) are provided on the upper surface side of the adapter socket 230 at positions corresponding to the plurality of conductive portions 40 of the anisotropic conductive sheet 10. The lower surface side electrodes (not shown in the drawing) that are electrically connected to form a pair with these upper surface side electrodes and have a different arrangement pitch in the plane direction from the upper surface side electrodes are connected to the adapter socket 230. It is also arranged on the lower surface side. A plurality of electrodes (not shown in the figure) are provided on the upper surface side of the performance board 220 at positions corresponding to the lower surface side electrodes of the adapter socket 230. In addition, if the arrangement pitch in the plane direction of the electrode provided on the upper surface side of the performance board 220 and the conductive portion 40 of the anisotropic conductive sheet 10 is the same, the adapter board 230 is not used and the performance board 220 Alternatively, the anisotropic conductive sheet 10 may be disposed.

  Here, the anisotropic conductive sheet 10 is electrically connected to each conductive portion 40 (portion indicated by a black vertical line in FIG. 12) and the upper surface side electrode of the adapter socket 230. It is installed on the adapter socket 230. A guide socket 240 is disposed on the upper surface of the outer peripheral portion of the anisotropic conductive sheet 10. The guide socket 240 has a hollow portion 242. In measurement, the circuit board 200 is disposed on the upper surface of the anisotropic conductive sheet 10 so that the circuit board 200 is fitted into the hollow portion of the guide socket 240. At this time, the individual electrodes (not shown in the figure) on the lower surface side of the circuit board 200 are in contact with each other so as to correspond to the individual conductive portions 40 exposed on the upper surface side of the anisotropic conductive sheet 10. In this state, the circuit board 200 is pressed from above by a pressing member (not shown in the drawing). At this time, the conductive portion 40 is also pressurized, and pressure conductivity is developed in the conductive portion 40, so that the circuit board 200 can be electrically inspected.

10, 10A, 10B, 10C, 10D, 10E Anisotropic conductive sheet 20 Base material 20P Protruding portion 20E Base material end 22 Opening portion 24, 24E Back surface 26, 26E Front surface 28 Opening portion 30, 30A, 30B Anisotropic conductivity Conductive sheet body 32 One side 34 (of anisotropic conductive sheet body) Conductive particles 36 Surface 40, 40A, 40B, 40C opposite to the side on which the base material of the anisotropic conductive sheet body is disposed Conductive portions 42, 42B Insulating part 42T, 42E Insulating part (rubber layer)
44 (conductive part) surface 46, 46E (rubber layer) surface 50 rubber matrix 60P convex part 100A adhesive sheet 100B releasable sheet 102 raw material mixture 102A first layer 102B second layer 102H cured layer 110A, 110B Work in process 120 Upper mold 120A Pole plate 122 Lower mold 122A Pole plate 200 Circuit board 210 Test head 220 Performance board (measurement board)
230 Adapter socket 240 Guide socket 242 Hollow part

Claims (6)

The volume resistance exceeds 1.0 × 10 ⁴ Ω · m, the surface resistance is in the range of 1.0 × 10 ^{6 to} 1.0 × 10 ¹⁰ Ω, has a plurality of openings, an organic material and glass A sheet-like base material including cloth;
A sheet-like rubber material that is filled so as to close the opening of the base material and is provided so as to continuously cover at least both surfaces in the vicinity of the plurality of openings of the base material;
Conductive particles that are unevenly distributed and dispersed in the rubber material provided so as to close the opening so as to form a conductive part extending in the thickness direction of the base material in the opening.
Further, a rubber layer substantially composed of the rubber material that continuously covers at least one side in the vicinity of the plurality of openings of the base material is continuously provided up to the end side surface of the base material. An anisotropic conductive sheet characterized by comprising: The volume resistance exceeds 1.0 × 10 ⁴ Ω · m, the surface resistance is in the range of 1.0 × 10 ^{6 to} 1.0 × 10 ¹⁰ Ω, has a plurality of openings, an organic material and glass A sheet-like base material including cloth;
A sheet-like rubber material that is filled so as to close the opening of the base material and is provided so as to continuously cover at least both surfaces in the vicinity of the plurality of openings of the base material;
Conductive particles that are unevenly distributed in the rubber material provided to close the opening so as to form a conductive part extending in the thickness direction of the base material in the opening, and
And at least a convex portion provided at an end portion on at least one side of the base material,
The anisotropic conductivity characterized in that, in the thickness direction of the base material, the protruding height of the surface of the end portion of the conductive portion with respect to the one surface of the base material is substantially the same as the protruding height of the convex portion. Sheet. In the anisotropic conductive sheet according to claim 2 ,
The anisotropic conductive sheet, wherein the convex part is a member integrated with the base material. In the anisotropic conductive sheet according to claim 2 ,
The anisotropic conductive sheet, wherein the convex portion is a member made of an inelastic material that is separate from the base material. Each the circuit board having a plurality of electrodes to be inspected, at least, a plurality of conductive portions of the anisotropically conductive sheet according to any one of claims 1-4 and said plurality of electrodes to be inspected An electrical inspection method for a circuit board, wherein the electrical inspection of the circuit board is performed in a state of being electrically connected in correspondence. The anisotropic conductive sheet according to any one of claims 1 to 4 and an inspection apparatus main body are provided at least,
In the electrical inspection, the anisotropic conductive sheet is disposed between the inspection apparatus main body and a circuit board including a plurality of electrodes to be inspected.
Inspecting the circuit board in an electrically connected state between the inspection apparatus main body and the anisotropic conductive sheet and between the anisotropic conductive sheet and the circuit board. An electrical inspection device for circuit boards.

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