JP5520026B2 - 研磨パッド固定用両面テープ - Google Patents

研磨パッド固定用両面テープ Download PDF

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Publication number
JP5520026B2
JP5520026B2 JP2009281168A JP2009281168A JP5520026B2 JP 5520026 B2 JP5520026 B2 JP 5520026B2 JP 2009281168 A JP2009281168 A JP 2009281168A JP 2009281168 A JP2009281168 A JP 2009281168A JP 5520026 B2 JP5520026 B2 JP 5520026B2
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Japan
Prior art keywords
pressure
sensitive adhesive
fixing
resin
polishing pad
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JP2009281168A
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English (en)
Japanese (ja)
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JP2011122069A5 (enExample
JP2011122069A (ja
Inventor
梨絵 松井
賢司 酒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Priority to JP2009281168A priority Critical patent/JP5520026B2/ja
Publication of JP2011122069A publication Critical patent/JP2011122069A/ja
Publication of JP2011122069A5 publication Critical patent/JP2011122069A5/ja
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2009281168A 2009-12-11 2009-12-11 研磨パッド固定用両面テープ Active JP5520026B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009281168A JP5520026B2 (ja) 2009-12-11 2009-12-11 研磨パッド固定用両面テープ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009281168A JP5520026B2 (ja) 2009-12-11 2009-12-11 研磨パッド固定用両面テープ

Publications (3)

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JP2011122069A JP2011122069A (ja) 2011-06-23
JP2011122069A5 JP2011122069A5 (enExample) 2012-11-01
JP5520026B2 true JP5520026B2 (ja) 2014-06-11

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ID=44286268

Family Applications (1)

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JP2009281168A Active JP5520026B2 (ja) 2009-12-11 2009-12-11 研磨パッド固定用両面テープ

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JP (1) JP5520026B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5858576B2 (ja) * 2011-04-21 2016-02-10 東洋ゴム工業株式会社 積層研磨パッド用ホットメルト接着剤シート、及び積層研磨パッド用接着剤層付き支持層
JP6034796B2 (ja) * 2011-10-31 2016-11-30 東京応化工業株式会社 ウエハと当該ウエハの支持体とを接着するための接着剤組成物、及びその利用
JP6594606B2 (ja) * 2013-01-31 2019-10-23 日東電工株式会社 粘着剤組成物および粘着シート
JP2015048430A (ja) * 2013-09-03 2015-03-16 日東電工株式会社 両面粘着テープ
JP6202958B2 (ja) * 2013-09-13 2017-09-27 日東電工株式会社 粘着シート
JP6513356B2 (ja) * 2013-09-13 2019-05-15 日東電工株式会社 研磨パッド固定用粘着シート
JP7318510B2 (ja) * 2019-12-02 2023-08-01 東洋インキＳｃホールディングス株式会社 研磨部材固定用粘着剤および粘着シート
KR102460711B1 (ko) * 2020-08-21 2022-10-27 한국타이어앤테크놀로지 주식회사 흡음 타이어용 폼테이프 및 이를 포함하는 흡음 타이어
JP7415888B2 (ja) * 2020-11-17 2024-01-17 信越半導体株式会社 研磨パッド、両面研磨装置及びウェーハの両面研磨方法
JP7783968B1 (ja) * 2024-12-18 2025-12-10 ａｒｔｉｅｎｃｅ株式会社 研磨パッド固定用粘着シート、剥離シート付きの研磨パッド固定用粘着シート、粘着層ａ付きの研磨パッド、剥離シートおよび粘着層ａ付きの研磨パッド、および研磨パッドを定盤に固定する方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007245276A (ja) * 2006-03-15 2007-09-27 Sekisui Chem Co Ltd 研磨パッド固定用両面テープ
WO2007132881A1 (ja) * 2006-05-17 2007-11-22 Sekisui Chemical Co., Ltd. 研磨パッド固定用両面テープ

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JP2011122069A (ja) 2011-06-23

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