JP5508904B2 - 水溶性シリコン加工液 - Google Patents

水溶性シリコン加工液 Download PDF

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Publication number
JP5508904B2
JP5508904B2 JP2010051159A JP2010051159A JP5508904B2 JP 5508904 B2 JP5508904 B2 JP 5508904B2 JP 2010051159 A JP2010051159 A JP 2010051159A JP 2010051159 A JP2010051159 A JP 2010051159A JP 5508904 B2 JP5508904 B2 JP 5508904B2
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Prior art keywords
acid
water
component
processing liquid
soluble silicon
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Japanese (ja)
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JP2011184561A5 (enExample
JP2011184561A (ja
Inventor
友彦 北村
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Idemitsu Kosan Co Ltd
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Idemitsu Kosan Co Ltd
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Priority to JP2010051159A priority Critical patent/JP5508904B2/ja
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Publication of JP2011184561A5 publication Critical patent/JP2011184561A5/ja
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JP2010051159A 2010-03-08 2010-03-08 水溶性シリコン加工液 Active JP5508904B2 (ja)

Priority Applications (1)

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JP2010051159A JP5508904B2 (ja) 2010-03-08 2010-03-08 水溶性シリコン加工液

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JP2010051159A JP5508904B2 (ja) 2010-03-08 2010-03-08 水溶性シリコン加工液

Publications (3)

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JP2011184561A JP2011184561A (ja) 2011-09-22
JP2011184561A5 JP2011184561A5 (enExample) 2013-03-14
JP5508904B2 true JP5508904B2 (ja) 2014-06-04

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JP2010051159A Active JP5508904B2 (ja) 2010-03-08 2010-03-08 水溶性シリコン加工液

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Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3121187B2 (ja) * 1993-10-18 2000-12-25 ユシロ化学工業株式会社 マグネシウム合金用水溶性加工油剤
JP3949200B2 (ja) * 1996-08-12 2007-07-25 エヌ・エス ルブリカンツ株式会社 ワイヤソーによる切断加工のための切削油、切削油組成物およびそれを用いた物品の切断方法
JPH1053789A (ja) * 1996-08-12 1998-02-24 Nippei Toyama Corp ワイヤー切断加工機用水性加工液組成物
JP4497767B2 (ja) * 2001-09-06 2010-07-07 ユシロ化学工業株式会社 固定砥粒ワイヤソー用水溶性加工液組成物
US8580656B2 (en) * 2008-07-14 2013-11-12 Air Products And Chemicals, Inc. Process for inhibiting corrosion and removing contaminant from a surface during wafer dicing and composition useful therefor

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JP2011184561A (ja) 2011-09-22

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