JP5507940B2 - Lighting device - Google Patents

Lighting device Download PDF

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JP5507940B2
JP5507940B2 JP2009220321A JP2009220321A JP5507940B2 JP 5507940 B2 JP5507940 B2 JP 5507940B2 JP 2009220321 A JP2009220321 A JP 2009220321A JP 2009220321 A JP2009220321 A JP 2009220321A JP 5507940 B2 JP5507940 B2 JP 5507940B2
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light emitting
circuit board
printed circuit
emitting component
filler
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JP2011071264A (en
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茂章 山崎
国永 中田
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
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Description

本発明は、ＬＥＤなどの発光部品をプリント基板に実装した照明装置に関するものである。   The present invention relates to an illumination device in which a light emitting component such as an LED is mounted on a printed board.

従来、ＬＥＤを実装した基板をケースに収納し、ケース内にシリコン樹脂を充填することで防水処理したＬＥＤ表示装置が特許文献１（特開平５−１９０９０５号）に開示されている。この従来例では、一種類のＬＥＤのみを実装する場合には必要十分な高さに充填することが可能であるが、同一基板上に他の種類のＬＥＤや、他の電気部品を実装した場合、その部品の電極部を保護するために、ＬＥＤの発光部まで充填する必要が生じる場合がある。   2. Description of the Related Art Conventionally, Japanese Patent Application Laid-Open No. 5-190905 discloses an LED display device in which a substrate on which an LED is mounted is housed in a case and the case is filled with a silicone resin to perform waterproofing. In this conventional example, when only one type of LED is mounted, it can be filled to a necessary and sufficient height, but when other types of LED and other electrical components are mounted on the same substrate In order to protect the electrode part of the component, it may be necessary to fill the light emitting part of the LED.

特開平５−１９０９０５号公報Japanese Patent Laid-Open No. 5-190905

しかし、ＬＥＤの発光部を充填材で覆ってしまうと、ＬＥＤから出た光が反射や吸収により損失してしまったり、他の電気部品に光が当たり、反射や吸収により光を損失してしまうという問題点があった。   However, if the light emitting part of the LED is covered with a filler, the light emitted from the LED may be lost due to reflection or absorption, or the other electrical parts may be hit by light and lost due to reflection or absorption. There was a problem.

本発明の目的は、実装基板上に発光部品および高さの異なる他の電気部品を実装した状態でも発光部品の発光部が充填材に埋もれて光の損失を発生させることのない照明装置を提供することにある。   An object of the present invention is to provide an illuminating device in which a light emitting part of a light emitting component is buried in a filling material and no light loss occurs even when the light emitting component and other electrical components having different heights are mounted on a mounting substrate. There is to do.

請求項１の照明装置は、上記の課題を解決するために、図１，３に示すように、発光部品１と、発光部品１以外の電気部品２ａ〜２ｅと、前記各部品１、２ａ〜２ｅを実装するプリント基板３とを備え、プリント基板３を突出変形させることで、発光部品１の実装位置が全ての電気部品２ａ〜２ｅの実装位置よりも高くなっており、発光部品１は充填により保護する部分である充電部（電極部１ａ）および発光部１ｂを持ち、発光部品１と電気部品２ａ〜２ｅを収納したケース５に硬化性の充填材４を流し込むことで各部品１、２ａ〜２ｅを保護する構造の照明装置であって、電気部品２ａ〜２ｅの充電部は充填材４により覆われ、発光部品１の発光部１ｂは充填材４に覆われていないことを特徴とするものである。 In order to solve the above-described problem, the lighting device according to claim 1 has a light emitting component 1, electric components 2a to 2e other than the light emitting component 1, and the components 1, 2a to 1, as shown in FIGS. and a printed circuit board 3 that implements 2e, the printed circuit board 3 by causing protruding deformation has become higher than the mounting position of the light emitting component 1 is mounted positions of all the electrical parts 2a to 2e, the light emitting component 1 Each part 1 has a charging part (electrode part 1a) and a light emitting part 1b which are parts to be protected by filling, and a curable filler 4 is poured into a case 5 containing the light emitting part 1 and the electrical parts 2a to 2e. A lighting device having a structure for protecting 2a to 2e, wherein the charging parts of the electrical components 2a to 2e are covered with the filler 4, and the light emitting part 1b of the light emitting component 1 is not covered with the filler 4. To do.

本願の別の第１発明は、上記の課題を解決するために、図２に示すように、発光部品１と、発光部品１以外の電気部品２ａ〜２ｅと、前記各部品１、２ａ〜２ｅを実装するプリント基板３とを備え、前記プリント基板３上に重ねて実装される第２のプリント基板６に発光部品１を実装することで、発光部品１の実装位置が電気部品２ａ〜２ｅの実装位置よりも高くなっていることを特徴とする。 Another first shot light of the present application, in order to solve the above problem, as shown in FIG. 2, the light emitting part 1, and the electrical component 2a~2e other than the light emitting part 1, each component 1,2a~ and a printed circuit board 3 that implements 2e, pre Symbol by mounting the light emitting part 1 to the second printed circuit board 6 is mounted on top on the printed circuit board 3, the mounting position of the light emitting component 1 electrical component 2a~ 2e is higher than the mounting position.

本願の別の第２発明は、上記の課題を解決するために、発光部品１と、発光部品１以外の電気部品２ａ〜２ｅと、前記各部品１、２ａ〜２ｅを実装するプリント基板３とを備え、プリント基板３における発光部品１の実装位置の周囲を分断し、段差を付けることで発光部品１の実装位置が電気部品２ａ〜２ｅの実装位置よりも高くなっていることを特徴とする。 Another second shot light of the present application, in order to solve the above problems, a light emitting component 1, and the electrical component 2a~2e other than the light emitting part 1, the printed circuit board 3 for mounting the respective components 1,2a~2e with the door, and divide the circumference of the mounting position of the light emitting component 1 on the printed board 3, and characterized in that the mounting position of the light emitting component 1 by attaching the step is higher than the mounting position of the electrical component 2a~2e To do.

請求項２の発明は、請求項１の照明装置において、図３に示すように、発光部品１の充電部（電極部１ａ）は発光部１ｂよりも低くなっており、発光部品１の実装位置の周囲に隆起部７があり、隆起部７の高さが発光部品１の充電部（電極部１ａ）よりも高く、発光部１ｂよりも低くなっていることを特徴とする。 According to a second aspect of the present invention, in the illumination device of the first aspect, as shown in FIG. 3, the charging portion (electrode portion 1a) of the light emitting component 1 is lower than the light emitting portion 1b, and the mounting position of the light emitting component 1 There is a protruding portion 7 around the height of the protruding portion 7, and the height of the protruding portion 7 is higher than the charging portion (electrode portion 1a) of the light emitting component 1 and lower than the light emitting portion 1b.

請求項３の発明は、請求項２の照明装置において、隆起部７はプリント基板３へ隆起部品を実装することで形成されていることを特徴とする。 According to a third aspect of the present invention, in the illumination device of the second aspect , the raised portion 7 is formed by mounting a raised component on the printed circuit board 3.

請求項４の発明は、請求項１〜３の照明装置において、発光部品１の周囲の高くなった部分の配線部または発光部品１の電極部１ａからプリント基板３の低い部分の配線部への電気接続を確保する導線を有する。 According to a fourth aspect of the present invention, in the illuminating device according to the first to third aspects, the wiring portion at the periphery of the light emitting component 1 or the electrode portion 1a of the light emitting component 1 is connected to the wiring portion at the lower portion of the printed circuit board 3. Has conductors to ensure electrical connection.

本願の別の第３発明は、上記の課題を解決するために、発光部品１と、発光部品１以外の電気部品２ａ〜２ｅと、前記各部品１、２ａ〜２ｅを実装するプリント基板３とを備え、プリント基板３における発光部品１の実装位置の周囲を分断し、段差を付けることで発光部品１の実装位置が電気部品２ａ〜２ｅの実装位置よりも高くなっており、プリント基板３の分断部がスルーホール部の中央を通っており、分断後にスルーホール部にはんだ付けすることで、電気接続を確保することを特徴とする。 Another third shot Ming of the present application is to solve the above problems, a light emitting component 1, and the electrical component 2a~2e other than the light emitting part 1, the printed circuit board 3 for mounting the respective components 1,2a~2e The mounting position of the light emitting component 1 is higher than the mounting positions of the electrical components 2a to 2e by dividing the periphery of the mounting position of the light emitting component 1 on the printed circuit board 3 and providing a step. The dividing portion passes through the center of the through-hole portion, and is electrically soldered to the through-hole portion after the division to ensure electrical connection.

請求項５の発明は、請求項１〜４の照明装置において、プリント基板３または第２のプリント基板６がアルミニウムまたは銅などの金属ベース基板であることを特徴とする。 According to a fifth aspect of the present invention, in the lighting device according to the first to fourth aspects, the printed circuit board 3 or the second printed circuit board 6 is a metal base substrate such as aluminum or copper.

請求項６の発明は、請求項１〜５の照明装置において、プリント基板３の給電部は充填材４から露出する構造を有することを特徴とする。 According to a sixth aspect of the present invention, in the illumination device according to any of the first to fifth aspects, the power feeding portion of the printed circuit board 3 has a structure exposed from the filler 4.

本発明によると、ＬＥＤなどの電極部および発光部を持つ発光部品と、この発光部品とは別の電気部品を充填材で保護すべき高さへ一括して充填することができ、かつ発光部へ充填材が付着しない。よって、充填材によるＬＥＤなどの発光部品の光の吸収や反射が起こらないため、光出力を効率良く取り出せる照明装置を提供することが可能となった。   According to the present invention, a light emitting component having an electrode portion such as an LED and a light emitting portion, and an electrical component different from the light emitting component can be filled at a height to be protected with the filler, and the light emitting portion The filler does not adhere. Therefore, since light absorption and reflection of light-emitting components such as LEDs by the filler do not occur, it is possible to provide an illumination device that can efficiently extract light output.

本発明の実施形態１の構成を示す断面図である。It is sectional drawing which shows the structure of Embodiment 1 of this invention. 本発明の実施形態２の構成を示す断面図である。It is sectional drawing which shows the structure of Embodiment 2 of this invention. 本発明の実施形態３の構成を示す断面図である。It is sectional drawing which shows the structure of Embodiment 3 of this invention.

（実施形態１）
本発明の実施形態１の断面図を図１に示す。ＬＥＤなどの発光部品１は、電極部１ａおよび発光部１ｂを有している。電極部１ａに通電することにより発光部１ｂが発光する。前記発光部品１とは別の電気部品２ａ〜２ｅは、例えばコンデンサや抵抗、ＩＣ、トランスなどであり、発光部品１の電極部１ａに駆動電流を供給する電源回路を構成している。 (Embodiment 1)
A sectional view of Embodiment 1 of the present invention is shown in FIG. A light emitting component 1 such as an LED has an electrode portion 1a and a light emitting portion 1b. The light emitting unit 1b emits light by energizing the electrode unit 1a. The electric components 2 a to 2 e different from the light emitting component 1 are, for example, capacitors, resistors, ICs, transformers, and the like, and constitute a power supply circuit that supplies a drive current to the electrode portion 1 a of the light emitting component 1.

前記発光部品１および電気部品２ａ〜２ｅは、プリント基板３に実装される。プリント基板３はアルミニウムや銅などの金属ベースのプリント基板とすることで、放熱が容易となり、また、突出変形も容易となる。発光部品１と電気部品２ａ〜２ｅを接続するための銅箔などの印刷配線部（図示せず）は、金属ベースのプリント基板３の表面に絶縁膜を介して形成すればよい。   The light emitting component 1 and the electrical components 2a to 2e are mounted on the printed board 3. The printed circuit board 3 is a metal-based printed circuit board such as aluminum or copper, so that heat can be easily dissipated and the protrusion can be easily deformed. A printed wiring portion (not shown) such as a copper foil for connecting the light emitting component 1 and the electrical components 2a to 2e may be formed on the surface of the metal-based printed board 3 via an insulating film.

発光部品１と電気部品２ａ〜２ｅを実装したプリント基板３はケース５に収納される。充填材４は硬化前の状態でケース５に流し込まれる。その後、硬化工程を経て、完成した照明装置となる。本実施形態では、充填材４として透明な硬化性の樹脂材料を用いているが、これに限定されるものではない。   The printed circuit board 3 on which the light emitting component 1 and the electrical components 2a to 2e are mounted is housed in a case 5. The filler 4 is poured into the case 5 before being cured. Then, it passes through a hardening process and becomes a completed lighting device. In the present embodiment, a transparent curable resin material is used as the filler 4, but is not limited thereto.

充填材４は、発光部品１と電気部品２ａ〜２ｅの充電部（電極部を含む充填材４で保護すべき部分）を充填保護する。電気部品２ａ〜２ｅの充填保護すべき範囲をＨ、発光部品１の充填保護すべき範囲をｈで示す。   The filler 4 fills and protects the charging part (the part to be protected by the filler 4 including the electrode part) of the light emitting component 1 and the electrical components 2a to 2e. The range to be filled and protected for the electrical components 2a to 2e is denoted by H, and the range to be filled and protected for the light emitting component 1 is denoted by h.

前記照明装置において、プリント基板３上の電気部品２ａ〜２ｅの充電部の基板表面からの高さの最大値は、プリント基板３上の発光部品１の発光部１ｂの基板表面からの高さよりも高いものとする。また、発光部品１の電極部１ａの高さは、発光部１ｂよりも低いものとする。   In the lighting device, the maximum value of the height of the charging parts of the electrical components 2a to 2e on the printed circuit board 3 from the substrate surface is higher than the height of the light emitting part 1b of the light emitting component 1 on the printed circuit board 3 from the substrate surface. High. Moreover, the height of the electrode part 1a of the light emitting component 1 shall be lower than the light emitting part 1b.

プリント基板３は、発光部品１の実装位置の部分が高くなるように、部分的に突出変形している。その突出変形の高さは、電気部品２ａ〜２ｅの充電部の基板表面からの高さの最大値と、発光部品１の発光部１ｂの高さの差より大きくなっている。   The printed circuit board 3 is partly projecting and deformed so that the portion where the light emitting component 1 is mounted becomes higher. The height of the projecting deformation is larger than the difference between the maximum height of the charging parts of the electric parts 2 a to 2 e from the substrate surface and the height of the light emitting part 1 b of the light emitting part 1.

すると、充填材４をケース５に流し込む際に、発光部品１の電極部１ａより高く、かつ、発光部１ｂより低い位置まで流し込むことで、電気部品２ａ〜２ｅの充電部を全て充填材４で覆うことができ、発光部品１の電極部１ａも充填材４で覆うことができ、発光部１ｂは充填材４で覆わないような充填が可能になる。したがって、充填材４は必ずしも透明でなくても良い。例えば、半透明や不透明な樹脂でも使用は可能である。   Then, when pouring the filler 4 into the case 5, all the charged parts of the electric components 2 a to 2 e are filled with the filler 4 by pouring to a position higher than the electrode portion 1 a of the light emitting component 1 and lower than the light emitting portion 1 b. The electrode part 1 a of the light emitting component 1 can be covered with the filler 4, and the light emitting part 1 b can be filled without being covered with the filler 4. Therefore, the filler 4 does not necessarily have to be transparent. For example, a translucent or opaque resin can be used.

以上のように構成することにより、同一のプリント基板３上に発光部品１およびそれ以外の電気部品２ａ〜２ｅを実装し、各部品１、２ａ〜２ｅの電極部を含む充電部を覆うように充填材４を充填した状態でも、発光部品１の光の損失が無い照明装置を提供することが可能となった。   By configuring as described above, the light emitting component 1 and the other electrical components 2a to 2e are mounted on the same printed circuit board 3 so as to cover the charging unit including the electrode portions of the components 1, 2a to 2e. Even in a state where the filler 4 is filled, it is possible to provide a lighting device that does not lose light of the light emitting component 1.

なお、上記の説明において、発光部品１や電気部品２ａ〜２ｅの電極部もしくは充電部というのは、充填材４で保護すべき部分を代表しており、他に充填保護すべき部分がある場合はその部分を含んでいても良い。また、電気部品２ａ〜２ｅは発光部品１以外の充填保護すべき部分を含む部品を代表しており、電気部品以外の充填保護すべき部分を持つ部品を含んでいても良い。   In addition, in said description, the electrode part or charging part of the light emitting component 1 or the electrical components 2a-2e represents the part which should be protected with the filler 4, and there exists another part which should be filled and protected. May include that part. The electrical components 2a to 2e are representative of components including a portion to be protected for filling other than the light emitting component 1, and may include components having a portion to be protected for filling other than the electrical components.

本実施形態では、プリント基板３を突出変形させるので、突出変形した部分の上下で確実に電気接続を確保するために、ボンディングワイヤーまたはリード線などの導線を用いて接続しても良い。すなわち、発光部品１の周囲の高くなった部分の配線部または発光部品１の電極部１ａからプリント基板３上の低い部分の電気部品２ａ〜２ｅの配線部へボンディングワイヤーまたはリード線などの導線を接続すれば、突出変形させた部分の印刷配線部が断線するなどの不都合が無く、確実に電気接続を確保することができる。   In this embodiment, since the printed circuit board 3 is deformed in a projecting manner, it may be connected using a conductive wire such as a bonding wire or a lead wire in order to ensure electrical connection above and below the projecting and deformed portion. That is, a conductive wire such as a bonding wire or a lead wire is connected from the wiring portion of the raised portion around the light emitting component 1 or the electrode portion 1a of the light emitting component 1 to the wiring portion of the lower electric components 2a to 2e on the printed circuit board 3. When connected, there is no inconvenience such as disconnection of the printed wiring portion of the projecting deformed portion, and electrical connection can be reliably ensured.

また、アルミニウムや銅などの金属ベースのプリント基板を突出変形させる構造に代えて、通常の絶縁基板を用いたプリント基板における発光部品の実装位置の周囲を分断し、分断部において段差を付けることで発光部品の実装位置が電気部品の実装位置よりも高くなるような構造としても良い。この場合、分断部に沿って複数のスルーホール部を有するプリント基板をスルーホール部の中央を通るように分断し、分断後にスルーホール部にはんだ付けすることで分断部の間の電気接続を確保するように構成すれば良い。分断部は複数段としても良く、段数を増減することにより、発光部品１の実装位置の高さを調整できる。   In addition, instead of a structure that protrudes and deforms a metal-based printed circuit board such as aluminum or copper, the periphery of the mounting position of the light emitting component on the printed circuit board using a normal insulating substrate is divided, and a step is provided at the divided portion. A structure in which the mounting position of the light emitting component is higher than the mounting position of the electrical component may be employed. In this case, a printed circuit board having a plurality of through-hole portions is divided along the dividing portion so as to pass through the center of the through-hole portion, and soldering to the through-hole portion after the dividing ensures electrical connection between the dividing portions. What is necessary is just to comprise so. The dividing part may have a plurality of stages, and the height of the mounting position of the light emitting component 1 can be adjusted by increasing or decreasing the number of stages.

なお、プリント基板３の給電部（端子、コネクタなど）は充填材４で埋もれてしまわない構造とする。例えば、プリント基板３上に端子ピンを立設し、この端子ピンの上端は充填材４の表面から露出させておく。あるいは、プリント基板３上に給電用のコネクタ（図示せず）を実装し、そのコネクタの開口部は充填材４の表面から露出させておく。そのほか、給電用のリード線を充填材４から露出させておくような構造としても構わない。以下の各実施形態においても同様である。   Note that the power feeding portion (terminal, connector, etc.) of the printed circuit board 3 is structured not to be buried with the filler 4. For example, a terminal pin is erected on the printed circuit board 3, and the upper end of the terminal pin is exposed from the surface of the filler 4. Alternatively, a power supply connector (not shown) is mounted on the printed circuit board 3, and the opening of the connector is exposed from the surface of the filler 4. In addition, a structure in which a lead wire for power feeding is exposed from the filler 4 may be used. The same applies to the following embodiments.

（実施形態２）
本発明の実施形態２の断面図を図２に示す。ＬＥＤなどの発光部品１は、電極部１ａおよび発光部１ｂを有している。電極部１ａに通電することにより発光部１ｂが発光する。前記発光部品１とは別の電気部品２ａ〜２ｄは、例えばコンデンサや抵抗、ＩＣ、トランスなどであり、発光部品１の電極部１ａに駆動電流を供給する電源回路を構成している。 (Embodiment 2)
FIG. 2 shows a cross-sectional view of Embodiment 2 of the present invention. A light emitting component 1 such as an LED has an electrode portion 1a and a light emitting portion 1b. The light emitting unit 1b emits light by energizing the electrode unit 1a. The electric components 2 a to 2 d different from the light emitting component 1 are, for example, capacitors, resistors, ICs, transformers, and the like, and constitute a power supply circuit that supplies a drive current to the electrode portion 1 a of the light emitting component 1.

前記発光部品１は、別のプリント基板６に実装される。また、発光部品１を実装したプリント基板６と電気部品２ａ〜２ｄは、プリント基板３に実装される。プリント基板３は、ケース５に収納される。充填材４は硬化前の状態でケース５に流し込まれる。その後、硬化工程を経て、完成した照明装置となる。本実施形態では、充填材４として透明な硬化性の樹脂材料を用いているが、これに限定されるものではない。   The light emitting component 1 is mounted on another printed circuit board 6. The printed circuit board 6 and the electrical components 2 a to 2 d on which the light emitting component 1 is mounted are mounted on the printed circuit board 3. The printed circuit board 3 is stored in the case 5. The filler 4 is poured into the case 5 before being cured. Then, it passes through a hardening process and becomes a completed lighting device. In the present embodiment, a transparent curable resin material is used as the filler 4, but is not limited thereto.

プリント基板３及び／又は６は、アルミニウムや銅などの金属ベースのプリント基板とすることで、放熱が容易となる。電気部品２ａ〜２ｄを接続するための銅箔などの印刷配線部（図示せず）は、金属ベースのプリント基板３の表面に絶縁膜を介して形成すればよい。同様に、発光部品１を接続するための銅箔などの印刷配線部（図示せず）は、金属ベースのプリント基板６の表面に絶縁膜を介して形成すればよい。   The printed circuit board 3 and / or 6 is a metal-based printed circuit board such as aluminum or copper, thereby facilitating heat dissipation. A printed wiring portion (not shown) such as a copper foil for connecting the electrical components 2a to 2d may be formed on the surface of the metal-based printed board 3 via an insulating film. Similarly, a printed wiring portion (not shown) such as a copper foil for connecting the light emitting component 1 may be formed on the surface of the metal-based printed board 6 with an insulating film interposed therebetween.

本実施形態では、プリント基板３の上に別のプリント基板６を重ねて実装しているので、プリント基板３上の印刷配線部とプリント基板６上の印刷配線部との間で確実に電気接続を確保するために、ボンディングワイヤーまたはリード線などの導線を用いて接続しても良い。すなわち、発光部品１の周囲の高くなった部分の配線部または発光部品１の電極部１ａからプリント基板３上の低い部分の電気部品２ａ〜２ｄの配線部へボンディングワイヤーまたはリード線などの導線を接続すれば、プリント基板３と別のプリント基板６の間の段差部を越えて、確実に電気接続を確保することができる。   In this embodiment, since another printed circuit board 6 is mounted on the printed circuit board 3 in an overlapping manner, the electrical connection between the printed wiring section on the printed circuit board 3 and the printed wiring section on the printed circuit board 6 is ensured. In order to ensure the above, it may be connected using a conducting wire such as a bonding wire or a lead wire. That is, a conductive wire such as a bonding wire or a lead wire is provided from the wiring portion at the periphery of the light emitting component 1 or the electrode portion 1a of the light emitting component 1 to the wiring portion of the low electrical components 2a to 2d on the printed circuit board 3. If connected, the electrical connection can be reliably ensured beyond the stepped portion between the printed circuit board 3 and another printed circuit board 6.

充填材４は、発光部品１と電気部品２ａ〜２ｄの充電部（電極部を含む充填材４で保護すべき部分）を充填保護する。電気部品２ａ〜２ｄの充填保護すべき範囲をＨ、発光部品１の充填保護すべき範囲をｈで示す。   The filler 4 fills and protects the charging part (the part to be protected by the filler 4 including the electrode part) of the light emitting component 1 and the electrical components 2a to 2d. The range to be filled and protected for the electrical components 2a to 2d is denoted by H, and the range to be filled and protected for the light emitting component 1 is denoted by h.

前記照明装置において、プリント基板３上の電気部品２ａ〜２ｄの充電部の基板表面からの高さの最大値は、プリント基板３上の発光部品１の発光部１ｂの基板表面からの高さよりも高いものとする。また、発光部品１の電極部１ａの高さは、発光部１ｂよりも低いものとする。   In the lighting device, the maximum value of the height of the charging parts of the electrical components 2a to 2d on the printed circuit board 3 from the substrate surface is higher than the height of the light emitting part 1b of the light emitting component 1 on the printed circuit board 3 from the substrate surface. High. Moreover, the height of the electrode part 1a of the light emitting component 1 shall be lower than the light emitting part 1b.

そして、発光部品１を実装したプリント基板６は、発光部品１の実装位置の部分が高くなるようにプリント基板３に重ねて実装されている。その重ねられた高さは、電気部品２ａ〜２ｄの充電部の基板表面からの高さの最大値と発光部品１の発光部１ｂの高さの差より大きくなっている。   The printed circuit board 6 on which the light emitting component 1 is mounted is mounted on the printed circuit board 3 so that the mounting position of the light emitting component 1 is higher. The overlapped height is larger than the difference between the maximum height of the charging parts of the electric parts 2 a to 2 d from the substrate surface and the height of the light emitting part 1 b of the light emitting part 1.

すると、充填材４をケース５に流し込む際に、発光部品１の電極部１ａより高く、かつ、発光部１ｂより低い位置まで流し込むことで、電気部品２ａ〜２ｄの電極部を全て充填材４で覆うことができ、発光部品１の電極部１ａも充填材４で覆うことができ、発光部１ｂは充填材４で覆わないような充填が可能になる。   Then, when pouring the filler 4 into the case 5, all the electrode parts of the electric components 2 a to 2 d are filled with the filler 4 by pouring to a position higher than the electrode portion 1 a of the light emitting component 1 and lower than the light emitting portion 1 b. The electrode part 1 a of the light emitting component 1 can be covered with the filler 4, and the light emitting part 1 b can be filled without being covered with the filler 4.

以上のように構成することにより、別のプリント基板６に実装した発光部品１およびプリント基板３に実装した電気部品２ａ〜２ｄを充填材４で充填した状態でも発光部品１の光の損失が無い照明装置を提供することが可能となった。   With the above configuration, there is no light loss of the light emitting component 1 even when the light emitting component 1 mounted on another printed circuit board 6 and the electrical components 2a to 2d mounted on the printed circuit board 3 are filled with the filler 4. An illumination device can be provided.

なお、発光部品１や電気部品２ａ〜２ｄの電極部もしくは充電部というのは、充填材４で保護すべき部分を代表しており、他に充填保護すべき部分がある場合はその部分を含んでいても良い。また、電気部品２ａ〜２ｄは発光部品１以外の充填保護すべき部分を含む部品を代表しており、電気部品２ａ〜２ｄ以外の充填保護すべき部分を持つ部品を含んでいても良い。   In addition, the electrode part or charging part of the light-emitting component 1 or the electrical components 2a to 2d represents a portion that should be protected by the filler 4, and includes other portions that should be protected by filling. You can leave. Moreover, the electrical components 2a to 2d are representative of components including a portion to be charged and protected other than the light emitting component 1, and may include components having a portion to be charged and protected other than the electrical components 2a to 2d.

（実施形態３）
本発明の実施形態３の断面図を図３に示す。ＬＥＤなどの発光部品１は、電極部１ａおよび発光部１ｂを有している。電極部１ａに通電することにより発光部１ｂが発光する。前記発光部品１とは別の電気部品２ａ〜２ｄは、例えばコンデンサや抵抗、ＩＣ、トランスなどであり、発光部品１の電極部１ａに駆動電流を供給する電源回路を構成している。発光部品１の周囲には、隆起部品７を配置している。隆起部品７は例えばリング状でも矩形状でも良く、発光部品１の電極部１ａを囲む形状であれば良い。 (Embodiment 3)
FIG. 3 shows a cross-sectional view of Embodiment 3 of the present invention. A light emitting component 1 such as an LED has an electrode portion 1a and a light emitting portion 1b. The light emitting unit 1b emits light by energizing the electrode unit 1a. The electric components 2 a to 2 d different from the light emitting component 1 are, for example, capacitors, resistors, ICs, transformers, and the like, and constitute a power supply circuit that supplies a drive current to the electrode portion 1 a of the light emitting component 1. A raised part 7 is arranged around the light emitting part 1. The raised component 7 may be, for example, a ring shape or a rectangular shape as long as the shape surrounds the electrode portion 1a of the light emitting component 1.

前記発光部品１と電気部品２ａ〜２ｄおよび隆起部品７は、プリント基板３に実装される。プリント基板３はアルミニウムや銅などの金属ベースのプリント基板とすることで、放熱が容易となり、また、突出変形も容易となる。発光部品１と電気部品２ａ〜２ｄを接続するための銅箔などの印刷配線部（図示せず）は、金属ベースのプリント基板３の表面に絶縁膜を介して形成すればよい。   The light emitting component 1, the electrical components 2 a to 2 d and the raised component 7 are mounted on the printed circuit board 3. The printed circuit board 3 is a metal-based printed circuit board such as aluminum or copper, so that heat can be easily dissipated and the protrusion can be easily deformed. A printed wiring portion (not shown) such as a copper foil for connecting the light emitting component 1 and the electrical components 2a to 2d may be formed on the surface of the metal-based printed board 3 via an insulating film.

発光部品１と電気部品２ａ〜２ｄおよび隆起部品７を実装したプリント基板３は、ケース５に収納される。充填材４は硬化前の状態でケース５と隆起部品７で形成した囲いに流し込まれる。その後、硬化工程を経て、完成した照明装置となる。本実施形態では、充填材４として透明な硬化性の樹脂材料を用いているが、これに限定されるものではない。   The printed circuit board 3 on which the light emitting component 1, the electrical components 2 a to 2 d and the raised component 7 are mounted is housed in a case 5. The filler 4 is poured into an enclosure formed by the case 5 and the raised parts 7 before being cured. Then, it passes through a hardening process and becomes a completed lighting device. In the present embodiment, a transparent curable resin material is used as the filler 4, but is not limited thereto.

充填材４は、発光部品１と電気部品２ａ〜２ｄの充電部（電極部を含む充填材４で保護すべき部分）を充填保護する。電気部品２ａ〜２ｄの充填保護すべき範囲をＨ、発光部品１の充填保護すべき範囲をｈで示す。   The filler 4 fills and protects the charging part (the part to be protected by the filler 4 including the electrode part) of the light emitting component 1 and the electrical components 2a to 2d. The range to be filled and protected for the electrical components 2a to 2d is denoted by H, and the range to be filled and protected for the light emitting component 1 is denoted by h.

前記照明装置において、プリント基板３上の電気部品２ａ〜２ｄの充電部の基板表面からの高さの最大値は、プリント基板３上の発光部品１の発光部１ｂの基板表面からの高さよりも高いものとする。また、発光部品１の電極部１ａの高さは、発光部１ｂよりも低いものとする。   In the lighting device, the maximum value of the height of the charging parts of the electrical components 2a to 2d on the printed circuit board 3 from the substrate surface is higher than the height of the light emitting part 1b of the light emitting component 1 on the printed circuit board 3 from the substrate surface. High. Moreover, the height of the electrode part 1a of the light emitting component 1 shall be lower than the light emitting part 1b.

プリント基板３は、発光部品１の実装位置の部分が高くなるように、部分的に突出変形している。その突出変形の高さは、電気部品２ａ〜２ｄの充電部の基板表面からの高さの最大値と、発光部品１の発光部１ｂの高さの差より大きくなっている。   The printed circuit board 3 is partly projecting and deformed so that the portion where the light emitting component 1 is mounted becomes higher. The height of the projecting deformation is larger than the difference between the maximum height of the charging parts of the electric parts 2 a to 2 d from the substrate surface and the height of the light emitting part 1 b of the light emitting part 1.

また、隆起部品７はプリント基板３を部分的に突出変形した上に配置しており、かつ発光部品１を囲うよう実装されている。隆起部品７の高さは、発光部品１の電極部１ａよりも高く、発光部１ｂよりも低くなっている。   The raised component 7 is disposed on the printed circuit board 3 so as to partially protrude and is mounted so as to surround the light emitting component 1. The height of the raised component 7 is higher than the electrode portion 1a of the light emitting component 1 and lower than the light emitting portion 1b.

充填材４をケース５と隆起部品７で形成した囲いに流し込む際に、ケース５に対しては、電気部品２ａ〜２ｄの充電部より高く流し込む。また、隆起部品７で形成した囲いに対しては、発光部品１の電極部１ａよりも高く流し込む。この際、充填材４を多く流し込んだ場合、隆起部品７を越えて充填材４が溢れ出し、発光部品１の発光部１ｂの高さまで充填されることを防止できる。   When the filler 4 is poured into the enclosure formed by the case 5 and the raised component 7, it is poured into the case 5 higher than the charging parts of the electrical components 2 a to 2 d. Further, the enclosure formed by the raised parts 7 is poured higher than the electrode part 1 a of the light emitting part 1. At this time, when a large amount of the filler 4 is poured, it is possible to prevent the filler 4 from overflowing beyond the raised parts 7 and filling up to the height of the light emitting part 1 b of the light emitting part 1.

このことにより、電気部品２ａ〜２ｄの充電部を全て充填材４で覆うことができ、発光部品１の電極部１ａも充填材４で覆うことができ、発光部１ｂは充填材４で覆わないような充填が可能になる。   Thereby, all the charging parts of the electrical components 2a to 2d can be covered with the filler 4, the electrode part 1a of the light emitting component 1 can also be covered with the filler 4, and the light emitting part 1b is not covered with the filler 4. Such filling becomes possible.

以上のように構成することにより、同一のプリント基板３上に発光部品１およびそれ以外の電気部品２ａ〜２ｄを実装し、充填材４で充填した状態でも、発光部品１の光の損失が無い照明装置を提供することが可能となった。   With the configuration described above, even when the light emitting component 1 and the other electrical components 2a to 2d are mounted on the same printed circuit board 3 and filled with the filler 4, there is no light loss of the light emitting component 1. An illumination device can be provided.

なお、発光部品１や電気部品２ａ〜２ｄの電極部もしくは充電部というのは、充填材４で保護すべき部分を代表しており、他に充填保護すべき部分がある場合はその部分を含んでいても良い。また、電気部品２ａ〜２ｄは発光部品１以外の充填保護すべき部分を含む部品を代表しており、電気部品２ａ〜２ｄ以外の充填保護すべき部分を持つ部品を含んでいても良い。   In addition, the electrode part or charging part of the light-emitting component 1 or the electrical components 2a to 2d represents a portion that should be protected by the filler 4, and includes other portions that should be protected by filling. You can leave. Moreover, the electrical components 2a to 2d are representative of components including a portion to be charged and protected other than the light emitting component 1, and may include components having a portion to be charged and protected other than the electrical components 2a to 2d.

また、本実施形態では隆起部品７を追加部品として実装したが、プリント基板３を適切に変形することによっても同等の効果を得ることが可能である。さらに、本実施形態では隆起部品７をプリント基板３に実装したが、実施形態２で述べた別のプリント基板６に隆起部品７を実装しても良い。さらにまた、実施形態２で述べた別のプリント基板６を適切に変形することによって隆起部を形成しても良い。   In this embodiment, the raised component 7 is mounted as an additional component. However, the same effect can be obtained by appropriately deforming the printed circuit board 3. Furthermore, although the raised component 7 is mounted on the printed circuit board 3 in the present embodiment, the raised component 7 may be mounted on another printed circuit board 6 described in the second embodiment. Furthermore, the raised portion may be formed by appropriately deforming another printed circuit board 6 described in the second embodiment.

１ 発光部品
１ａ 電極部
１ｂ 発光部
２ａ〜２ｅ 電気部品
３ プリント基板
４ 充填材
５ ケース DESCRIPTION OF SYMBOLS 1 Light-emitting component 1a Electrode part 1b Light-emitting part 2a-2e Electrical component 3 Printed circuit board 4 Filling material 5 Case

Claims (6)

発光部品と、発光部品以外の電気部品と、前記各部品を実装するプリント基板とを備え、プリント基板を突出変形させることで、発光部品の実装位置が全ての電気部品の実装位置よりも高くなっており、発光部品は充填により保護する部分である充電部および発光部を持ち、発光部品と電気部品を収納したケースに硬化性の充填材を流し込むことで各部品を保護する構造の照明装置であって、電気部品の充電部は充填材により覆われ、発光部品の発光部は充填材に覆われていないことを特徴とする照明装置。 A light emitting part, and an electric component other than the light emitting part, and a printed circuit board for mounting the respective components, by projecting deforming the printed circuit board, high mounting position of the light-emitting parts than the mounting position of all electrical components The lighting device has a charging part and a light emitting part that are parts to be protected by filling, and protects each part by pouring a curable filler into a case containing the light emitting part and the electrical part. And the charging part of an electrical component is covered with a filler, The light emission part of a light emitting component is not covered with the filler, The illuminating device characterized by the above-mentioned. 請求項１において、発光部品の充電部は発光部よりも低くなっており、発光部品の実装位置の周囲に隆起部があり、隆起部の高さが発光部品の充電部よりも高く、発光部よりも低くなっていることを特徴とする照明装置。 In Claim 1, the charging part of the light emitting component is lower than the light emitting part, and there is a protruding part around the mounting position of the light emitting part, and the height of the protruding part is higher than the charging part of the light emitting part, and the light emitting part A lighting device characterized by being lower than the above. 請求項２において、隆起部はプリント基板へ隆起部品を実装することで形成されていることを特徴とする照明装置。 The lighting device according to claim 2, wherein the raised portion is formed by mounting a raised component on a printed circuit board. 請求項１〜３のいずれかにおいて、発光部品周囲の高くなった部分の配線部または発光部品の電極部からプリント基板の低い部分の配線部への電気接続を確保する導線を有することを特徴とする照明装置。 The lead wire according to any one of claims 1 to 3, further comprising a conductive wire that secures an electrical connection from a wiring portion at a high portion around the light emitting component or an electrode portion of the light emitting component to a wiring portion at a low portion of the printed circuit board. Lighting device. 請求項１〜４のいずれかにおいて、プリント基板または第２のプリント基板がアルミニウムまたは銅などの金属ベース基板であることを特徴とする照明装置。 5. The lighting device according to claim 1, wherein the printed circuit board or the second printed circuit board is a metal base substrate such as aluminum or copper. 請求項１〜５のいずれかにおいて、プリント基板の給電部は充填材から露出する構造を有することを特徴とする照明装置。 6. The lighting device according to claim 1, wherein the power feeding portion of the printed circuit board has a structure exposed from the filler.
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