JP5497693B2 - フォトマスク基板、フォトマスク基板の製造方法、フォトマスクの製造方法、及びパターン転写方法 - Google Patents

フォトマスク基板、フォトマスク基板の製造方法、フォトマスクの製造方法、及びパターン転写方法 Download PDF

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Publication number
JP5497693B2
JP5497693B2 JP2011130239A JP2011130239A JP5497693B2 JP 5497693 B2 JP5497693 B2 JP 5497693B2 JP 2011130239 A JP2011130239 A JP 2011130239A JP 2011130239 A JP2011130239 A JP 2011130239A JP 5497693 B2 JP5497693 B2 JP 5497693B2
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Japan
Prior art keywords
gap
photomask
proximity
substrate
exposure apparatus
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JP2011130239A
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English (en)
Japanese (ja)
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JP2012256798A5 (enrdf_load_stackoverflow
JP2012256798A (ja
Inventor
寿美 池邊
敏幸 田中
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Hoya Corp
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Hoya Corp
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Priority to JP2011130239A priority Critical patent/JP5497693B2/ja
Priority to TW101119017A priority patent/TWI506355B/zh
Priority to CN201210187324.1A priority patent/CN102819182B/zh
Priority to KR1020120061391A priority patent/KR101319743B1/ko
Publication of JP2012256798A publication Critical patent/JP2012256798A/ja
Publication of JP2012256798A5 publication Critical patent/JP2012256798A5/ja
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/60—Substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G03F1/32—Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/46—Antireflective coatings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
JP2011130239A 2011-06-10 2011-06-10 フォトマスク基板、フォトマスク基板の製造方法、フォトマスクの製造方法、及びパターン転写方法 Active JP5497693B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011130239A JP5497693B2 (ja) 2011-06-10 2011-06-10 フォトマスク基板、フォトマスク基板の製造方法、フォトマスクの製造方法、及びパターン転写方法
TW101119017A TWI506355B (zh) 2011-06-10 2012-05-28 光罩基板、光罩基板之製造方法、光罩基底、光罩、圖案轉印方法、液晶顯示裝置之製造方法及近接空隙評估方法
CN201210187324.1A CN102819182B (zh) 2011-06-10 2012-06-07 光掩模基板及制造方法、光掩模制造方法和图案转印方法
KR1020120061391A KR101319743B1 (ko) 2011-06-10 2012-06-08 포토마스크 기판, 포토마스크 기판의 제조 방법, 포토마스크의 제조 방법 및 패턴 전사 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011130239A JP5497693B2 (ja) 2011-06-10 2011-06-10 フォトマスク基板、フォトマスク基板の製造方法、フォトマスクの製造方法、及びパターン転写方法

Publications (3)

Publication Number Publication Date
JP2012256798A JP2012256798A (ja) 2012-12-27
JP2012256798A5 JP2012256798A5 (enrdf_load_stackoverflow) 2013-06-27
JP5497693B2 true JP5497693B2 (ja) 2014-05-21

Family

ID=47303353

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Application Number Title Priority Date Filing Date
JP2011130239A Active JP5497693B2 (ja) 2011-06-10 2011-06-10 フォトマスク基板、フォトマスク基板の製造方法、フォトマスクの製造方法、及びパターン転写方法

Country Status (4)

Country Link
JP (1) JP5497693B2 (enrdf_load_stackoverflow)
KR (1) KR101319743B1 (enrdf_load_stackoverflow)
CN (1) CN102819182B (enrdf_load_stackoverflow)
TW (1) TWI506355B (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6522277B2 (ja) * 2013-11-19 2019-05-29 Hoya株式会社 フォトマスク、フォトマスクの製造方法、パターン転写方法及び表示装置の製造方法
JP6415186B2 (ja) * 2014-08-27 2018-10-31 キヤノン株式会社 評価用マスク、評価方法、露光装置及び物品の製造方法
KR20170110593A (ko) * 2015-01-05 2017-10-11 마수피얼 홀딩스 아이엔시. 멀티톤 레벨 포토마스크
JP6553887B2 (ja) * 2015-02-19 2019-07-31 Hoya株式会社 フォトマスクの製造方法、描画装置、フォトマスクの検査方法、及び表示装置の製造方法
JP6556673B2 (ja) * 2016-07-26 2019-08-07 Hoya株式会社 フォトマスクの製造方法、描画装置、表示装置の製造方法、フォトマスク基板の検査方法、及びフォトマスク基板の検査装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2671338B2 (ja) * 1987-12-25 1997-10-29 株式会社ニコン 露光方法及び基板の姿勢制御方法
JPH02251851A (ja) * 1989-03-24 1990-10-09 Seiko Instr Inc フォトマスク
JP2877190B2 (ja) * 1996-01-09 1999-03-31 日本電気株式会社 Ｘ線マスク及びその製造方法
US7026081B2 (en) * 2001-09-28 2006-04-11 Asml Masktools B.V. Optical proximity correction method utilizing phase-edges as sub-resolution assist features
TWI250133B (en) * 2002-01-31 2006-03-01 Shinetsu Chemical Co Large-sized substrate and method of producing the same
JP4657591B2 (ja) * 2003-07-25 2011-03-23 信越化学工業株式会社 フォトマスクブランク用基板の選定方法
TWI329779B (en) * 2003-07-25 2010-09-01 Shinetsu Chemical Co Photomask blank substrate, photomask blank and photomask
JP4362732B2 (ja) * 2005-06-17 2009-11-11 信越化学工業株式会社 フォトマスク用大型ガラス基板及びその製造方法、コンピュータ読み取り可能な記録媒体、並びにマザーガラスの露光方法
KR100613461B1 (ko) * 2005-06-29 2006-08-17 주식회사 하이닉스반도체 이중노광기술을 이용한 이중노광방법과 이를 위한포토마스크
JP2007199434A (ja) * 2006-01-27 2007-08-09 Dainippon Printing Co Ltd プロキシミティ方式の露光方法とそれに用いられるマスク基板、および該マスク基板の作製方法
WO2008072706A1 (ja) * 2006-12-15 2008-06-19 Asahi Glass Company, Limited Ｅｕｖリソグラフィ用反射型マスクブランク、および該マスクブランク用の機能膜付基板
JP2010054933A (ja) 2008-08-29 2010-03-11 Toshiba Corp 露光装置

Also Published As

Publication number Publication date
TWI506355B (zh) 2015-11-01
CN102819182A (zh) 2012-12-12
KR101319743B1 (ko) 2013-10-17
KR20120137279A (ko) 2012-12-20
JP2012256798A (ja) 2012-12-27
CN102819182B (zh) 2014-07-23
TW201310164A (zh) 2013-03-01

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