JP5486345B2 - セラミックス焼結体の製造方法 - Google Patents
セラミックス焼結体の製造方法 Download PDFInfo
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- JP5486345B2 JP5486345B2 JP2010043111A JP2010043111A JP5486345B2 JP 5486345 B2 JP5486345 B2 JP 5486345B2 JP 2010043111 A JP2010043111 A JP 2010043111A JP 2010043111 A JP2010043111 A JP 2010043111A JP 5486345 B2 JP5486345 B2 JP 5486345B2
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- ceramic
- molded body
- ceramic molded
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- 239000000919 ceramic Substances 0.000 title claims description 124
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000002002 slurry Substances 0.000 claims description 42
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 34
- 239000000843 powder Substances 0.000 claims description 31
- 238000005266 casting Methods 0.000 claims description 21
- 238000005304 joining Methods 0.000 claims description 20
- 239000011358 absorbing material Substances 0.000 claims description 13
- 238000009736 wetting Methods 0.000 claims description 11
- 238000001035 drying Methods 0.000 claims description 10
- 238000009499 grossing Methods 0.000 claims description 10
- 230000003746 surface roughness Effects 0.000 claims description 10
- 238000005245 sintering Methods 0.000 claims description 8
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 238000002513 implantation Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 26
- 238000012360 testing method Methods 0.000 description 22
- 238000012545 processing Methods 0.000 description 16
- 239000011230 binding agent Substances 0.000 description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 239000002270 dispersing agent Substances 0.000 description 7
- 238000000465 moulding Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000002745 absorbent Effects 0.000 description 4
- 239000002250 absorbent Substances 0.000 description 4
- 238000003801 milling Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 229910052602 gypsum Inorganic materials 0.000 description 3
- 239000010440 gypsum Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 229920005646 polycarboxylate Polymers 0.000 description 3
- BSYNRYMUTXBXSQ-UHFFFAOYSA-N Aspirin Chemical compound CC(=O)OC1=CC=CC=C1C(O)=O BSYNRYMUTXBXSQ-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000009694 cold isostatic pressing Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Description
はじめに、鋳込み成形の着肉方向について試験を行った。鋳込み成形用の泥漿は、セラミックス粉末として市販のアルミナ粉末(平均粒径0.55μm、純度99.7%)を用い、アルミナ粉末100体積%と、アルミナ粉末に対してバインダ(日新化成株式会社製 Duramax B−1070)を22.9体積%、分散剤(ポリカルボン酸アンモニウム)を4.0体積%、イオン交換水を83.0体積%配合し、アルミナ粉末が分散された泥漿を調整した。
次に、成形体の含水率及び表面粗さRaについて、これらを変化させて試験を行った。
12 非吸水性材料
15 着肉層
16 成形体
Claims (4)
- 2以上のセラミックス成形体同士を焼結して一体化したセラミックス焼結体の製造方法であって、
吸水性材料からなる底部及び非吸水性材料からなる側壁部を備える成形型にセラミックス粉末を分散させた泥漿を注型し、前記吸水性材料の吸水とともにセラミックス粉末を着肉させる鋳込み成形により前記セラミックス成形体を得る工程と、
鋳込み成形により得た前記セラミックス成形体を乾燥させる工程と、
前記セラミックス成形体の接合面を平滑化する工程と、
平滑化された接合面を有する前記セラミックス成形体を湿潤する工程と、
前記セラミックス成形体に含まれるセラミックス粉末と同一のセラミックス粉末を含む泥漿を介して接合面同士を突き合わせて未焼結接合体を得る工程と、
前記未焼結接合体を焼結して一体化する工程とを含み、
前記セラミックス成形体の接合面同士を突き合わせる際に、2以上のセラミックス成形体について、鋳込み成形時にセラミックス粉末が泥漿中の溶媒の流れに従い着肉する着肉方向に垂直な面同士、または着肉方向に平行な面同士を突き合わせることを特徴とするセラミックス焼結体の製造方法。 - 前記セラミックス成形体の接合面を平滑化する工程において、接合面の表面粗さRaを0.1〜2.0μmとする請求項1記載のセラミックス焼結体の製造方法。
- 前記セラミックス成形体を鋳込み成形により得た後に乾燥させる工程において、セラミックス成形体の含水率を10.3体積%以下に調整する請求項1または2記載のセラミックス焼結体の製造方法。
- 平滑化された接合面を有する前記セラミックス成形体を湿潤する工程は、前記セラミックス成形体を水中に浸漬する請求項1〜3のいずれか一項に記載のセラミックス焼結体の製造方法。
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JP5486345B2 true JP5486345B2 (ja) | 2014-05-07 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5791394B2 (ja) * | 2011-06-30 | 2015-10-07 | 株式会社日本セラテック | セラミックス成形体の製造方法および焼結体の製造方法 |
JP6263351B2 (ja) * | 2013-08-30 | 2018-01-17 | 日本特殊陶業株式会社 | セラミックス焼結体およびその製造方法 |
JP6335737B2 (ja) * | 2014-09-30 | 2018-05-30 | 日本特殊陶業株式会社 | 中空構造体の製造方法 |
CN115074034B (zh) * | 2022-06-24 | 2023-07-25 | 华中科技大学 | 一种用于增材制造陶瓷零件的粘结剂及粘结方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0788005B2 (ja) * | 1989-03-30 | 1995-09-27 | 株式会社クボタ | セラミック成形体の接合方法 |
JPH02279570A (ja) * | 1989-04-18 | 1990-11-15 | Toyota Motor Corp | セラミックス構造体の製造方法 |
JPH06191959A (ja) * | 1992-12-24 | 1994-07-12 | Kyocera Corp | セラミック部材の接合方法 |
JP3604888B2 (ja) * | 1997-01-30 | 2004-12-22 | 日本碍子株式会社 | 窒化アルミニウム質セラミックス基材の接合体、窒化アルミニウム質セラミックス基材の接合体の製造方法及び接合剤 |
JP3389484B2 (ja) * | 1997-11-28 | 2003-03-24 | 京セラ株式会社 | 窒化アルミニウム接合構造体とその製造方法 |
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