JP5485978B2 - 空隙形成が制御された研磨パッド - Google Patents

空隙形成が制御された研磨パッド Download PDF

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Publication number
JP5485978B2
JP5485978B2 JP2011502929A JP2011502929A JP5485978B2 JP 5485978 B2 JP5485978 B2 JP 5485978B2 JP 2011502929 A JP2011502929 A JP 2011502929A JP 2011502929 A JP2011502929 A JP 2011502929A JP 5485978 B2 JP5485978 B2 JP 5485978B2
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JP
Japan
Prior art keywords
element network
polishing pad
fabric
voids
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011502929A
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English (en)
Japanese (ja)
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JP2011517853A5 (https=
JP2011517853A (ja
Inventor
ポール リフブル
デイヴィッド アダム ウェルズ
マーク シー． ジン
オスカー ケイ． スー
ジョン エリック アルデボー
スコット シン チャオ
アヌープ マシュー
ガンウェイ ウー
Original Assignee
イノパッド，インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by イノパッド，インコーポレイテッド filed Critical イノパッド，インコーポレイテッド
Publication of JP2011517853A publication Critical patent/JP2011517853A/ja
Publication of JP2011517853A5 publication Critical patent/JP2011517853A5/ja
Application granted granted Critical
Publication of JP5485978B2 publication Critical patent/JP5485978B2/ja
Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249978—Voids specified as micro

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2011502929A 2008-04-01 2008-10-02 空隙形成が制御された研磨パッド Expired - Fee Related JP5485978B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US4142208P 2008-04-01 2008-04-01
US61/041,422 2008-04-01
PCT/US2008/078610 WO2009123659A1 (en) 2008-04-01 2008-10-02 Polishing pad with controlled void formation

Publications (3)

Publication Number Publication Date
JP2011517853A JP2011517853A (ja) 2011-06-16
JP2011517853A5 JP2011517853A5 (https=) 2011-11-24
JP5485978B2 true JP5485978B2 (ja) 2014-05-07

Family

ID=41117705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011502929A Expired - Fee Related JP5485978B2 (ja) 2008-04-01 2008-10-02 空隙形成が制御された研磨パッド

Country Status (6)

Country Link
US (1) US8377351B2 (https=)
EP (1) EP2271463A4 (https=)
JP (1) JP5485978B2 (https=)
KR (1) KR101563204B1 (https=)
CN (1) CN101990483B (https=)
WO (1) WO2009123659A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101044279B1 (ko) * 2009-07-30 2011-06-28 서강대학교산학협력단 Ｃｍｐ 연마패드와 그의 제조방법
KR101044281B1 (ko) * 2009-07-30 2011-06-28 서강대학교산학협력단 기공이 형성된 ｃｍｐ 연마패드와 그의 제조방법
US8758659B2 (en) * 2010-09-29 2014-06-24 Fns Tech Co., Ltd. Method of grooving a chemical-mechanical planarization pad
US20150038066A1 (en) * 2013-07-31 2015-02-05 Nexplanar Corporation Low density polishing pad
TWI548481B (zh) * 2014-11-17 2016-09-11 三芳化學工業股份有限公司 拋光墊及其製造方法
US10946495B2 (en) * 2015-01-30 2021-03-16 Cmc Materials, Inc. Low density polishing pad
KR102608960B1 (ko) * 2016-12-05 2023-12-01 삼성전자주식회사 집적회로 소자 제조용 연마 패드의 제조 방법
KR102570825B1 (ko) * 2020-07-16 2023-08-28 한국생산기술연구원 다공성 돌출 패턴을 포함하는 연마 패드 및 이를 포함하는 연마 장치

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US6656018B1 (en) * 1999-04-13 2003-12-02 Freudenberg Nonwovens Limited Partnership Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
US20020077037A1 (en) * 1999-05-03 2002-06-20 Tietz James V. Fixed abrasive articles
JP2001001252A (ja) * 1999-06-21 2001-01-09 Toray Ind Inc 研磨布
US6533645B2 (en) * 2000-01-18 2003-03-18 Applied Materials, Inc. Substrate polishing article
US6964604B2 (en) * 2000-06-23 2005-11-15 International Business Machines Corporation Fiber embedded polishing pad
WO2002100593A2 (en) * 2000-11-20 2002-12-19 Freudenberg Nonwovens, L.P. Polishing pads with polymer filled fibrous web, and methods for fabricating and using same
JP3815226B2 (ja) * 2001-01-31 2006-08-30 東レ株式会社 研磨布
JP3455187B2 (ja) * 2001-02-01 2003-10-14 東洋ゴム工業株式会社 研磨パッド用ポリウレタン発泡体の製造装置
JP2003094320A (ja) * 2001-09-25 2003-04-03 Toray Ind Inc 研磨布
JP2003220550A (ja) * 2002-01-24 2003-08-05 Sumitomo Bakelite Co Ltd 研磨用パッドおよびその製造方法
US20030168627A1 (en) * 2002-02-22 2003-09-11 Singh Rajiv K. Slurry and method for chemical mechanical polishing of metal structures including refractory metal based barrier layers
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US20060189269A1 (en) * 2005-02-18 2006-08-24 Roy Pradip K Customized polishing pads for CMP and methods of fabrication and use thereof
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
TWI409136B (zh) * 2006-07-19 2013-09-21 Innopad Inc 表面具微溝槽之化學機械平坦化墊

Also Published As

Publication number Publication date
EP2271463A4 (en) 2013-11-27
CN101990483A (zh) 2011-03-23
CN101990483B (zh) 2013-10-16
US20090246504A1 (en) 2009-10-01
JP2011517853A (ja) 2011-06-16
WO2009123659A1 (en) 2009-10-08
US8377351B2 (en) 2013-02-19
EP2271463A1 (en) 2011-01-12
KR101563204B1 (ko) 2015-10-26
KR20110009113A (ko) 2011-01-27

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