KR101563204B1 - 제어된 공동 형성을 가지는 연마 패드 - Google Patents

제어된 공동 형성을 가지는 연마 패드 Download PDF

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KR101563204B1
KR101563204B1 KR1020107023840A KR20107023840A KR101563204B1 KR 101563204 B1 KR101563204 B1 KR 101563204B1 KR 1020107023840 A KR1020107023840 A KR 1020107023840A KR 20107023840 A KR20107023840 A KR 20107023840A KR 101563204 B1 KR101563204 B1 KR 101563204B1
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South Korea
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components
network
composition
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Korean (ko)
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KR20110009113A (ko
Inventor
폴 르페브르
데이비드 아담 웰스
마크 씨. 진
오스카 케이. 수
존 에릭 알데보르흐
스콧 신 차오
아눕 매튜
광웨이 유
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에프엔에스테크 주식회사
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249978—Voids specified as micro

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
KR1020107023840A 2008-04-01 2008-10-02 제어된 공동 형성을 가지는 연마 패드 Active KR101563204B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US4142208P 2008-04-01 2008-04-01
US61/041,422 2008-04-01

Publications (2)

Publication Number Publication Date
KR20110009113A KR20110009113A (ko) 2011-01-27
KR101563204B1 true KR101563204B1 (ko) 2015-10-26

Family

ID=41117705

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107023840A Active KR101563204B1 (ko) 2008-04-01 2008-10-02 제어된 공동 형성을 가지는 연마 패드

Country Status (6)

Country Link
US (1) US8377351B2 (https=)
EP (1) EP2271463A4 (https=)
JP (1) JP5485978B2 (https=)
KR (1) KR101563204B1 (https=)
CN (1) CN101990483B (https=)
WO (1) WO2009123659A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101044279B1 (ko) * 2009-07-30 2011-06-28 서강대학교산학협력단 Ｃｍｐ 연마패드와 그의 제조방법
KR101044281B1 (ko) * 2009-07-30 2011-06-28 서강대학교산학협력단 기공이 형성된 ｃｍｐ 연마패드와 그의 제조방법
US8758659B2 (en) * 2010-09-29 2014-06-24 Fns Tech Co., Ltd. Method of grooving a chemical-mechanical planarization pad
US20150038066A1 (en) * 2013-07-31 2015-02-05 Nexplanar Corporation Low density polishing pad
TWI548481B (zh) * 2014-11-17 2016-09-11 三芳化學工業股份有限公司 拋光墊及其製造方法
US10946495B2 (en) * 2015-01-30 2021-03-16 Cmc Materials, Inc. Low density polishing pad
KR102608960B1 (ko) * 2016-12-05 2023-12-01 삼성전자주식회사 집적회로 소자 제조용 연마 패드의 제조 방법
KR102570825B1 (ko) * 2020-07-16 2023-08-28 한국생산기술연구원 다공성 돌출 패턴을 포함하는 연마 패드 및 이를 포함하는 연마 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003220550A (ja) * 2002-01-24 2003-08-05 Sumitomo Bakelite Co Ltd 研磨用パッドおよびその製造方法
JP2007537050A (ja) * 2004-05-11 2007-12-20 フロイデンバーグ ノンウォウブンズ 研磨用パッド
WO2008011535A2 (en) * 2006-07-19 2008-01-24 Innopad, Inc. Polishing pad having micro-grooves on the pad surface

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US6656018B1 (en) * 1999-04-13 2003-12-02 Freudenberg Nonwovens Limited Partnership Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
US20020077037A1 (en) * 1999-05-03 2002-06-20 Tietz James V. Fixed abrasive articles
JP2001001252A (ja) * 1999-06-21 2001-01-09 Toray Ind Inc 研磨布
US6533645B2 (en) * 2000-01-18 2003-03-18 Applied Materials, Inc. Substrate polishing article
US6964604B2 (en) * 2000-06-23 2005-11-15 International Business Machines Corporation Fiber embedded polishing pad
WO2002100593A2 (en) * 2000-11-20 2002-12-19 Freudenberg Nonwovens, L.P. Polishing pads with polymer filled fibrous web, and methods for fabricating and using same
JP3815226B2 (ja) * 2001-01-31 2006-08-30 東レ株式会社 研磨布
JP3455187B2 (ja) * 2001-02-01 2003-10-14 東洋ゴム工業株式会社 研磨パッド用ポリウレタン発泡体の製造装置
JP2003094320A (ja) * 2001-09-25 2003-04-03 Toray Ind Inc 研磨布
US20030168627A1 (en) * 2002-02-22 2003-09-11 Singh Rajiv K. Slurry and method for chemical mechanical polishing of metal structures including refractory metal based barrier layers
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US20060189269A1 (en) * 2005-02-18 2006-08-24 Roy Pradip K Customized polishing pads for CMP and methods of fabrication and use thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003220550A (ja) * 2002-01-24 2003-08-05 Sumitomo Bakelite Co Ltd 研磨用パッドおよびその製造方法
JP2007537050A (ja) * 2004-05-11 2007-12-20 フロイデンバーグ ノンウォウブンズ 研磨用パッド
WO2008011535A2 (en) * 2006-07-19 2008-01-24 Innopad, Inc. Polishing pad having micro-grooves on the pad surface

Also Published As

Publication number Publication date
EP2271463A4 (en) 2013-11-27
CN101990483A (zh) 2011-03-23
CN101990483B (zh) 2013-10-16
US20090246504A1 (en) 2009-10-01
JP5485978B2 (ja) 2014-05-07
JP2011517853A (ja) 2011-06-16
WO2009123659A1 (en) 2009-10-08
US8377351B2 (en) 2013-02-19
EP2271463A1 (en) 2011-01-12
KR20110009113A (ko) 2011-01-27

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