JP2011517853A5 - - Google Patents

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Publication number
JP2011517853A5
JP2011517853A5 JP2011502929A JP2011502929A JP2011517853A5 JP 2011517853 A5 JP2011517853 A5 JP 2011517853A5 JP 2011502929 A JP2011502929 A JP 2011502929A JP 2011502929 A JP2011502929 A JP 2011502929A JP 2011517853 A5 JP2011517853 A5 JP 2011517853A5
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JP
Japan
Prior art keywords
element network
chemical mechanical
polishing pad
mechanical planarization
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2011502929A
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English (en)
Japanese (ja)
Other versions
JP5485978B2 (ja
JP2011517853A (ja
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Publication date
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Priority claimed from PCT/US2008/078610 external-priority patent/WO2009123659A1/en
Publication of JP2011517853A publication Critical patent/JP2011517853A/ja
Publication of JP2011517853A5 publication Critical patent/JP2011517853A5/ja
Application granted granted Critical
Publication of JP5485978B2 publication Critical patent/JP5485978B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011502929A 2008-04-01 2008-10-02 空隙形成が制御された研磨パッド Expired - Fee Related JP5485978B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US4142208P 2008-04-01 2008-04-01
US61/041,422 2008-04-01
PCT/US2008/078610 WO2009123659A1 (en) 2008-04-01 2008-10-02 Polishing pad with controlled void formation

Publications (3)

Publication Number Publication Date
JP2011517853A JP2011517853A (ja) 2011-06-16
JP2011517853A5 true JP2011517853A5 (https=) 2011-11-24
JP5485978B2 JP5485978B2 (ja) 2014-05-07

Family

ID=41117705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011502929A Expired - Fee Related JP5485978B2 (ja) 2008-04-01 2008-10-02 空隙形成が制御された研磨パッド

Country Status (6)

Country Link
US (1) US8377351B2 (https=)
EP (1) EP2271463A4 (https=)
JP (1) JP5485978B2 (https=)
KR (1) KR101563204B1 (https=)
CN (1) CN101990483B (https=)
WO (1) WO2009123659A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101044279B1 (ko) * 2009-07-30 2011-06-28 서강대학교산학협력단 Ｃｍｐ 연마패드와 그의 제조방법
KR101044281B1 (ko) * 2009-07-30 2011-06-28 서강대학교산학협력단 기공이 형성된 ｃｍｐ 연마패드와 그의 제조방법
US8758659B2 (en) * 2010-09-29 2014-06-24 Fns Tech Co., Ltd. Method of grooving a chemical-mechanical planarization pad
US20150038066A1 (en) * 2013-07-31 2015-02-05 Nexplanar Corporation Low density polishing pad
TWI548481B (zh) * 2014-11-17 2016-09-11 三芳化學工業股份有限公司 拋光墊及其製造方法
US10946495B2 (en) * 2015-01-30 2021-03-16 Cmc Materials, Inc. Low density polishing pad
KR102608960B1 (ko) * 2016-12-05 2023-12-01 삼성전자주식회사 집적회로 소자 제조용 연마 패드의 제조 방법
KR102570825B1 (ko) * 2020-07-16 2023-08-28 한국생산기술연구원 다공성 돌출 패턴을 포함하는 연마 패드 및 이를 포함하는 연마 장치

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US6656018B1 (en) * 1999-04-13 2003-12-02 Freudenberg Nonwovens Limited Partnership Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
US20020077037A1 (en) * 1999-05-03 2002-06-20 Tietz James V. Fixed abrasive articles
JP2001001252A (ja) * 1999-06-21 2001-01-09 Toray Ind Inc 研磨布
US6533645B2 (en) * 2000-01-18 2003-03-18 Applied Materials, Inc. Substrate polishing article
US6964604B2 (en) * 2000-06-23 2005-11-15 International Business Machines Corporation Fiber embedded polishing pad
WO2002100593A2 (en) * 2000-11-20 2002-12-19 Freudenberg Nonwovens, L.P. Polishing pads with polymer filled fibrous web, and methods for fabricating and using same
JP3815226B2 (ja) * 2001-01-31 2006-08-30 東レ株式会社 研磨布
JP3455187B2 (ja) * 2001-02-01 2003-10-14 東洋ゴム工業株式会社 研磨パッド用ポリウレタン発泡体の製造装置
JP2003094320A (ja) * 2001-09-25 2003-04-03 Toray Ind Inc 研磨布
JP2003220550A (ja) * 2002-01-24 2003-08-05 Sumitomo Bakelite Co Ltd 研磨用パッドおよびその製造方法
US20030168627A1 (en) * 2002-02-22 2003-09-11 Singh Rajiv K. Slurry and method for chemical mechanical polishing of metal structures including refractory metal based barrier layers
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US20060189269A1 (en) * 2005-02-18 2006-08-24 Roy Pradip K Customized polishing pads for CMP and methods of fabrication and use thereof
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
TWI409136B (zh) * 2006-07-19 2013-09-21 Innopad Inc 表面具微溝槽之化學機械平坦化墊

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