JP5460340B2 - フォトリソグラフィーのための組成物および方法 - Google Patents
フォトリソグラフィーのための組成物および方法 Download PDFInfo
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- JP5460340B2 JP5460340B2 JP2010000154A JP2010000154A JP5460340B2 JP 5460340 B2 JP5460340 B2 JP 5460340B2 JP 2010000154 A JP2010000154 A JP 2010000154A JP 2010000154 A JP2010000154 A JP 2010000154A JP 5460340 B2 JP5460340 B2 JP 5460340B2
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- UHKJHMOIRYZSTH-UHFFFAOYSA-N ethyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OCC UHKJHMOIRYZSTH-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/38—Esters containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/52—Amides or imides
- C08F220/54—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide
- C08F220/56—Acrylamide; Methacrylamide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
- C08L33/16—Homopolymers or copolymers of esters containing halogen atoms
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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Landscapes
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials For Photolithography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
本発明の第一の態様に従って、フォトレジスト層上での上塗り層の形成における使用に適した組成物が提供される。この組成物は、互いに異なっている第1樹脂、第2樹脂および第3樹脂を含む。第1樹脂は1種以上のフッ素化基を含み、かつ第2樹脂および第3樹脂それぞれよりも大きな重量比率で組成物中に存在する。第2樹脂は、第1樹脂および第3樹脂の表面エネルギーよりも低い表面エネルギーを有する。第3樹脂は1種以上の強酸基を含む。
本発明のさらなる態様に従って、被覆された基体が提供される。被覆された基体は、基体上のフォトレジスト層;およびフォトレジスト層上の上塗り層;を含む。上塗り層は、互いに異なっている第1樹脂、第2樹脂および第3樹脂を含む。第1樹脂は1種以上のフッ素化基を含み、かつ第2樹脂および第3樹脂それぞれよりも大きな重量比率で組成物中に存在する。第2樹脂は、第1樹脂および第3樹脂の表面エネルギーよりも低い表面エネルギーを有する。第3樹脂は1種以上の強酸基を含む。さらなる態様に従って、上塗り層は段階的(graded)層である。
本発明のさらなる態様に従って、フォトレジスト組成物を処理する方法が提供される。この方法は、(a)フォトレジスト組成物を基体上に適用してフォトレジスト層を形成し;(b)フォトレジスト層上に、第1の態様に関して上述された上塗り組成物を適用し;および(c)フォトレジスト層を化学線に露光する;ことを含む。本方法のさらなる態様に従って、露光は液浸露光であることができ、基体は半導体ウェハであることができる。
ある態様においては、フォトレジスト組成物層上に適用される本発明の上塗り層組成物は自己分離性(self−segregating)であり、段階的上塗り層を形成し、これは液浸リソグラフィープロセスにおいて使用される液浸流体へのフォトレジスト層の成分の移動を少なくとも阻害するのを助けることができるか、好ましくはこの移動を最小化もしくは防ぐのを助けることができる。さらに、液浸流体界面での水動的接触角特性、例えば、水後退角は改良されうる。さらに、上塗り層組成物は、層の露光領域および未露光領域の双方について、例えば、水性塩基現像剤中において優れた現像剤溶解性を有する上塗り層を提供する。
また、本明細書において使用される場合、同じ方法で処理されるが上塗り組成物層のない同じフォトレジストシステムと比較して、上塗り組成物の使用によって、低減された量の酸または有機物質が液浸流体中で検出される場合には、上塗り層はフォトレジスト物質の液浸流体への移動を阻害すると見なされる。液浸流体中のフォトレジスト物質の検出は、フォトレジスト(オーバーコートされた上塗り組成物層を有する、および有しない)の露光前の、および次いで液浸流体を通した露光を用いたフォトレジスト層(オーバーコートされた上塗り組成物層を有する、および有しない)のリソグラフィック処理後の液浸流体の質量分析によって行われることができる。好ましくは、上塗り組成物は、何ら上塗り層を使用しない同じフォトレジスト(すなわち、液浸流体がフォトレジスト層に直接接触する)と比較して、液浸流体中に存在するフォトレジスト物質(例えば、質量分析で検出される酸または有機物質)の少なくとも10パーセント低減をもたらし、より好ましくは、上塗り組成物は、上塗り層を使用しない同じフォトレジストと比較して、液浸流体中に存在するフォトレジスト物質の少なくとも20、50または100パーセント低減をもたらす。
本発明の上塗り組成物の典型的な樹脂は様々な繰り返し単位、例えば、疎水性基;弱酸基;強酸基;分岐した、場合によって置換されたアルキルもしくはシクロアルキル基;フルオロアルキル基;または極性基、例えばエステル基、エーテル基、カルボキシ基もしくはスルホニル基:の1種以上を含む繰り返し単位を含むことができる。
1)248nmでの画像形成に特に好適な化学増幅ポジ型レジストを提供できる、酸不安定基を含むフェノール系樹脂。この種の特に好ましい樹脂には、以下のものが挙げられる:i)ビニルフェノールおよびアクリル酸アルキルの重合単位を含むポリマー、ここにおいて、重合されたアクリル酸アルキル単位は光酸の存在下でデブロッキング(deblocking)反応を受けうる。光酸誘起デブロッキング反応を受けうる代表的なアクリル酸アルキルには、アクリル酸t−ブチル、メタクリル酸t−ブチル、アクリル酸メチルアダマンチル、メタクリル酸メチルアダマンチル、および光酸誘起反応を受けうる他の非環式アルキルおよび脂環式アクリラートが挙げられる。例えば、米国特許第6,042,997号および第5,492,793号に記載されたポリマーである:ii)ビニルフェノール、場合によって置換されている(ヒドロキシもしくはカルボキシ環置換基を含まない)ビニルフェニル(例えばスチレン)、および上記ポリマーi)で記載されたデブロッキング基を有するもののようなアクリル酸アルキルの重合単位を含むポリマー;例えば、米国特許第6,042,997号に記載されたポリマー:およびiii)光酸で反応しうるアセタールもしくはケタール部分を含む繰り返し単位、および場合によってフェニルもしくはフェノール性基のような芳香族繰り返し単位を含むポリマー;このようなポリマーは、米国特許第5,929,176号および第6,090,526号に記載されている:並びに、i)および/またはii)および/またはiii)のブレンド。
4)例えば、テトラフルオロエチレン、フッ素化芳香族基、例えば、フルオロ−スチレン化合物、ヘキサフルオロアルコール部分を含む化合物などの重合により提供されうるような、フッ素置換を含む樹脂(フルオロポリマー)。このような樹脂の例は、例えば、国際公開第WO2000017712号に開示されている。
本発明の上塗り組成物は3種以上の異なる樹脂を含む。本発明において有用な樹脂はホモポリマーであることができるが、より典型的には複数の異なる繰り返し単位を含み、2種または3種の異なる単位を有する、すなわち、コポリマーまたはターポリマーが典型的である。
後述の実施例は、本発明の上塗り組成物の典型的な製造を提供する。
様々なフォトレジスト組成物が、本発明の上塗り層組成物および方法と組み合わせて使用されうる。
上述のように、本発明に従って使用するのに典型的なフォトレジストには、ポジ型またはネガ型化学増幅型フォトレジスト、すなわち、1以上の組成物成分の酸不安定基の光酸促進脱保護反応を受け、このレジストの塗膜層の露光領域を、未露光領域よりも水性現像剤中でより可溶性にするポジ型レジスト組成物、並びに、光酸促進架橋反応を受けて、このレジストの塗膜層の露光領域を、未露光領域よりも現像剤非可溶性にするネガ型レジスト組成物が挙げられる。これらのなかで、ポジ型物質が典型的である。エステルのカルボキシル酸素に共有結合しているターシャリー非環式アルキル炭素(例えば、t−ブチル)またはターシャリー脂環式炭素(例えば、メチルアダマンチル)を含むエステル基は、多くの場合、本発明のリソグラフィーシステムのフォトレジストに使用される樹脂の好ましい光酸不安定基である。アセタール光酸不安定基も好ましいであろう。
液体フォトレジスト組成物は、例えば、スピンコーティング、ディッピング、ローラーコーティングまたは他の従来のコーティング技術により基体に適用されることができ、スピンコーティングが典型的である。スピンコーティングの場合、コーティング溶液の固形分含有量は、使用される特定のスピニング装置、溶液の粘度、スピナーの速度およびスピニングされる時間に基づいて、所望の膜厚を提供するように調節されうる。
次の非限定的な実施例は本発明の例示である。
上塗り組成物の製造
本発明の上塗り組成物は次の成分を次の量で混合することにより製造された。
1)4−メチル−2−ペンタノール中のポリ(4,4,4−トリフルオロ−3−ヒドロキシ−1−メチル−3−(トリフルオロメチル)ブチル 2−メタクリラート−コ−2−{[(トリフルオロメチル)スルホニル]アミノ}エチル 2−メタクリラート)(重量比90/10)の13.3重量%溶液を0.41g;
2)4−メチル−2−ペンタノール中のポリ(2{[(トリフルオロメチル)スルホニル]アミノ}エチル 2−メタクリラート−コ−2−アクリルアミド−2−メチル−1−プロパンスルホン酸)(重量比95/5)の10.0重量%溶液を0.36g;
3)プロピレングリコールメチルエーテルアセタート中のポリ(1,1,1−トリフルオロ−2−ヒドロキシ−6−メチル−2−(トリフルオロメチル)ヘプタン−4−イル メタクリラート−コ−2−{[(トリフルオロメチル)スルホニル]アミノ}エチル 2−メタクリラート)−コ−2,3,3−トリメチル 2−メタクリラート)(重量比55/25/20)の21.0重量%溶液を0.05g;
4)0.15gのジプロピレングリコールモノメチルエーテル、異性体の混合物;
5)0.5gのイソペンチルエーテル、異性体の混合物;
6)3.53gの4−メチル−2−ペンタノール。
1)4−メチル−2−ペンタノール中のポリ(4,4,4−トリフルオロ−3−ヒドロキシ−1−メチル−3−(トリフルオロメチル)ブチル 2−メタクリラート−コ−2{[(トリフルオロメチル)スルホニル]アミノ}エチル 2−メタクリラート)(重量比90/10)の13.3重量%溶液を0.41g;
2)4−メチル−2−ペンタノール中のポリ(2{[(トリフルオロメチル)スルホニル]アミノ}エチル 2−メタクリラート−コ−2−アクリルアミド−2−メチル−1−プロパンスルホン酸)(重量比95/5)の10.0重量%溶液を0.36g;
3)プロピレングリコールメチルエーテルアセタート中のポリ(1,1,1−トリフルオロ−2−ヒドロキシ−6−メチル−2−(トリフルオロメチル)ヘプタン−4−イル メタクリラート−コ−2−{[(トリフルオロメチル)スルホニル]アミノ}エチル 2−メタクリラート)−コ−2,3,3−トリメチル 2−メタクリラート)(重量比55/25/20)の21.0重量%溶液を0.05g;
4)0.15gのジプロピレングリコールモノメチルエーテル、異性体の混合物;
5)1.0gのイソペンチルエーテル、異性体の混合物;
6)3.03gの4−メチル−2−ペンタノール。
1)4−メチル−2−ペンタノール中のポリ(4,4,4−トリフルオロ−3−ヒドロキシ−1−メチル−3−(トリフルオロメチル)ブチル 2−メタクリラート−コ−2{[(トリフルオロメチル)スルホニル]アミノ}エチル 2−メタクリラート)(重量比90/10)の13.3重量%溶液を0.41g;
2)4−メチル−2−ペンタノール中のポリ(2{[(トリフルオロメチル)スルホニル]アミノ}エチル 2−メタクリラート)−コ−2−アクリルアミド−2−メチル−1−プロパンスルホン酸)(重量比95/5)の10.0重量%溶液を0.36g;
3)プロピレングリコールメチルエーテルアセタート中のポリ(1,1,1−トリフルオロ−2−ヒドロキシ−6−メチル−2−(トリフルオロメチル)ヘプタン−4−イル メタクリラート−コ−2−{[(トリフルオロメチル)スルホニル]アミノ}エチル 2−メタクリラート)−コ−2,3,3−トリメチル 2−メタクリラート)(重量比55/25/20)の21.0重量%溶液を0.05g;
4)0.15gのジプロピレングリコールモノメチルエーテル、異性体の混合物;
5)1.5gのイソペンチルエーテル、異性体の混合物;
6)2.53gの4−メチル−2−ペンタノール。
1)4−メチル−2−ペンタノール中のポリ(4,4,4−トリフルオロ−3−ヒドロキシ−1−メチル−3−(トリフルオロメチル)ブチル 2−メタクリラート−コ−2−{[(トリフルオロメチル)スルホニル]アミノ}エチル 2−メタクリラート)(重量比90/10)の13.3重量%溶液を0.41g;
2)4−メチル−2−ペンタノール中のポリ(2{[(トリフルオロメチル)スルホニル]アミノ}エチル 2−メタクリラート)−コ−2−アクリルアミド−2−メチル−1−プロパンスルホン酸)(重量比95/5)の10.0重量%溶液を0.36g;
3)プロピレングリコールメチルエーテルアセタート中のポリ(1,1,1−トリフルオロ−2−ヒドロキシ−6−メチル−2−(トリフルオロメチル)ヘプタン−4−イル メタクリラート−コ−2−{[(トリフルオロメチル)スルホニル]アミノ}エチル 2−メタクリラート)−コ−2,3,3−トリメチル 2−メタクリラート)(重量比55/25/20)の21.0重量%溶液を0.05g;
4)0.15gのジプロピレングリコールモノメチルエーテル、異性体の混合物;
5)2.0gのイソペンチルエーテル、異性体の混合物;
6)2.03gの4−メチル−2−ペンタノール。
実施例1〜4の組成物が、シリコンウェハ基体上に配置された乾燥フォトレジスト層上にスピンコートされた。コーティング組成物について水接触角が評価された。評価された水接触角は、BurnettらのJ.Vac.Sci.Techn.B、23(6)、ページ2721−2727(2005年11月/12月)に開示された手順に一般的に従った静的(θ静的)、後退(θ後退)、前進(θ前進)および転落(θ転落)を含む。結果は以下の表1に示される。
液浸リソグラフィー
実施例1〜4のコーティング組成物はそれぞれ、デブロッキング−メタクリラートベースの193nmポジ型フォトレジストの塗膜層を有する各シリコンウェハ上にスピンコートされる。それぞれのウェハについてのフォトレジスト層は次いで、193nmの波長を有するパターン化された放射線を用いた液浸リソグラフィーシステムで画像形成される。
Claims (10)
- フォトレジスト層上での上塗り層の形成における使用に適した組成物であって、
当該組成物は互いに異なっている第1樹脂、第2樹脂および第3樹脂を含み;
第1樹脂は1種以上のフッ素化基を含み、かつ第2樹脂および第3樹脂それぞれよりも大きな重量比率で組成物中に存在しており;
第2樹脂は、第1樹脂および第3樹脂の表面エネルギーよりも低い表面エネルギーを有し;並びに
第3樹脂は1種以上の強酸基を含む;
組成物。 - 第1樹脂がスルホンアミドをさらに含む、請求項1に記載の組成物。
- 第2樹脂が1種以上の光酸不安定基を含む、請求項1に記載の組成物。
- 第3樹脂の1種以上の強酸基がスルホン酸基を含む、請求項1に記載の組成物。
- アルコールと;アルキルエーテルおよび/またはアルカンと;ジアルキルグリコールモノアルキルエーテルと;の混合物を含む溶媒系をさらに含む、請求項1に記載の組成物。
- 基体上のフォトレジスト層;およびフォトレジスト層上の上塗り層;を含む被覆された基体であって、
上塗り層が、互いに異なっている第1樹脂、第2樹脂および第3樹脂を含み;
第1樹脂は1種以上のフッ素化基を含み、かつ第2樹脂および第3樹脂それぞれよりも大きな重量比率で組成物中に存在しており;
第2樹脂は、第1樹脂および第3樹脂の表面エネルギーよりも低い表面エネルギーを有し;並びに
第3樹脂は1種以上の強酸基を含む;
被覆された基体。 - 上塗り層が段階的層である、請求項6の被覆された基体。
- (a)フォトレジスト組成物を基体上に適用してフォトレジスト層を形成し;
(b)互いに異なっている第1樹脂、第2樹脂および第3樹脂を含み;
第1樹脂は1種以上のフッ素化基を含み、かつ第2樹脂および第3樹脂それぞれよりも大きな重量比率で組成物中に存在しており;
第2樹脂は、第1樹脂および第3樹脂の表面エネルギーよりも低い表面エネルギーを有し;および
第3樹脂は1種以上の強酸基を含む;
上塗り組成物をフォトレジスト層上に適用し;並びに
(c)フォトレジスト層を化学線に露光する;
ことを含む、フォトレジスト組成物を処理する方法。 - 露光が液浸露光であり、基体が半導体ウェハである、請求項8に記載の方法。
- 上塗り層が段階的層である、請求項8に記載の方法。
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TWI452435B (zh) | 2014-09-11 |
JP2010237646A (ja) | 2010-10-21 |
CN102053492B (zh) | 2013-06-12 |
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US9274427B2 (en) | 2016-03-01 |
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