JP5455325B2 - 多重ウェルcmosイメージセンサ及びその製造方法 - Google Patents
多重ウェルcmosイメージセンサ及びその製造方法 Download PDFInfo
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- JP5455325B2 JP5455325B2 JP2008131192A JP2008131192A JP5455325B2 JP 5455325 B2 JP5455325 B2 JP 5455325B2 JP 2008131192 A JP2008131192 A JP 2008131192A JP 2008131192 A JP2008131192 A JP 2008131192A JP 5455325 B2 JP5455325 B2 JP 5455325B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 30
- 239000000758 substrate Substances 0.000 claims description 44
- 238000009792 diffusion process Methods 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 25
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 18
- 229910052710 silicon Inorganic materials 0.000 claims description 18
- 239000010703 silicon Substances 0.000 claims description 18
- 238000000407 epitaxy Methods 0.000 claims description 14
- 238000002513 implantation Methods 0.000 claims description 14
- 239000012535 impurity Substances 0.000 claims description 14
- 150000002500 ions Chemical class 0.000 claims description 13
- 238000005468 ion implantation Methods 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000031700 light absorption Effects 0.000 description 3
- 238000005381 potential energy Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14689—MOS based technologies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035236—Superlattices; Multiple quantum well structures
- H01L31/035263—Doping superlattices, e.g. nipi superlattices
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
Description
20 フォトダイオード
21 第1フォトダイオード
22 第2フォトダイオード
23 第3フォトダイオード
24 第4フォトダイオード
25 n+ウォール
30 フローティング拡散領域
32 トランスファゲート
40 p型ウォール
n1 第1n型ドーピング層
n2 第2n型ドーピング層
n3 第3n型ドーピング層
n4 第4n型ドーピング層
p1 第1p型ドーピング層
p2 第2p型ドーピング層
p3 第3p型ドーピング層
p4 第4p型ドーピング層
p5 第5p型ドーピング層
Claims (15)
- 基板の所定の領域で垂直に形成された複数のフォトダイオードと、
前記複数のフォトダイオードの外周を前記基板に垂直かつ直接に連結するn+ウォールと、
前記n+ウォールの一側で前記複数のフォトダイオードと連結されて、前記複数のフォトダイオードからの電荷を伝送されるフローティング拡散領域と、を備え、
前記フローティング拡散領域と前記n+ウォールとの間には、p型領域が形成され、
前記複数のフォトダイオードは、多重ポテンシャルウェル構造であり、
前記n+ウォールは、前pn接合を形成する前記複数のフォトダイオードよりも低いポテンシャルであり、
前記n+ウォールは、前記フォトダイオードの外周を完全に取り囲む
ことを特徴とする多重ウェルCMOSイメージセンサ。 - 前記フォトダイオードは、n型不純物層とその周囲のp型不純物層とで形成されたpn接合ダイオードである
ことを特徴とする請求項1に記載のイメージセンサ。 - 前記フォトダイオードは、前記基板から3μmの深さ以上で形成された
ことを特徴とする請求項1に記載のイメージセンサ。 - 前記p型領域は、注入工程で形成されたp型ウォールである
ことを特徴とする請求項1に記載のイメージセンサ。 - 前記複数のフォトダイオードのn型層は、イオン注入工程で形成された
ことを特徴とする請求項1に記載のイメージセンサ。 - 基板上に複数のp型ドーピング層と複数のn型ドーピング層とが交互に形成されたエピタキシ層を形成する第1工程と、
前記エピタキシ層の上方からn+不純物をイオン注入して、フォトダイオード領域の外周にn+ウォールを形成する第2工程と、
前記エピタキシ層の表面から前記n+ウォールの一側にp型導電性イオンを注入してp型ウォールを形成する第3工程と、
前記エピタキシ層に前記p型ウォールと連通されるようにn++イオンを注入して、フローティング拡散領域を形成する第4工程と、を含む
ことを特徴とする多重ウェルCMOSイメージセンサの製造方法。 - 前記エピタキシ層は、シリコン層である
ことを特徴とする請求項6に記載のイメージセンサの製造方法。 - 前記第2工程は、フォトダイオード領域の外周を完全に取り囲む前記n+ウォールを形成する
ことを特徴とする請求項6に記載のイメージセンサの製造方法。 - 前記第3工程は、前記n+ウォールの深さ以上で前記p型ウォールを形成する
ことを特徴とする請求項6に記載のイメージセンサの製造方法。 - 前記第1工程は、3μm以上の深さで前記エピタキシ層を形成する
ことを特徴とする請求項6に記載のイメージセンサの製造方法。 - p型基板の表面からフォトダイオード領域に垂直に互いに離隔された複数のn型層を形成する第1工程と、
前記基板の上方からn+不純物をイオン注入して、フォトダイオード領域の外周に前記基板に垂直かつ直接に連結するn+ウォールを形成する第2工程と、
前記n+ウォールの一側から離隔されるようにn++イオンを注入して、フローティング拡散領域を形成する第3工程と、を含み、
前記n+ウォールは、前pn接合を形成する前記複数のフォトダイオードよりも低いポテンシャルであり、
前記第2工程は、フォトダイオード領域の外周を完全に取り囲む前記n+ウォールを形成する
ことを特徴とする多重ウェルCMOSイメージセンサの製造方法。 - 前記基板は、シリコン基板である
ことを特徴とする請求項11に記載のイメージセンサの製造方法。 - 前記第1工程は、n型イオンを注入する工程である
ことを特徴とする請求項11に記載のイメージセンサの製造方法。 - 前記第2工程は、前記複数のn型層と連通されるように前記n+ウォールを形成する
ことを特徴とする請求項11に記載の多重ウェルCMOSイメージセンサの製造方法。 - 前記第1工程は、3μm以上の深さで前記n型層を形成する
ことを特徴とする請求項11に記載のイメージセンサの製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2007-0052225 | 2007-05-29 | ||
KR1020070052225A KR101146590B1 (ko) | 2007-05-29 | 2007-05-29 | 다중우물 시모스 이미지센서 및 그 제조방법 |
Publications (2)
Publication Number | Publication Date |
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JP2008300826A JP2008300826A (ja) | 2008-12-11 |
JP5455325B2 true JP5455325B2 (ja) | 2014-03-26 |
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Application Number | Title | Priority Date | Filing Date |
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JP2008131192A Expired - Fee Related JP5455325B2 (ja) | 2007-05-29 | 2008-05-19 | 多重ウェルcmosイメージセンサ及びその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7777259B2 (ja) |
JP (1) | JP5455325B2 (ja) |
KR (1) | KR101146590B1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5374941B2 (ja) * | 2008-07-02 | 2013-12-25 | ソニー株式会社 | 固体撮像装置及び電子機器 |
JP4905468B2 (ja) * | 2009-01-09 | 2012-03-28 | ソニー株式会社 | 固体撮像素子 |
US8138531B2 (en) * | 2009-09-17 | 2012-03-20 | International Business Machines Corporation | Structures, design structures and methods of fabricating global shutter pixel sensor cells |
KR101867488B1 (ko) * | 2012-01-10 | 2018-06-14 | 삼성전자주식회사 | 이미지 센서 |
US8889461B2 (en) | 2012-05-29 | 2014-11-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | CIS image sensors with epitaxy layers and methods for forming the same |
JP6607777B2 (ja) | 2015-12-28 | 2019-11-20 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
CN108054179A (zh) * | 2017-12-11 | 2018-05-18 | 德淮半导体有限公司 | 用于形成图像传感器的方法及图像传感器 |
WO2019235230A1 (ja) | 2018-06-06 | 2019-12-12 | ソニーセミコンダクタソリューションズ株式会社 | 撮像素子、電子機器 |
JP2022112252A (ja) * | 2021-01-21 | 2022-08-02 | ソニーセミコンダクタソリューションズ株式会社 | 光検出素子および電子機器 |
US20230361236A1 (en) * | 2022-05-05 | 2023-11-09 | Globalfoundries Singapore Pte. Ltd. | Multi-semiconductor layer photodetector and related method |
CN115579373B (zh) * | 2022-11-09 | 2023-02-24 | 合肥晶合集成电路股份有限公司 | 图像传感器像素结构及其制备方法 |
Family Cites Families (11)
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US6489643B1 (en) * | 1998-06-27 | 2002-12-03 | Hynix Semiconductor Inc. | Photodiode having a plurality of PN junctions and image sensor having the same |
JP3445502B2 (ja) * | 1998-09-11 | 2003-09-08 | 株式会社東芝 | 固体撮像装置 |
JP4765012B2 (ja) * | 2000-02-09 | 2011-09-07 | 富士電機株式会社 | 半導体装置及びその製造方法 |
US6946715B2 (en) * | 2003-02-19 | 2005-09-20 | Micron Technology, Inc. | CMOS image sensor and method of fabrication |
US8039882B2 (en) | 2003-08-22 | 2011-10-18 | Micron Technology, Inc. | High gain, low noise photodiode for image sensors and method of formation |
US7154137B2 (en) * | 2004-10-12 | 2006-12-26 | Omnivision Technologies, Inc. | Image sensor and pixel having a non-convex photodiode |
US8018015B2 (en) * | 2005-06-29 | 2011-09-13 | Micron Technology, Inc. | Buried conductor for imagers |
JP2007027603A (ja) | 2005-07-21 | 2007-02-01 | Matsushita Electric Ind Co Ltd | 撮像装置 |
JP2007096271A (ja) * | 2005-09-05 | 2007-04-12 | Toshiba Corp | 固体撮像装置及びその製造方法 |
JP4823619B2 (ja) | 2005-09-12 | 2011-11-24 | ルネサスエレクトロニクス株式会社 | 光電変換素子、固定撮像デバイス、撮像装置、および画像読み取り装置 |
JP2008016542A (ja) * | 2006-07-04 | 2008-01-24 | Nikon Corp | 固体撮像装置 |
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2007
- 2007-05-29 KR KR1020070052225A patent/KR101146590B1/ko active IP Right Grant
- 2007-10-31 US US11/980,628 patent/US7777259B2/en not_active Expired - Fee Related
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2008
- 2008-05-19 JP JP2008131192A patent/JP5455325B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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KR101146590B1 (ko) | 2012-05-16 |
JP2008300826A (ja) | 2008-12-11 |
US20080296641A1 (en) | 2008-12-04 |
US7777259B2 (en) | 2010-08-17 |
KR20080104859A (ko) | 2008-12-03 |
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