JP5453605B2 - 無電解Ｃｕめっき液および無電解Ｃｕめっき方法 - Google Patents
無電解Ｃｕめっき液および無電解Ｃｕめっき方法 Download PDFInfo
- Publication number
- JP5453605B2 JP5453605B2 JP2009209998A JP2009209998A JP5453605B2 JP 5453605 B2 JP5453605 B2 JP 5453605B2 JP 2009209998 A JP2009209998 A JP 2009209998A JP 2009209998 A JP2009209998 A JP 2009209998A JP 5453605 B2 JP5453605 B2 JP 5453605B2
- Authority
- JP
- Japan
- Prior art keywords
- electroless
- plating
- cnt
- plating film
- plating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007747 plating Methods 0.000 title claims description 99
- 238000000034 method Methods 0.000 title claims description 8
- 239000002270 dispersing agent Substances 0.000 claims description 13
- 239000002041 carbon nanotube Substances 0.000 claims description 12
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 claims description 10
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 10
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 claims description 10
- 239000001863 hydroxypropyl cellulose Substances 0.000 claims description 10
- 238000007772 electroless plating Methods 0.000 claims description 8
- 239000010949 copper Substances 0.000 description 51
- 239000002134 carbon nanofiber Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 7
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 5
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 5
- 229940112669 cuprous oxide Drugs 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 3
- 239000004917 carbon fiber Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 239000002048 multi walled nanotube Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920002125 Sokalan® Polymers 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000004584 polyacrylic acid Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- CKQAOGOZKZJUGA-UHFFFAOYSA-N 1-nonyl-4-(4-nonylphenoxy)benzene Chemical compound C1=CC(CCCCCCCCC)=CC=C1OC1=CC=C(CCCCCCCCC)C=C1 CKQAOGOZKZJUGA-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- 101150003085 Pdcl gene Proteins 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920003086 cellulose ether Polymers 0.000 description 1
- SXPWTBGAZSPLHA-UHFFFAOYSA-M cetalkonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+](C)(C)CC1=CC=CC=C1 SXPWTBGAZSPLHA-UHFFFAOYSA-M 0.000 description 1
- 229960000228 cetalkonium chloride Drugs 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009209998A JP5453605B2 (ja) | 2009-09-11 | 2009-09-11 | 無電解Ｃｕめっき液および無電解Ｃｕめっき方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009209998A JP5453605B2 (ja) | 2009-09-11 | 2009-09-11 | 無電解Ｃｕめっき液および無電解Ｃｕめっき方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011058061A JP2011058061A (ja) | 2011-03-24 |
| JP2011058061A5 JP2011058061A5 (enExample) | 2012-04-05 |
| JP5453605B2 true JP5453605B2 (ja) | 2014-03-26 |
Family
ID=43946013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009209998A Expired - Fee Related JP5453605B2 (ja) | 2009-09-11 | 2009-09-11 | 無電解Ｃｕめっき液および無電解Ｃｕめっき方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5453605B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6304681B2 (ja) * | 2013-07-24 | 2018-04-04 | 国立大学法人信州大学 | 金属膜及び金属膜の形成方法 |
| WO2016013219A1 (ja) * | 2014-07-23 | 2016-01-28 | 日本ゼオン株式会社 | めっき液およびその製造方法、並びに、複合材料、銅複合材料およびその製造方法 |
| US10316424B2 (en) | 2016-02-23 | 2019-06-11 | Samsung Electronics Co., Ltd. | Flexible electrically conductive structure, flexible wiring board, production method thereof, and electronic device includng the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4528223B2 (ja) * | 2005-07-25 | 2010-08-18 | 本田技研工業株式会社 | 熱輸送流体 |
| JP4599565B2 (ja) * | 2006-10-23 | 2010-12-15 | 国立大学法人信州大学 | 電解めっき方法および電解めっき液 |
| JP2008201834A (ja) * | 2007-02-16 | 2008-09-04 | Honda Motor Co Ltd | 熱輸送流体 |
-
2009
- 2009-09-11 JP JP2009209998A patent/JP5453605B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011058061A (ja) | 2011-03-24 |
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