JP5443849B2 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP5443849B2
JP5443849B2 JP2009151832A JP2009151832A JP5443849B2 JP 5443849 B2 JP5443849 B2 JP 5443849B2 JP 2009151832 A JP2009151832 A JP 2009151832A JP 2009151832 A JP2009151832 A JP 2009151832A JP 5443849 B2 JP5443849 B2 JP 5443849B2
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Japan
Prior art keywords
pad
columnar member
wiring board
solder
connection
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JP2009151832A
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English (en)
Japanese (ja)
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JP2011009488A5 (enExample
JP2011009488A (ja
Inventor
孝 大塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2009151832A priority Critical patent/JP5443849B2/ja
Publication of JP2011009488A publication Critical patent/JP2011009488A/ja
Publication of JP2011009488A5 publication Critical patent/JP2011009488A5/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

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  • Combinations Of Printed Boards (AREA)
JP2009151832A 2009-06-26 2009-06-26 半導体装置及びその製造方法 Active JP5443849B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009151832A JP5443849B2 (ja) 2009-06-26 2009-06-26 半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009151832A JP5443849B2 (ja) 2009-06-26 2009-06-26 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2011009488A JP2011009488A (ja) 2011-01-13
JP2011009488A5 JP2011009488A5 (enExample) 2012-07-26
JP5443849B2 true JP5443849B2 (ja) 2014-03-19

Family

ID=43565800

Family Applications (1)

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JP2009151832A Active JP5443849B2 (ja) 2009-06-26 2009-06-26 半導体装置及びその製造方法

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JP (1) JP5443849B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013219170A (ja) * 2012-04-09 2013-10-24 Yokogawa Electric Corp 基板装置
KR101930689B1 (ko) * 2012-05-25 2018-12-19 삼성전자주식회사 반도체 장치
JP6342794B2 (ja) * 2014-12-25 2018-06-13 新光電気工業株式会社 配線基板及び配線基板の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6263486A (ja) * 1985-09-13 1987-03-20 富士通株式会社 混成集積回路の重層構造
JP2527562Y2 (ja) * 1990-09-03 1997-03-05 富士通テン株式会社 基板接続構造
JPH0832216A (ja) * 1994-07-15 1996-02-02 Matsushita Electric Ind Co Ltd 半田付け方法
JPH08195556A (ja) * 1995-01-13 1996-07-30 Fujitsu Ten Ltd 回路基板間の接続方法
JPH08316629A (ja) * 1995-05-16 1996-11-29 Nec Shizuoka Ltd 半田柱によるマルチ・チップ・モジュール基板の 半田付処理方法
JP2001267714A (ja) * 2000-03-16 2001-09-28 Sony Corp 電子回路装置
JP3801902B2 (ja) * 2001-10-30 2006-07-26 シャープ株式会社 積層型半導体装置
KR101037229B1 (ko) * 2006-04-27 2011-05-25 스미토모 베이클리트 컴퍼니 리미티드 반도체 장치 및 반도체 장치의 제조 방법
JP5125349B2 (ja) * 2007-09-21 2013-01-23 カシオ計算機株式会社 半導体装置の実装構造および実装方法
JP2009073735A (ja) * 2008-10-31 2009-04-09 Alps Electric Co Ltd ホルダ付光学素子の製造方法

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JP2011009488A (ja) 2011-01-13

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