JP5437555B2 - Ebcのためのシリコン含有基材の結合コートおよび同物を製造するプロセス - Google Patents
Ebcのためのシリコン含有基材の結合コートおよび同物を製造するプロセス Download PDFInfo
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- JP5437555B2 JP5437555B2 JP2006158296A JP2006158296A JP5437555B2 JP 5437555 B2 JP5437555 B2 JP 5437555B2 JP 2006158296 A JP2006158296 A JP 2006158296A JP 2006158296 A JP2006158296 A JP 2006158296A JP 5437555 B2 JP5437555 B2 JP 5437555B2
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| US11/150,098 US7442444B2 (en) | 2005-06-13 | 2005-06-13 | Bond coat for silicon-containing substrate for EBC and processes for preparing same |
| US11/150,098 | 2005-06-13 |
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| CN114368969A (zh) * | 2022-01-27 | 2022-04-19 | 江苏航运职业技术学院 | TiSi2掺杂Gd2Zr2O7陶瓷材料、制备方法及热障涂层 |
| CN116425566B (zh) * | 2023-04-26 | 2024-07-12 | 北京理工大学 | 掺杂LaSi2改性的ZrB2-SiC复合粉体及其制备方法、热防护涂层及其制备方法 |
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| GB0611268D0 (en) | 2006-07-19 |
| GB2427204A (en) | 2006-12-20 |
| US7442444B2 (en) | 2008-10-28 |
| JP2007015913A (ja) | 2007-01-25 |
| US20060280953A1 (en) | 2006-12-14 |
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