JP5431706B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP5431706B2
JP5431706B2 JP2008255960A JP2008255960A JP5431706B2 JP 5431706 B2 JP5431706 B2 JP 5431706B2 JP 2008255960 A JP2008255960 A JP 2008255960A JP 2008255960 A JP2008255960 A JP 2008255960A JP 5431706 B2 JP5431706 B2 JP 5431706B2
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JP
Japan
Prior art keywords
light
phosphor
light emitting
emitting device
dispersion layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008255960A
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English (en)
Japanese (ja)
Other versions
JP2010087324A5 (enExample
JP2010087324A (ja
Inventor
英樹 加藤
哲 長曽我部
大輔 中山
怜史 島岡
翔太 笹嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Minebea Co Ltd
Original Assignee
Minebea Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minebea Co Ltd filed Critical Minebea Co Ltd
Priority to JP2008255960A priority Critical patent/JP5431706B2/ja
Publication of JP2010087324A publication Critical patent/JP2010087324A/ja
Publication of JP2010087324A5 publication Critical patent/JP2010087324A5/ja
Application granted granted Critical
Publication of JP5431706B2 publication Critical patent/JP5431706B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Led Device Packages (AREA)
JP2008255960A 2008-10-01 2008-10-01 発光装置 Expired - Fee Related JP5431706B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008255960A JP5431706B2 (ja) 2008-10-01 2008-10-01 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008255960A JP5431706B2 (ja) 2008-10-01 2008-10-01 発光装置

Publications (3)

Publication Number Publication Date
JP2010087324A JP2010087324A (ja) 2010-04-15
JP2010087324A5 JP2010087324A5 (enExample) 2012-08-30
JP5431706B2 true JP5431706B2 (ja) 2014-03-05

Family

ID=42250975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008255960A Expired - Fee Related JP5431706B2 (ja) 2008-10-01 2008-10-01 発光装置

Country Status (1)

Country Link
JP (1) JP5431706B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101902371B1 (ko) * 2017-03-02 2018-09-28 주식회사 이츠웰 파장 선택형 엘이디 패키지 및 이를 이용한 엘이디 패키지 어레이

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5440064B2 (ja) * 2008-10-21 2014-03-12 東芝ライテック株式会社 照明装置
JP5767444B2 (ja) 2010-06-16 2015-08-19 ソニー株式会社 光源装置及び画像投影装置
JP2013538461A (ja) * 2010-09-21 2013-10-10 ▲セン▼國光 パッケージ済み発光ダイオードの作製方法
CN102479888B (zh) * 2010-11-30 2014-04-09 盈胜科技股份有限公司 在两光学透镜及分隔环界定的槽间中填注并密封荧光层的方法
JP5733743B2 (ja) * 2010-12-15 2015-06-10 日東電工株式会社 光半導体装置
JP2014199831A (ja) * 2011-08-12 2014-10-23 シャープ株式会社 発光装置、蛍光体シート、及びバックライトシステム、及び発光装置の製造方法
KR20130045687A (ko) * 2011-10-26 2013-05-06 엘지이노텍 주식회사 발광 장치 및 이를 구비한 조명 장치
JP6058948B2 (ja) * 2012-08-28 2017-01-11 日東光学株式会社 光学フィルタ、光源装置、照明装置
TW201417353A (zh) * 2012-08-29 2014-05-01 夏普股份有限公司 發光元件及發光元件之製造方法
KR102015907B1 (ko) 2013-01-24 2019-08-29 삼성전자주식회사 반도체 발광소자
JP2014203852A (ja) * 2013-04-01 2014-10-27 日本電気硝子株式会社 波長変換部材及び発光デバイス
US20150137163A1 (en) 2013-11-13 2015-05-21 Nanoco Technologies Ltd. LED Cap Containing Quantum Dot Phosphors
JP6438648B2 (ja) 2013-11-15 2018-12-19 日亜化学工業株式会社 半導体発光装置およびその製造方法
KR102254916B1 (ko) 2014-02-05 2021-05-26 삼성디스플레이 주식회사 파장 변환 부재, 및 이를 포함하는 백라이트 어셈블리 및 표시 장치
JP6183486B2 (ja) * 2015-05-29 2017-08-23 日亜化学工業株式会社 発光装置、被覆部材の製造方法及び発光装置の製造方法
JP6179628B2 (ja) * 2016-03-23 2017-08-16 セイコーエプソン株式会社 照明装置、電子機器及び投射型表示装置
JP6740762B2 (ja) 2016-07-13 2020-08-19 日亜化学工業株式会社 発光装置およびその製造方法
TWI797259B (zh) 2018-02-20 2023-04-01 晶元光電股份有限公司 一種發光單元及其發光裝置
JP6822452B2 (ja) 2018-08-23 2021-01-27 セイコーエプソン株式会社 光源装置およびプロジェクター
JP7701241B2 (ja) * 2021-10-26 2025-07-01 株式会社小糸製作所 半導体発光装置、および車両用灯具

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3707688B2 (ja) * 2002-05-31 2005-10-19 スタンレー電気株式会社 発光装置およびその製造方法
JP4238681B2 (ja) * 2003-09-17 2009-03-18 豊田合成株式会社 発光装置
JP4020092B2 (ja) * 2004-03-16 2007-12-12 住友電気工業株式会社 半導体発光装置
JP4451178B2 (ja) * 2004-03-25 2010-04-14 スタンレー電気株式会社 発光デバイス
JP2005294646A (ja) * 2004-04-01 2005-10-20 Sumitomo Electric Ind Ltd 発光装置
JP4606382B2 (ja) * 2005-01-27 2011-01-05 京セラ株式会社 発光装置
DE102006000476A1 (de) * 2005-09-22 2007-05-24 Lexedis Lighting Gesmbh Lichtemissionsvorrichtung
JP2007109947A (ja) * 2005-10-14 2007-04-26 Toyoda Gosei Co Ltd 蛍光体板及びこれを備えた発光装置
JP4873963B2 (ja) * 2006-02-27 2012-02-08 京セラ株式会社 発光装置およびそれを用いた照明装置
WO2007105647A1 (ja) * 2006-03-10 2007-09-20 Nichia Corporation 発光装置
JP2007266358A (ja) * 2006-03-29 2007-10-11 Kyocera Corp 発光装置および照明装置
JP2008004645A (ja) * 2006-06-20 2008-01-10 Harison Toshiba Lighting Corp 発光デバイス
WO2008056296A1 (en) * 2006-11-06 2008-05-15 Koninklijke Philips Electronics N.V. Wavelength converting elements with reflective edges
EP2843716A3 (en) * 2006-11-15 2015-04-29 The Regents of The University of California Textured phosphor conversion layer light emitting diode
JP5236344B2 (ja) * 2008-04-24 2013-07-17 パナソニック株式会社 半導体発光装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101902371B1 (ko) * 2017-03-02 2018-09-28 주식회사 이츠웰 파장 선택형 엘이디 패키지 및 이를 이용한 엘이디 패키지 어레이

Also Published As

Publication number Publication date
JP2010087324A (ja) 2010-04-15

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