JP5426689B2 - 記憶層材料を備えた磁気素子 - Google Patents
記憶層材料を備えた磁気素子 Download PDFInfo
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- JP5426689B2 JP5426689B2 JP2011544695A JP2011544695A JP5426689B2 JP 5426689 B2 JP5426689 B2 JP 5426689B2 JP 2011544695 A JP2011544695 A JP 2011544695A JP 2011544695 A JP2011544695 A JP 2011544695A JP 5426689 B2 JP5426689 B2 JP 5426689B2
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- 230000005291 magnetic effect Effects 0.000 title claims description 50
- 239000000463 material Substances 0.000 title description 15
- 230000005294 ferromagnetic effect Effects 0.000 claims description 59
- 238000003860 storage Methods 0.000 claims description 47
- 229910019236 CoFeB Inorganic materials 0.000 claims description 44
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 11
- ZDZZPLGHBXACDA-UHFFFAOYSA-N [B].[Fe].[Co] Chemical compound [B].[Fe].[Co] ZDZZPLGHBXACDA-UHFFFAOYSA-N 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical group [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 7
- 229910052707 ruthenium Inorganic materials 0.000 claims description 7
- FQMNUIZEFUVPNU-UHFFFAOYSA-N cobalt iron Chemical compound [Fe].[Co].[Co] FQMNUIZEFUVPNU-UHFFFAOYSA-N 0.000 claims description 6
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 claims description 5
- 230000008878 coupling Effects 0.000 description 14
- 238000010168 coupling process Methods 0.000 description 14
- 238000005859 coupling reaction Methods 0.000 description 14
- 230000005415 magnetization Effects 0.000 description 8
- 238000002955 isolation Methods 0.000 description 7
- 239000013598 vector Substances 0.000 description 6
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- 239000000395 magnesium oxide Substances 0.000 description 4
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000005290 antiferromagnetic effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000005316 antiferromagnetic exchange Effects 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
- H10N50/85—Magnetic active materials
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
- G11C11/15—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Mram Or Spin Memory Techniques (AREA)
- Hall/Mr Elements (AREA)
- Thin Magnetic Films (AREA)
- Semiconductor Memories (AREA)
Description
310 リファレンス層
320 絶縁層
330 記憶層
Claims (12)
- リファレンス強磁性層と、
非磁性サブ層を介してコバルト‐鉄(CoFe)サブ層に結合されたコバルト‐鉄‐ホウ素(CoFeB)サブ層を備えた記憶強磁性層と、
前記リファレンス強磁性層と前記記憶強磁性層との間に配置された絶縁層と、を備えた磁気トンネル接合(MTJ)素子であって、
前記CoFeBサブ層が前記CoFeサブ層に強磁性的に結合され、
前記非磁性サブ層が、ルテニウム(Ru)であり、略2Åから略5Åの範囲内の厚さを有する、MTJ素子。 - 前記記憶強磁性層が、前記CoFeサブ層に結合されたニッケル‐鉄(NiFe)サブ層を更に備える、請求項1に記載のMTJ素子。
- リファレンス強磁性層と、
非磁性サブ層を介してニッケル‐鉄(NiFe)サブ層に結合されたコバルト‐鉄‐ホウ素(CoFeB)サブ層を備えた記憶強磁性層と、
前記リファレンス強磁性層と前記記憶強磁性層との間に配置された絶縁層と、を備えた磁気トンネル接合(MTJ)素子であって、
前記CoFeBサブ層が前記NiFeサブ層に強磁性的に結合され、
前記非磁性サブ層が、ルテニウム(Ru)であり、略2Åから略5Åの範囲内の厚さを有する、MTJ素子。 - 前記記憶強磁性層が、前記NiFeサブ層に結合されたコバルト‐鉄(CoFe)サブ層を更に備える、請求項3に記載のMTJ素子。
- 前記記憶強磁性層が、前記NiFeサブ層に結合された第二のCoFeBサブ層を更に備える、請求項3に記載のMTJ素子。
- リファレンス強磁性層を形成する段階と、
非磁性サブ層を介してコバルト‐鉄(CoFe)サブ層に結合されたコバルト‐鉄‐ホウ素(CoFeB)サブ層を備えた記憶強磁性層を形成する段階と、
前記リファレンス強磁性層と前記記憶強磁性層との間に配置された絶縁層を形成する段階と、を備えた磁気トンネル接合(MTJ)デバイスの製造方法であって、
前記CoFeBサブ層が前記CoFeサブ層に強磁性的に結合され、
前記非磁性サブ層が、ルテニウム(Ru)であり、略2Åから略5Åの範囲内の厚さを有する、製造方法。 - 前記記憶強磁性層が、前記CoFeサブ層に結合されたNiFeサブ層を更に備える、請求項6に記載の製造方法。
- リファレンス強磁性層を形成する段階と、
非磁性サブ層を介してニッケル‐鉄(NiFe)サブ層に結合されたコバルト‐鉄‐ホウ素(CoFeB)サブ層を備えた記憶強磁性層を形成する段階と、
前記リファレンス強磁性層と前記記憶強磁性層との間に配置された絶縁層を形成する段階と、を備えた磁気トンネル接合(MTJ)デバイスの製造方法であって、
前記CoFeBサブ層が前記NiFeサブ層に強磁性的に結合され、
前記非磁性サブ層が、ルテニウム(Ru)であり、略2Åから略5Åの範囲内の厚さを有する、製造方法。 - 前記記憶強磁性層が、前記NiFeサブ層に結合されたコバルト‐鉄(CoFe)サブ層を更に備える、請求項8に記載の製造方法。
- 前記記憶強磁性層が、前記NiFeサブ層に結合された第二のCoFeBサブ層を更に備える、請求項8に記載の製造方法。
- トランジスタと、
前記トランジスタに直列に結合された磁気トンネル接合(MTJ)素子と、を備えたメモリであって、
前記磁気トンネル接合(MTJ)素子が、
リファレンス強磁性層と、
非磁性サブ層を介してコバルト‐鉄(CoFe)サブ層に結合されたコバルト‐鉄‐ホウ素(CoFeB)サブ層を備えた記憶強磁性層と、
前記リファレンス強磁性層と前記記憶強磁性層との間に配置された絶縁層とを備え、
前記CoFeBサブ層が前記CoFeサブ層に強磁性的に結合され、
前記非磁性サブ層が、ルテニウム(Ru)であり、略2Åから略5Åの範囲内の厚さを有する、メモリ。 - 前記記憶強磁性層が、前記CoFeサブ層に結合されたニッケル‐鉄(NiFe)サブ層を更に備える、請求項11に記載のメモリ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US12/352,648 US8536669B2 (en) | 2009-01-13 | 2009-01-13 | Magnetic element with storage layer materials |
US12/352,648 | 2009-01-13 | ||
PCT/US2010/020919 WO2010083233A1 (en) | 2009-01-13 | 2010-01-13 | Magnetic element with storage layer materials |
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JP2013234723A Division JP5753888B2 (ja) | 2009-01-13 | 2013-11-13 | 記憶層材料を備えた磁気素子 |
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JP2012514858A JP2012514858A (ja) | 2012-06-28 |
JP5426689B2 true JP5426689B2 (ja) | 2014-02-26 |
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JP2013234723A Expired - Fee Related JP5753888B2 (ja) | 2009-01-13 | 2013-11-13 | 記憶層材料を備えた磁気素子 |
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Country Status (8)
Country | Link |
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US (2) | US8536669B2 (ja) |
EP (1) | EP2382675B1 (ja) |
JP (2) | JP5426689B2 (ja) |
KR (1) | KR101304369B1 (ja) |
CN (2) | CN102272965B (ja) |
BR (1) | BRPI1007146A2 (ja) |
TW (1) | TW201044657A (ja) |
WO (1) | WO2010083233A1 (ja) |
Families Citing this family (23)
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US7880209B2 (en) * | 2008-10-09 | 2011-02-01 | Seagate Technology Llc | MRAM cells including coupled free ferromagnetic layers for stabilization |
US8089132B2 (en) | 2008-10-09 | 2012-01-03 | Seagate Technology Llc | Magnetic memory with phonon glass electron crystal material |
US8039913B2 (en) | 2008-10-09 | 2011-10-18 | Seagate Technology Llc | Magnetic stack with laminated layer |
US8045366B2 (en) | 2008-11-05 | 2011-10-25 | Seagate Technology Llc | STRAM with composite free magnetic element |
US8043732B2 (en) | 2008-11-11 | 2011-10-25 | Seagate Technology Llc | Memory cell with radial barrier |
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US7826259B2 (en) | 2009-01-29 | 2010-11-02 | Seagate Technology Llc | Staggered STRAM cell |
US7999338B2 (en) | 2009-07-13 | 2011-08-16 | Seagate Technology Llc | Magnetic stack having reference layers with orthogonal magnetization orientation directions |
TWI398973B (zh) * | 2009-12-31 | 2013-06-11 | Ind Tech Res Inst | 垂直式磁性磁阻元件結構 |
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US9715915B2 (en) | 2014-10-30 | 2017-07-25 | Samsung Electronics Co., Ltd. | Magneto-resistive devices including a free layer having different magnetic properties during operations |
KR102566954B1 (ko) | 2016-08-04 | 2023-08-16 | 삼성전자주식회사 | 자기 메모리 소자 및 그 제조 방법 |
US11605409B2 (en) | 2020-10-27 | 2023-03-14 | International Business Machines Corporation | MTJ-based analog memory device |
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2009
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- 2010-01-13 BR BRPI1007146A patent/BRPI1007146A2/pt not_active IP Right Cessation
- 2010-01-13 WO PCT/US2010/020919 patent/WO2010083233A1/en active Application Filing
- 2010-01-13 TW TW099100981A patent/TW201044657A/zh unknown
- 2010-01-13 CN CN201080004267.8A patent/CN102272965B/zh active Active
- 2010-01-13 CN CN201410283280.1A patent/CN104021812B/zh active Active
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JP2012514858A (ja) | 2012-06-28 |
KR101304369B1 (ko) | 2013-09-11 |
US20100176471A1 (en) | 2010-07-15 |
BRPI1007146A2 (pt) | 2018-03-13 |
KR20110114667A (ko) | 2011-10-19 |
TW201044657A (en) | 2010-12-16 |
JP2014078722A (ja) | 2014-05-01 |
CN104021812B (zh) | 2018-10-26 |
JP5753888B2 (ja) | 2015-07-22 |
US8536669B2 (en) | 2013-09-17 |
WO2010083233A1 (en) | 2010-07-22 |
CN104021812A (zh) | 2014-09-03 |
US8823120B2 (en) | 2014-09-02 |
US20130320468A1 (en) | 2013-12-05 |
CN102272965A (zh) | 2011-12-07 |
EP2382675A1 (en) | 2011-11-02 |
EP2382675B1 (en) | 2013-03-06 |
CN102272965B (zh) | 2014-07-30 |
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