JP5425434B2 - 流体材料の液滴を分注するようにディスペンサを作動する方法 - Google Patents
流体材料の液滴を分注するようにディスペンサを作動する方法 Download PDFInfo
- Publication number
- JP5425434B2 JP5425434B2 JP2008242419A JP2008242419A JP5425434B2 JP 5425434 B2 JP5425434 B2 JP 5425434B2 JP 2008242419 A JP2008242419 A JP 2008242419A JP 2008242419 A JP2008242419 A JP 2008242419A JP 5425434 B2 JP5425434 B2 JP 5425434B2
- Authority
- JP
- Japan
- Prior art keywords
- dispensing
- dispenser
- substrate
- fluid material
- test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
- B05B12/084—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to condition of liquid or other fluent material already sprayed on the target, e.g. coating thickness, weight or pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
- Spray Control Apparatus (AREA)
Description
11:キャビネット
12:流体材料液滴生成器
14:X−Yポジショナ
15:Z軸駆動機構
16、17,18:軸駆動部
20:基板
21:X移動軸
22:Y移動軸
23:Z移動軸
24:コンピュータ
25:メモリ
26:ヒューマン・マシン・インターフェース・デバイス
28:通信バス
30:制御パネル
32:移動コントローラ
34:ビデオカメラ及び照明アセンブリ
36:映像回路
37:基板の上面
38:コンベヤ
40:単頭矢印
42:コンベヤ・コントローラ
44、45、46:エンコーダ
48:流体材料の量
50:流体材料ドット
52:流体材料のライン
60:ジェット噴射ディスペンサ
62:ニードル・バルブ
64:エアピストン
66:エアシリンダ
68:シャフト
70:チャンバ
72:シャフトの下端
74:バルブ台座
76:伸縮バネ
78:上部ロッド
80:スクリュー
81:モータ
84:液滴生成器コントローラ
85、86:電圧−圧力変換器
87:マイクロメータ
88:供給容器
98:ノズル
102:出口オリフィス
Claims (4)
- 基板上の別個の分注位置のすべてにおいて、停止せずに単一の連続的な分注経路において流体材料の液滴を分注するように、ジェット噴射ディスペンサ装置内のディスペンサを作動する方法であって、
基板について別個の分注位置のすべての座標を記憶し、それらの座標を使用して、基板について前記分注位置を通る単一の連続的な移動通路を生成するステップを含み、前記単一の連続的な移動通路は、少なくとも1つの非線形の通路セグメントを含んでおり、
さらに、基板について前記別個の分注位置のすべてを通る補正された単一の連続的な移動通路を生成するステップと、
前記ジェット噴射ディスペンサ装置の定位置に第1の基板を移動させるステップと、
停止せずに前記補正された単一の連続的な移動通路にそってディスペンサを連続的に移動させるとともに、前記第1の基板の別個の分注位置のすべての上に前記ディスペンサから流体材料の液滴を分注し、各々の別個の分注位置に到達する前に、制御信号を前記ディスペンサに与えて、液滴の分注を開始させるステップと、
前記ジェット噴射ディスペンサ装置の定位置に第2の基板を移動させるステップと、
停止せずに前記補正された単一の連続的な移動通路にそってディスペンサを連続的に移動させるとともに、前記第2の基板の別個の分注位置のすべての上に前記ディスペンサから流体材料の液滴を分注し、各々の別個の分注位置に到達する前に、制御信号を前記ディスペンサに与えて、液滴の分注を開始させるステップとを含み、
前記分注位置を通る補正された単一の連続的な移動通路を生成するステップは、
前記分注位置を通して前記ディスペンサを連続的に移動させるステップと、
前記分注位置の各々においてテスト用基板の上にテスト用の液滴を分注するステップと、
第一のテスト用基板の上の各々のテスト用の液滴について着地位置を測定するステップと、
前記テスト用基板の上の各々のテスト用の液滴について測定された着地位置を、予想された着地位置と比較して、前記各々のテスト用の液滴について空間誤差を生成するステップと、
前記各々のテスト用の液滴についての空間誤差を統計的に解析して、補正された連続的な移動通路を生成するステップとを含む、
ことを特徴とする方法。 - 前記分注位置を通る補正された連続的な移動通路を生成するステップは、
前記分注位置を通して前記ディスペンサを連続的に移動させるステップと、
前記分注位置の各々において、前記ディスペンサの実際の位置を時間の関数として記録するステップとを含み、前記ディスペンサの実際の位置は、エンコーダから伝達される電気出力信号によって与えられる位置であり、
さらに、前記分注位置の各々における前記ディスペンサの実際の位置を統計的に解析して、補正された連続的な移動通路を生成するステップを含む、
ことを特徴とする、請求項1に記載の方法。 - 前記ディスペンサの実際の位置は、前記ディスペンサを移動させる複数の軸駆動部に設けられたエンコーダを使用して記録されることを特徴とする、請求項2に記載の方法。
- 前記基板の上の各々のテスト用の液滴について着地位置を測定するステップは、
前記基板の上のテスト用の液滴の画像を分析することを含む、
ことを特徴とする、請求項1に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/859,176 | 2007-09-21 | ||
US11/859,176 US8765212B2 (en) | 2007-09-21 | 2007-09-21 | Methods for continuously moving a fluid dispenser while dispensing amounts of a fluid material |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009072776A JP2009072776A (ja) | 2009-04-09 |
JP2009072776A5 JP2009072776A5 (ja) | 2011-11-04 |
JP5425434B2 true JP5425434B2 (ja) | 2014-02-26 |
Family
ID=40470555
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008242419A Expired - Fee Related JP5425434B2 (ja) | 2007-09-21 | 2008-09-22 | 流体材料の液滴を分注するようにディスペンサを作動する方法 |
Country Status (6)
Country | Link |
---|---|
US (3) | US8765212B2 (ja) |
JP (1) | JP5425434B2 (ja) |
KR (2) | KR20090031251A (ja) |
CN (1) | CN101391249B (ja) |
DE (1) | DE102008039905A1 (ja) |
TW (1) | TWI458566B (ja) |
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CN103998144A (zh) * | 2011-10-28 | 2014-08-20 | 惠普发展公司,有限责任合伙企业 | 并行寻址方法 |
US9254642B2 (en) | 2012-01-19 | 2016-02-09 | AdvanJet | Control method and apparatus for dispensing high-quality drops of high-viscosity material |
US8944001B2 (en) | 2013-02-18 | 2015-02-03 | Nordson Corporation | Automated position locator for a height sensor in a dispensing system |
US10082417B2 (en) * | 2013-12-30 | 2018-09-25 | Nordson Corporation | Calibration methods for a viscous fluid dispensing system |
US20160039148A1 (en) * | 2014-08-05 | 2016-02-11 | Delaware Capital Formation, Inc. | 3-d printer having motion sensors |
US9815081B2 (en) * | 2015-02-24 | 2017-11-14 | Illinois Tool Works Inc. | Method of calibrating a dispenser |
US10881005B2 (en) * | 2016-06-08 | 2020-12-29 | Nordson Corporation | Methods for dispensing a liquid or viscous material onto a substrate |
CN106391397B (zh) * | 2016-09-07 | 2019-05-03 | Oppo广东移动通信有限公司 | 一种喷胶装置及边框轨迹的确定方法 |
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CN110315764A (zh) * | 2018-03-29 | 2019-10-11 | 富智康精密电子(廊坊)有限公司 | 贴装自动线设备 |
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US11331660B2 (en) * | 2019-01-04 | 2022-05-17 | Funai Electric Co. Ltd. | Digital dispense system |
KR20210089291A (ko) * | 2020-01-07 | 2021-07-16 | 삼성디스플레이 주식회사 | 표시 장치의 제조장치 및 표시 장치의 제조방법 |
US20210261401A1 (en) * | 2020-02-24 | 2021-08-26 | Healixir Health, LLC | Automated oil diffuser |
CN111813132B (zh) * | 2020-09-10 | 2020-12-08 | 歌尔光学科技有限公司 | 定位控制方法、装置、可编程逻辑控制器及可读存储介质 |
CN113058825A (zh) * | 2021-03-16 | 2021-07-02 | 上海闻泰信息技术有限公司 | 点胶方法、系统及装置 |
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-
2007
- 2007-09-21 US US11/859,176 patent/US8765212B2/en not_active Expired - Fee Related
-
2008
- 2008-08-27 DE DE102008039905A patent/DE102008039905A1/de not_active Withdrawn
- 2008-08-29 TW TW097133299A patent/TWI458566B/zh not_active IP Right Cessation
- 2008-09-17 KR KR1020080090907A patent/KR20090031251A/ko not_active Application Discontinuation
- 2008-09-22 JP JP2008242419A patent/JP5425434B2/ja not_active Expired - Fee Related
- 2008-09-22 CN CN2008101617107A patent/CN101391249B/zh not_active Expired - Fee Related
-
2014
- 2014-05-16 US US14/280,032 patent/US9674962B2/en active Active
-
2016
- 2016-03-30 KR KR1020160038743A patent/KR20160040502A/ko not_active Application Discontinuation
-
2017
- 2017-05-08 US US15/589,920 patent/US10646889B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2009072776A (ja) | 2009-04-09 |
US8765212B2 (en) | 2014-07-01 |
KR20160040502A (ko) | 2016-04-14 |
TW200927302A (en) | 2009-07-01 |
DE102008039905A1 (de) | 2009-06-25 |
US20140248421A1 (en) | 2014-09-04 |
CN101391249B (zh) | 2013-09-04 |
TWI458566B (zh) | 2014-11-01 |
US10646889B2 (en) | 2020-05-12 |
CN101391249A (zh) | 2009-03-25 |
US9674962B2 (en) | 2017-06-06 |
US20170246650A1 (en) | 2017-08-31 |
KR20090031251A (ko) | 2009-03-25 |
US20090078720A1 (en) | 2009-03-26 |
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