JP5406890B2 - ２つの加工層をトリミングするための方法およびトリミング装置 - Google Patents

２つの加工層をトリミングするための方法およびトリミング装置 Download PDF

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Publication number
JP5406890B2
JP5406890B2 JP2011164114A JP2011164114A JP5406890B2 JP 5406890 B2 JP5406890 B2 JP 5406890B2 JP 2011164114 A JP2011164114 A JP 2011164114A JP 2011164114 A JP2011164114 A JP 2011164114A JP 5406890 B2 JP5406890 B2 JP 5406890B2
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Japan
Prior art keywords
trimming
layer
plate
working
processing
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Expired - Fee Related
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JP2011164114A
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Japanese (ja)
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JP2012030353A (ja
Inventor
ゲオルク・ピーチ
ミヒャエル・ケルスタン
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Siltronic AG
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Siltronic AG
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
JP2011164114A 2010-07-28 2011-07-27 ２つの加工層をトリミングするための方法およびトリミング装置 Expired - Fee Related JP5406890B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010032501.5A DE102010032501B4 (de) 2010-07-28 2010-07-28 Verfahren und Vorrichtung zum Abrichten der Arbeitsschichten einer Doppelseiten-Schleifvorrichtung
DE102010032501.5 2010-07-28

Publications (2)

Publication Number Publication Date
JP2012030353A JP2012030353A (ja) 2012-02-16
JP5406890B2 true JP5406890B2 (ja) 2014-02-05

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011164114A Expired - Fee Related JP5406890B2 (ja) 2010-07-28 2011-07-27 ２つの加工層をトリミングするための方法およびトリミング装置

Country Status (8)

Country Link
US (3) US8911281B2 (zh)
JP (1) JP5406890B2 (zh)
KR (1) KR101256310B1 (zh)
CN (2) CN102343551B (zh)
DE (1) DE102010032501B4 (zh)
MY (1) MY155449A (zh)
SG (1) SG177878A1 (zh)
TW (1) TWI455793B (zh)

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DE102013202488B4 (de) * 2013-02-15 2015-01-22 Siltronic Ag Verfahren zum Abrichten von Poliertüchern zur gleichzeitig beidseitigen Politur von Halbleiterscheiben
DE102013206613B4 (de) 2013-04-12 2018-03-08 Siltronic Ag Verfahren zum Polieren von Halbleiterscheiben mittels gleichzeitiger beidseitiger Politur
US9609920B2 (en) * 2013-09-06 2017-04-04 Kimberly-Clark Worldwide, Inc. Process for modifying a hook profile of a fastening component and a fastening component having hooks with a modified profile
DE102014220888B4 (de) * 2014-10-15 2019-02-14 Siltronic Ag Vorrichtung und Verfahren zum doppelseitigen Polieren von scheibenförmigen Werkstücken
DE102015220090B4 (de) * 2015-01-14 2021-02-18 Siltronic Ag Verfahren zum Abrichten von Poliertüchern
JP6424809B2 (ja) * 2015-12-11 2018-11-21 信越半導体株式会社 ウェーハの両面研磨方法
CN106312818A (zh) * 2016-09-23 2017-01-11 江苏吉星新材料有限公司 一种研磨用陶瓷盘的修整方法
CN110744424A (zh) * 2019-10-21 2020-02-04 王挺 一种晶圆加工用切面抛光机
CN111976068A (zh) * 2020-07-06 2020-11-24 湖州骏才科技有限公司 一种膜材料加工用多功能降温修整装置
CN111906694A (zh) * 2020-08-13 2020-11-10 蚌埠中光电科技有限公司 一种玻璃研磨垫的在线修整装置
CN112192445A (zh) * 2020-10-10 2021-01-08 西安奕斯伟硅片技术有限公司 用于修整双面研磨硅片的成对研磨垫的工具、装置及方法
CN113770902B (zh) * 2021-09-06 2022-11-22 江西睿之和医疗器械有限公司 一种生态板的整形装置
WO2023055649A1 (en) * 2021-09-29 2023-04-06 Entegris, Inc. Double-sided pad conditioner
CN113997201B (zh) * 2021-11-11 2022-07-22 深圳市前海科创石墨烯新技术研究院 一种新型抛光垫修整盘组装方法及制造工具
CN114536220B (zh) * 2022-04-26 2022-07-15 华海清科股份有限公司 用于化学机械抛光的修整装置、方法及化学机械抛光系统
CN116749080B (zh) * 2023-08-18 2023-11-14 浙江求是半导体设备有限公司 修整方法
CN116922223B (zh) * 2023-09-15 2023-11-24 江苏京成机械制造有限公司 一种具有收集灰尘功能的铸件生产用修整设备

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JPS52103799A (en) * 1976-02-26 1977-08-31 Chikanobu Ichikawa Device for correcting lapping machine
JPS57168109A (en) 1981-04-10 1982-10-16 Shinetsu Eng Kk Device for measuring thickness of work piece in lapping plate
JPH03251363A (ja) * 1990-03-01 1991-11-08 Tdk Corp ラップ加工方法および両面ラップ盤
JP3251363B2 (ja) 1992-02-17 2002-01-28 株式会社小松製作所 タッチスクリーン表示装置
US5958794A (en) 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
JPH1110530A (ja) 1997-06-25 1999-01-19 Shin Etsu Handotai Co Ltd 両面研磨用キャリア
US6022266A (en) * 1998-10-09 2000-02-08 International Business Machines Corporation In-situ pad conditioning process for CMP
US6142859A (en) * 1998-10-21 2000-11-07 Always Sunshine Limited Polishing apparatus
JP2000153458A (ja) 1998-11-17 2000-06-06 Speedfam-Ipec Co Ltd 両面加工機における砥石定盤の面出し方法及び装置
DE19937784B4 (de) 1999-08-10 2006-02-16 Peter Wolters Werkzeugmaschinen Gmbh Zweischeiben-Feinschleifmaschine
US6206765B1 (en) * 1999-08-16 2001-03-27 Komag, Incorporated Non-rotational dresser for grinding stones
JP2001179600A (ja) 1999-12-20 2001-07-03 Speedfam Co Ltd ドレッサ
US6752687B2 (en) * 2001-04-30 2004-06-22 International Business Machines Corporation Method of polishing disks
JP4982037B2 (ja) * 2004-05-27 2012-07-25 信越半導体株式会社 研磨布用ドレッシングプレート及び研磨布のドレッシング方法並びにワークの研磨方法
DE102004040429B4 (de) 2004-08-20 2009-12-17 Peter Wolters Gmbh Doppelseiten-Poliermaschine
JP2007069323A (ja) * 2005-09-08 2007-03-22 Shinano Denki Seiren Kk 定盤表面調整用砥石及び表面調整方法
JP2007118146A (ja) * 2005-10-28 2007-05-17 Speedfam Co Ltd 定盤のパッド貼着面用ドレッサ及びパッド貼着面のドレッシング方法
DE102006032455A1 (de) 2006-07-13 2008-04-10 Siltronic Ag Verfahren zum gleichzeitigen beidseitigen Schleifen mehrerer Halbleiterscheiben sowie Halbleierscheibe mit hervorragender Ebenheit
JP4904960B2 (ja) * 2006-07-18 2012-03-28 信越半導体株式会社 両面研磨装置用キャリア及びこれを用いた両面研磨装置並びに両面研磨方法
WO2008064158A2 (en) * 2006-11-21 2008-05-29 3M Innovative Properties Company Lapping carrier and method
JP5305698B2 (ja) 2007-03-09 2013-10-02 Ｈｏｙａ株式会社 磁気ディスク用ガラス基板の製造方法、磁気ディスク製造方法および磁気ディスク用ガラス基板
DE102007013058B4 (de) 2007-03-19 2024-01-11 Lapmaster Wolters Gmbh Verfahren zum gleichzeitigen Schleifen mehrerer Halbleiterscheiben
DE102007056628B4 (de) 2007-03-19 2019-03-14 Siltronic Ag Verfahren und Vorrichtung zum gleichzeitigen Schleifen mehrerer Halbleiterscheiben
DE102007049811B4 (de) 2007-10-17 2016-07-28 Peter Wolters Gmbh Läuferscheibe, Verfahren zur Beschichtung einer Läuferscheibe sowie Verfahren zur gleichzeitigen beidseitigen Material abtragenden Bearbeitung von Halbleiterscheiben
CN201235498Y (zh) * 2008-07-30 2009-05-13 常州松晶电子有限公司 晶片双面研磨机
DE102009038942B4 (de) * 2008-10-22 2022-06-23 Peter Wolters Gmbh Vorrichtung zur beidseitigen Bearbeitung von flachen Werkstücken sowie Verfahren zur gleichzeitigen beidseitigen Material abtragenden Bearbeitung mehrerer Halbleiterscheiben
JP2010194704A (ja) * 2009-01-27 2010-09-09 Shinano Denki Seiren Kk 定盤修正用砥石、定盤修正用研磨装置及び研磨定盤の修正方法

Also Published As

Publication number Publication date
US8986070B2 (en) 2015-03-24
MY155449A (en) 2015-10-15
US20140170939A1 (en) 2014-06-19
US9011209B2 (en) 2015-04-21
TW201206632A (en) 2012-02-16
CN103737480B (zh) 2017-05-17
CN103737480A (zh) 2014-04-23
CN102343551A (zh) 2012-02-08
DE102010032501B4 (de) 2019-03-28
CN102343551B (zh) 2015-06-03
JP2012030353A (ja) 2012-02-16
KR101256310B1 (ko) 2013-04-18
KR20120023531A (ko) 2012-03-13
US20140170942A1 (en) 2014-06-19
DE102010032501A1 (de) 2012-02-02
SG177878A1 (en) 2012-02-28
TWI455793B (zh) 2014-10-11
US8911281B2 (en) 2014-12-16
US20120028546A1 (en) 2012-02-02

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